Printed wiring board

Patent metadata

Field	Value
Publication number	US-9807870-B2
Application number	US-201515305232-A
Country	US
Kind code	B2
Filing date	May 15, 2015
Priority date	May 21, 2014
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

A printed wiring board is provided which comprises a first insulating substrate ( 11 ) composed of a liquid crystal polymer, a first signal line ( 131 ) formed on one main surface ( 11 a ) of the first insulating substrate ( 11 ), a second insulating substrate ( 21 ) composed of a liquid crystal polymer, a second signal line ( 231 ) formed on one main surface ( 21 a ) of the second insulating substrate ( 21 ) and along the extending direction of the first signal line ( 131 ), and an adhesion layer ( 30 ) composed of a modified polyphenylene ether for adhesion between the one main surface ( 11 a ) of the first insulating substrate ( 11 ) and the one main surface ( 21 a ) of the second insulating substrate ( 21 ). When frequencies of signals transmitted by the first signal line and the second signal line are 2.5 GHz or more and 5.0 GHz or less, an offset amount is longer than a circuit width (L 1 ) of the first signal line ( 131 ) and 130 μm or more and 300 μm or less. The offset amount is a distance from the position of one end of the first signal line ( 131 ) among ends along the width direction to the position of one end of the second signal line ( 231 ) among ends along the width direction.

First claim

The invention claimed is:

1. A printed wiring board comprising:
a first insulating substrate composed of a liquid crystal polymer;
a first signal line formed on one main surface of the first insulating substrate;
a second insulating substrate composed of a liquid crystal polymer;
a second signal line, which is offset from the first signal line, formed on one main surface of the second insulating substrate and along an extending direction of the first signal line; and
an adhesion layer composed of a modified polyphenylene ether for adhesion between the one main surface of the first insulating substrate and the one main surface of the second insulating substrate,
wherein, when frequencies of signals transmitted by the first signal line and the second signal line are 2.5 GHz or more and 5.0 GHz or less, an offset amount is greater than a circuit width of the first signal line and the offset amount is 130 μm or more and 300 μm or less, wherein the offset amount is a distance between a position of one end of the first signal line farthest from the second signal line along a width direction of the first signal line and a position of one end of the second signal line nearest to the first signal line along a width direction of the second signal line.

2. The printed wiring board according to claim 1 , wherein the offset amount is less than 200 μm and greater than 130 μm.

3. The printed wiring board according to claim 1 , wherein the first signal line transmits a signal of a first frequency and the second signal line transmits a signal of a second frequency that is different from the first frequency.

Assignees

• Fujikura Ltd

Inventors

• Komatsu Naomi

Classifications

• H05K1/0228 Primary

  Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K1/0245) · CPC title

• H01P11/003

  Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines · CPC title

• H05K3/4635

  laminating flexible circuit boards using additional insulating adhesive materials between the boards · CPC title

• H05K1/024 Primary

  Dielectric details, e.g. changing the dielectric material around a transmission line · CPC title

• H05K3/429

  Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers · CPC title