Electric element-embedded multilayer substrate and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9699892-B2
Application number	US-201314021103-A
Country	US
Kind code	B2
Filing date	Sep 9, 2013
Priority date	Mar 10, 2011
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

An electric element-embedded multilayer substrate, which is a multilayer substrate including an electric element embedded therein and a plurality of base material layers having flexibility, the electric element including a main surface and being embedded in the multilayer substrate to be sandwiched between the base material layers, and a slide member provided between the main surface of the electric element and the base material layer.

First claim

What is claimed is:

1. An electric element-embedded multilayer substrate, comprising:
a multilayer substrate including a plurality of base material layers;
an electric element including a main surface and embedded in the multilayer substrate so as to be sandwiched between adjacent ones of the plurality of the base material layers; and
a slide member provided between the main surface of the electric element and one of the base material layers; wherein
the slide member directly contacts the electric element, and is not adhered or affixed to the electric element; and
when comparing the slide member and the one of the base material layers, the slide member is more slidable against the electric element than the one of the base material layers;
wherein the slide member is a sheet metal member disposed on the one of the base material layers;
wherein the sheet metal member is a metal foil including a shiny surface and a matte surface having a surface roughness higher than a surface roughness of the shiny surface; and the shiny surface defines a contact surface with the main surface of the electric element.

2. The electric element-embedded multilayer substrate according to claim 1 , wherein the base material layers are resin sheets including thermoplasticity.

3. The electric element-embedded multilayer substrate according to claim 1 , further comprising an auxiliary member defined by the sheet metal member disposed on the one of the base material layers; wherein
the auxiliary member is arranged adjacent to the slide member, with the one of the base material layers being sandwiched therebetween, in a direction in which the plurality of the base material layers are stacked.

4. The electric element-embedded multilayer substrate according to claim 1 , further comprising an interlayer wire, wherein the slide member is connected to the interlayer wire extended to a front surface or a back surface of the multilayer substrate.

5. The electric element-embedded multilayer substrate according to claim 1 , wherein the slide member covers a corner portion of the electric element in planar view in which the slide member is viewed from a stacking direction of the base material layers.

6. The electric element-embedded multilayer substrate according to claim 1 , wherein a gap portion is provided between the one of the base material layers and a side surface of the electric element.

7. The electric element-embedded multilayer substrate according to claim 1 , further comprising an interlayer wire, wherein a terminal electrode of the electric element is directly connected to the interlayer wire.

8. The electric element-embedded multilayer substrate according to claim 1 , further comprising a plurality of interlayer wires, wherein the slide member is connected to the plurality of interlayer wires that extends to a front surface or a back surface of the multilayer substrate to contact a surface electrode provided thereon.

9. The electric element-embedded multilayer substrate according to claim 3 , further comprising an interlayer wire, wherein the slide member and the auxiliary member are connected by the interlayer wire.

10. A method for manufacturing an electric element-embedded multilayer substrate, the method comprising the steps of:
preparing a plurality of base material layers, an electric element including a main surface, and a slide member;
sandwiching the electric element between the plurality of the base material layers such that the slide member is arranged between the main surface of the electric element and the base material layers; and
forming a multilayer substrate including the electric element embedded therein, by stacking the plurality of the base material layers; wherein
the slide member directly contacts the electric element, and is not adhered or affixed to the electric element; and
when comparing the slide member and the one of the base material layers, the slide member is more slidable against the electric element than the one of the base material layers;
wherein the slide member is a sheet metal member disposed on the one of the base material layers;
wherein the sheet metal member is a metal foil including a shiny surface and a matte surface having a surface roughness higher than a surface roughness of the shiny surface; and the shiny surface defines a contact surface with the main surface of the electric element.

11. The method for manufacturing an electric element-embedded multilayer substrate according to claim 10 , wherein the base material layers are resin sheets including thermoplasticity.

12. The method for manufacturing an electric element-embedded multilayer substrate according to claim 10 , further comprising forming an auxiliary member defined by the sheet metal member disposed on the one of the base material layers; wherein
the auxiliary member is arranged adjacent to the slide member, with the one of the base material layers being sandwiched therebetween, in a direction in which the plurality of the base material layers are stacked.

13. The method for manufacturing an electric element-embedded multilayer substrate according to claim 10 , further comprising forming an interlayer wire, wherein the slide member is connected to the interlayer wire extended to a front surface or a back surface of the multilayer substrate.

14. The method for manufacturing an electric element-embedded multilayer substrate according to claim 10 , wherein the slide member covers a corner portion of the electric element in planar view in which the slide member is viewed from a stacking direction of the base material layers.

15. The method for manufacturing an electric element-embedded multilayer substrate according to claim 10 , wherein a gap portion is provided between the one of the base material layers and a side surface of the electric element.

16. The method for manufacturing an electric element-embedded multilayer substrate according to claim 10 , further comprising forming an interlayer wire; wherein
a terminal electrode of the electric element is directly connected to the interlayer wire.

17. The method for manufacturing an electric element-embedded multilayer substrate according to claim 10 , further comprising forming a plurality of interlayer wires, wherein the slide member is connected to the plurality of interlayer wires that extends to a front surface or a back surface of the multilayer substrate to contact a surface electrode provided thereon.

18. The method for manufacturing an electric element-embedded multilayer substrate according to claim 12 , further comprising forming an interlayer wire so that the slide member and the auxiliary member are connected by the interlayer wire.

Assignees

• Murata Manufacturing Co

Inventors

• Kato Noboru
• Ozawa Masahiro

Classifications

• H05K3/4644

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

• H05K1/188

  manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/614

  the multiple chips being integrally enclosed · CPC title