Film composite having electrical functionality for applying to a substrate

Patent metadata

Field	Value
Publication number	US-9723726-B2
Application number	US-201515119156-A
Country	US
Kind code	B2
Filing date	Feb 25, 2015
Priority date	Feb 26, 2014
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

A film composite with electrical functionality for application on a substrate includes at least one conductive structure, a first bonding coat, a film layer and a second bonding coat. The first bonding coat is disposed on an underside of the at least one conductive structure, wherein the first bonding coat has an adhesive effect for application of the at least one conductive structure on the substrate. The second bonding coat is disposed between an upper side of the at least one conductive structure and the film layer. The second bonding coat has an adhesive effect, by which the film layer adheres to the at least one conductive structure.

First claim

The invention claimed is:

1. Film composite with electrical functionality for application on a substrate, comprising:
at least one conductive structure,
a first bonding coat,
a film layer,
a second bonding coat,
a backing film, on which the at least one conductive structure and the film layer are disposed,
wherein the first bonding coat is disposed on an underside of the at least one conductive structure,
wherein the first bonding coat has an adhesive effect for application of the at least one conductive structure on the substrate,
wherein the second bonding coat is disposed between an upper side of the at least one conductive structure and the film layer,
wherein the second bonding coat has an adhesive effect, by which the film layer adheres to the at least one conductive structure,
wherein the at least one conductive structure and the film layer disposed over the at least one conductive structure are configured to be stripped at least partly from the backing film for application on the substrate.

2. Film composite according to claim 1 , wherein the film layer and the second bonding coat respectively have a region that extends beyond the at least one conductive structure.

3. Film composite according to claim 2 , comprising
a further film layer,
wherein the further film layer, the at least one conductive structure and the film layer are disposed on the backing film,
wherein the further film layer adheres with its upper side to the first bonding coat and to the region of the second bonding coat extending beyond the at least one conductive structure.

4. Film composite according to claim 3 , comprising
a third bonding coat,
wherein the third bonding coat is disposed between the further film layer and the backing film,
wherein the third bonding coat has an adhesive effect, by which the further film layer adheres to the backing film.

5. Film composite according to claim 4 ,
wherein the film composite can be pasted onto a substrate,
wherein the film composite is formed in such a way that, in the condition of the film composite pasted onto the substrate, a respective first part of the at least one conductive structure, of the film layer and of the further film layer is disposed on the backing film and the backing film is disposed directly on the substrate and a second part of the further film layer adheres to the substrate by means of the third bonding coat.

6. Film composite according to claim 3 ,
wherein the backing film has at least one incision line that severs the backing film.

7. Film composite according to claim 2 ,
wherein the region of the second bonding coat extending beyond the at least one conductive structure adheres to the backing film,
wherein the first bonding coat adheres to the backing film.

8. Film composite according to claim 7 ,
wherein the film composite can be pasted onto a substrate,
wherein the film composite is formed in such a way that, in the condition of the film composite pasted onto the substrate, a respective first part of the at least one conductive structure and of the film layer is disposed on the backing film and the backing film is disposed directly on the substrate and a second part of the at least one conductive structure adheres on the substrate by means of the first bonding coat and a second part of the film layer adheres to the second part of the at least one conductive structure by means of the second bonding coat and a third part of the film layer adheres to the substrate by means of the second bonding coat.

9. Film composite according to claim 1 ,
wherein a first portion of the at least one conductive structure is masked by the film layer,
wherein a second portion of the at least one conductive structure is not masked by the film layer.

10. Method for manufacture of a film composite with an electrically conductive structure, comprising:
preparation of a backing film,
arrangement of an electrically conductive film on the backing film,
cutting of at least one first incision line in a region of the electrically conductive film in such a way that the electrically conductive film is severed by the at least one first incision line in the region of the electrically conductive film and a first region of the backing film disposed under the region of the electrically conductive film remains intact, whereby at least one conductive structure is formed in the electrically conductive film, which is separated by the at least one incision line from a remaining part of the electrically conductive structure,
removal of the remaining part of the electrically conductive film,
arrangement of a film layer on an upper side of the at least one conductive structure,
cutting of at least one second incision line in a region of the film layer in such a way that the film layer is severed by the at least one second incision line in the region of the film layer and a second region of the backing film disposed under the region of the film layer remains intact.

11. Method according to claim 10 , comprising:
cutting of at least one third incision line in a third region of the backing film, in such a way that the backing film is severed in the third region of the backing film,
cutting of at least one fourth incision line in a second region of the film layer and a fourth region of the backing film disposed under the second region of the film layer, in such a way that the film layer is severed in the second region and the backing film is severed in the fourth region, wherein the at least one third and fourth incision lines intersect in such a way that a region cut-out from the backing film is formed.

12. Method according to claim 10 , comprising:
preparation of a first bonding coat with an adhesive effect and application of the first bonding coat on an underside of the electrically conductive film,
preparation of a second bonding coat with an adhesive effect and application of the second bonding coat on an underside of the film layer,
lamination of the electrically conductive film onto the backing film by means of the first bonding coat,
lamination of the film layer onto the at least one conductive structure and the backing film by means of the second bonding coat.

13. Method according to claim 12 , comprising:
cutting of a recess in the film layer and the second bonding coat, before the film layer is laminated onto the at least one conductive structure.

14. Method according to claim 10 , comprising:
preparation of a first bonding coat with an adhesive effect and application of the first bonding coat on an underside of the electrically conductive film,
preparation of a second bonding coat with an adhesive effect and application of the second bonding coat on an underside of the film layer,
preparation of a further film layer,
preparation of a third bonding coat with an adhesive effect and application of the third bonding coat on an underside of the further film layer,
lamination of the further film layer onto the backing film by means of the third bonding coat,
lamination of the electrically conductive film onto the further film layer by means of the first bonding coat,
cutting of the at least one first incision line in the region of the electrically conductive film in such a way that a first region of the further film layer disposed under the region of the electrically conductive film remains intact,
lamination of the film layer onto the at least one conductive structure and the further film layer by means of the second bonding coat,
cutting of the at least one second incision line in a second region of the further film layer disposed under the region of the film

Assignees

• Schreiner Group Gmbh & Co Kg

Inventors

• Fischer Wolfram
• Nitschke Olaf
• Samuel Thomas
• Wiesener Oliver

Classifications

• H05K3/4652

  Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K3/4647 takes precedence) · CPC title

• H05K3/4084

  by deforming at least one of the conductive layers · CPC title

• H05K3/043 Primary

  by using a moving tool for milling or cutting the conductive material · CPC title

• H05K2203/1545

  Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path · CPC title

• H05K3/4635 Primary

  laminating flexible circuit boards using additional insulating adhesive materials between the boards · CPC title