Multi-layer wiring board and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9907189-B2
Application number	US-201414257192-A
Country	US
Kind code	B2
Filing date	Apr 21, 2014
Priority date	Apr 22, 2013
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

A multi-layer wiring board is configured having stacked therein, in a stacking direction, via an adhesive layer, a plurality of printed wiring bases in each of which a wiring pattern and a via are formed on/in a resin base. A multi-layer wiring board includes a movable portion configured from an elastic member and a void portion, the movable portion being formed in the printed wiring bases and adhesive layer in a periphery of a matrix-shaped plurality of multi-layer wiring portions disposed at a certain interval as viewed in a planar manner, and the movable portion joining the plurality of multi-layer wiring portions such that each of the multi-layer wiring portions is displaceable in the stacking direction and a direction of surfaces of the printed wiring bases.

First claim

What is claimed is:

1. A multi-layer wiring board, comprising:
a plurality of printed wiring bases stacked, in a stacking direction, by an adhesive layer, the plurality of printed wiring bases each having a wiring pattern formed on a resin base and a via formed in the resin base;
a plurality of multi-layer wiring portions disposed in a matrix of at least 2×2 or more; and
a movable portion configured from an elastic member, the movable portion is provided between the plurality of multi-layer wiring portions to join the plurality of multi-layer wiring portions in a crisscross manner,
wherein each of the multi-layer wiring portions comprises a component built-in portion having an electronic component built in internally thereto in the stacking direction, the electronic component being disposed in an opening provided to a first resin base of the resin bases,
the multi-layer wiring board includes a recess recessed from one surface along the stacking direction and penetrating the first resin base provided with the opening,
the elastic member of the movable portion fills the recess in the stacking direction.

2. The multi-layer wiring board according to claim 1 , wherein
a void portion is formed in a certain region surrounded by the plurality of multi-layer wiring portions and the movable portion.

3. The multi-layer wiring board according to claim 1 , wherein
the elastic member is configured from heat-resistant rubber.

4. The multi-layer wiring board according to claim 2 , wherein
the elastic member is configured from heat-resistant rubber.

5. The multi-layer wiring board according to claim 1 , wherein
the elastic member is configured from silicone rubber or fluoro rubber.

6. The multi-layer wiring board according to claim 2 , wherein
the elastic member is configured from silicone rubber or fluoro rubber.

Assignees

• Fujikura Ltd

Inventors

• Ueta Nobuki

Classifications

• H05K3/4697 Primary

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• Y10T29/49126

  Assembling bases · CPC title

• H05K2201/10674

  Flip chip · CPC title

• H05K2203/063

  of preperforated insulating layer · CPC title