Bond ply materials and circuit assemblies formed therefrom

Patent metadata

Field	Value
Publication number	US-2017145266-A1
Application number	US-201514951814-A
Country	US
Kind code	A1
Filing date	Nov 25, 2015
Priority date	Nov 25, 2015
Publication date	May 25, 2017
Grant date	—

Abstract

A composition for a bond ply, and a circuit subassembly that comprises such bond ply, are disclosed. The circuit subassembly can have a UL-94 rating of V-0. The composition of the bond ply layer comprises 25 to 45 volume percent of liquid resin; 10 to 40 weight percent of a bromine-containing or phosphorus-containing aromatic compound having a peak melting point of at least about 260° C.; and 5 to 35 volume percent inorganic filler;

First claim

What is claimed is:

1 . A bond ply layer, having a thickness of 50 to 400 micrometers formed from a composition comprising:
25 to 45 volume percent of liquid resin comprising polybutadiene and/or polyisoprene and, in addition, a nitrogen-containing compound having allyl groups, wherein the nitrogen-containing compound is present in an amount of 5 to 15 volume percent, based on total composition and polybutadiene and/or polyisoprene in an amount of 20 to less than 60 volume percent, based on the total resin; 10 to 40 weight percent of a bromine-containing or phosphorus-containing aromatic compound having a peak melting point of at least about 260° C.; and 5 to 35 volume percent inorganic filler, wherein all percents are calculated based on the bond ply composition absent solvent; wherein the bond ply has a UL-94 rating of at least V-1, a D f of less than 0.006 at 10 GHz and a D k of 2 to 10 at 10 GHz.

2 . The bond ply layer of claim 1 , further comprising 1 to 25 volume percent of poly(arylene ether).

3 . The bond ply layer of claim 1 , wherein the bromine-containing compound has a wt. % bromine (theoretical) of 50 to 80%, a molecular weight of 500 to 2500, and comprises two to four brominated aromatic rings.

4 . The bond ply layer of claim 1 , wherein the phosphorus-containing aromatic compound is an oxaphosphorinoxide-containing compound represented by the following structure:

wherein each R 1 and R 2 independently represents hydrogen or a C 1 -C 6 hydrocarbyl group, each m can independently represent an integer from 1 to 4, n is on average 2 to 4, and Q is a C 2 -C 24 divalent or trivalent hydrocarbyl group

5 . The bond ply layer of claim 1 , wherein the bromine-containing compound is selected from the group consisting of ethylene bistetrabromophthalide, tetrabromdiphenoxy benzene, decabromodiphenoxy oxide, and ethane-1,2-bis(pentabromo phenyl).

6 . The bond ply layer of claim 4 , wherein the oxaphosphorinoxide-containing aromatic compound is selected from the group consisting of 6H-dibenz[c,e] [1,2]oxaphosphorin, 6,6′-(1,4-ethanediyl)bis-, 6,6′-dioxide; 6H-dibenz[c,e][1,2] oxaphosphorin, 6,6′-(1,4-butanediyl)bis-, 6,6′-dioxide; 6H-dibenz[c,e][1,2] oxaphosphorin, 6,6′-(p-xylenediyl)bis-, 6,6′-dioxide, and combinations thereof.

7 . The bond ply layer of claim 1 , wherein the nitrogen-containing compound contains a triazine ring and allyl groups that are reactive with a resin component of the composition.

8 . The bond ply layer of claim 1 , wherein the composition of the bond ply layer comprises 5 to 25 weight percent of poly(arylene ether) and 5 to 25 weight percent of an elastomeric polymer, both in solid form.

9 . The bond ply layer of claim 1 , wherein the composition comprises:
5 to 20 weight percent of poly(arylene ether) and 5 to 20 weight percent of an elastomer, based on the weight of the composition; 20 to 30 volume percent of the inorganic filler; and 25 volume percent to less than 37 volume percent of the liquid resin, which liquid resin comprises:
20 to 40 volume percent polybutadiene or polyisoprene, based on total resin; and
5 to 10 volume percent of a nitrogen-containing compound that contains allyl groups.

10 . The bond ply layer of claim 1 wherein the liquid resin in further comprising 5 to 15 volume percent of a diene reactive monomer.

11 . A circuit subassembly, comprising
at least two circuit laminates, each comprising:
a dielectric substrate layer formed from a thermosetting composition;
a conductive metal layer bonded to each side of the dielectric substrate layer, wherein at least one of the conductive metal layers of each circuit laminate has been patterned to form a circuit;
a bond ply layer disposed between the circuits of on each of the two circuit laminates wherein each of the two sides of the bond ply is in direct contact with a circuit of one of the two circuit laminates, which bond ply layer is the product of a process of lamination in which the bond ply flows and fills areas of the dielectric substrate layer that are not covered by circuit formed by patterned conductive metal layer, wherein the bond ply layer is formed from a composition that, absent solvent, comprises: 25 to 45 volume percent of liquid resin comprising polybutadiene and/or polyisoprene and, in addition, a nitrogen-containing compound having allyl groups, wherein the nitrogen-containing compound is present in an amount of 5 to 15 volume percent, based on total composition, and the polybutadiene and/or polyisoprene is present in an amount of 20 to less than 60 volume percent, based on the total resin; 10 to 40 weight percent of a bromine-containing or phosphorus-containing aromatic compound having a peak melting point of at least about 260° C.; and 5 to 35 volume percent inorganic filler; wherein the circuit assembly has a UL-94 rating of at least V-0, a D f of less than 0.006 at 10 GHz and a D k of less than 2 to 10 at 10 GHz.

12 . The circuit subassembly of claim 11 , wherein the composition comprises
5 to 20 weight percent of poly(arylene ether) and an elastomer, based on the weight of the thermosetting composition; 10 to 40 weight percent, based on the weight of the thermosetting composition, of a bromine-containing or phosphorus-containing aromatic compound having a peak melting point of 260° C. to 500° C.; 20 to 30 volume percent of inorganic filler.

13 . The circuit subassembly of claim 12 , wherein the liquid resin further comprises a reactive monomer.

14 . The circuit subassembly of claim 11 , wherein the nitrogen-containing compound contains a triazine ring and has allyl groups that are reactive with polybutadiene and/or polyisoprene resin in the bond ply layer.

15 . The circuit subassembly of claim 11 , wherein the inorganic filler is selected from group consisting of silica, titanium dioxide, and combinations thereof.

16 . The circuit subassembly of claim 11 , wherein the bromine-containing aromatic compound has compound has a wt. % bromine, theoretically, of 50 to 80%, a molecular weight of 500 to 2000, and comprises two, three or to four brominated aromatic rings.

17 . The circuit subassembly of claim 11 , wherein the thermosetting resin is selected from the group consisting of 1,2-polybutadiene, polyisoprene, polybutadiene-polyisoprene copolymers, poly(phenylene ether) resins, curable cyclic olefins or their copolymers, and combinations thereof, and wherein the oxaphosphorinoxide-containing aromatic compound is represented by the following structure:

wherein each R 1 and R 2 independently represents hydrogen or a C 1 -C 6 hydrocarbyl group, each m can independently represent an integer from 1 to 4, n is on average 2 to 4, and Q is a C 2 -C 24 divalent or trivalent hydrocarbyl group.

18 . The circuit subassembly of claim 11 , wherein the dielectric substrate has a thickness of 50 to 1000 micrometers, the bond ply layer has a thickness of 50 to 400 micrometers, and an optional adhesive layer, between the dielectric substrate and each conductive metal layer, has a thickness that is less than 10 percent of the thickness of the dielectric substrate layer.

19 . A circuit subassembly, comprising:
(a) at least two circuit laminates, each comprising:
(i) a dielectric substrate layer formed from a thermosetting composition, wherein the thermo

Assignees

• Rogers Corp

Inventors

• Scholz William F

Classifications

• C08J2471/00

  Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers · CPC title

• H05K3/4623

  the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards (H05K3/462 takes precedence) · CPC title

• C09J2423/00

  Presence of polyolefin · CPC title

• H05K3/4635

  laminating flexible circuit boards using additional insulating adhesive materials between the boards · CPC title

• C09J153/02

  Vinyl aromatic monomers and conjugated dienes · CPC title