Winged coil structure and method of manufacturing the same

US9847165B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9847165-B2
Application numberUS-201514877981-A
CountryUS
Kind codeB2
Filing dateOct 8, 2015
Priority dateOct 8, 2015
Publication dateDec 19, 2017
Grant dateDec 19, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.

First claim

Opening claim text (preview).

What is claimed is: 1. A winged coil structure for providing a function of magnetic induction and a flexible and bendable feature, and having a wing shape with two thinner side parts than a middle part downwards projecting, comprising: an upper flexible plate formed of a flexible substrate with electrical insulation, having a middle region and two side regions bordering the middle region, the middle region having a middle through-hole; at least one upper magnetic induction coil embedded in the upper flexible plate and having a helical shape close to an upper surface of the upper flexible plate; at least one upper connection pad electrically connected with the corresponding upper magnetic induction coil; a lower flexible plate formed of an another flexible substrate with electrical insulation, having a middle region and two side regions bordering the middle region, the middle region having a middle through-hole, a lateral size of the lower flexible plate smaller than a lateral size of the upper flexible plate; at least one lower magnetic induction coil embedded in the lower flexible plate and having a helical shape close to a lower surface of the lower flexible plate; at least one lower connection pad electrically connected with the corresponding lower magnetic induction coil, and vertically aligned to the corresponding upper connection pad; at least one gold finger configured at the side regions of the upper flexible plate, and electrically connected with the corresponding lower magnetic induction coil; a dielectric layer provided between the upper flexible plate and the lower flexible plate, the upper flexible plate being on an upper surface of the dielectric layer, the lower flexible plate beneath a lower surface of the dielectric layer, the dielectric layer having at least one through-hole, each through-hole being aligned to the corresponding upper connection pad and lower connection pad; and at least one connection plug formed of an electrically conductive metal material, each connection plug penetrating the dielectric layer and provided between the corresponding upper connection pad and lower connection pad, the connection plug possessing workability of thermal pressing so as to tightly combine the upper connection pad and the lower connection pad through thermal pressing, wherein the upper magnetic induction coil and the lower magnetic induction coil are configured around the middle through-holes of the upper flexible plate and the lower flexible plate, respectively, and separated by the dielectric layer, a notched line is provided along each adjacency of the lower surface of the upper flexible plate and the lower flexible plate, the notched line has a trench recessing upwards or inwards such that the two side regions of the upper flexible plate are bendable upwards or downwards, and the dielectric layer is not extended to the notched line. 2. The winged coil structure as claimed in claim 1 , wherein the upper flexible plate and the lower flexible plate are formed of a resin or plastic material, the connection plug is formed of copper, tin, copper alloy or tin alloy, and has a shape of ball, column or block. 3. The winged coil structure as claimed in claim 1 , wherein the upper magnetic induction coil, the upper connection pad, the lower magnetic induction coil, the lower connection pad and the gold finger are formed of the same or different electrical conductive material, the electrical conductive material comprises copper, copper alloy or gold, and the dielectric layer is formed of a dielectric material. 4. The winged coil structure as claimed in claim 1 , wherein base surfaces of the two side regions of the upper flexible plate are attached to or covered by an external dielectric layer, the external dielectric layer is formed of a dielectric material the same as or different from the dielectric material of the dielectric layer. 5. The winged coil structure as claimed in claim 1 , further comprising a covering layer, wherein the covering layer is configured to cover the upper surface of the upper flexible plate, the lower surface of the lower flexible plate, and a surrounding area of the gold finger, and the covering layer is formed of an electrical insulation material with transparency or opaqueness. 6. A winged coil structure for providing a function of magnetic induction and a flexible and bendable feature, and having a wing shape with two thinner side parts than a middle part downwards projecting, comprising: an upper flexible plate formed of a flexible substrate with electrical insulation, having a middle region and two side regions bordering the middle region, the middle region having a middle through-hole; at least one upper magnetic induction coil embedded in the upper flexible plate and having a helical shape close to an upper surface of the upper flexible plate; at least one upper connection pad electrically connected with the corresponding upper magnetic induction coil; a lower flexible plate formed of an another flexible substrate with electrical insulation, having a middle region and two side regions bordering the middle region, the middle region having a middle through-hole, a lateral size of the lower flexible plate smaller than a lateral size of the upper flexible plate; at least one lower magnetic induction coil embedded in the lower flexible plate and having a helical shape close to a lower surface of the lower flexible plate; at least one lower connection pad electrically connected with the corresponding lower magnetic induction coil, and vertically aligned to the corresponding upper connection pad; at least one gold finger configured at the side regions of the upper flexible plate, and electrically connected with the corresponding lower magnetic induction coil; a dielectric layer provided between the upper flexible plate and the lower flexible plate, the upper flexible plate being on an upper surface of the dielectric layer, the lower flexible plate beneath a lower surface of the dielectric layer, the dielectric layer having at least one through-hole, each through-hole being aligned to the corresponding upper connection pad and lower connection pad; at least one connection plug formed of an electrically conductive metal material, each connection plug penetrating the dielectric layer and provided between the corresponding upper connection pad and lower connection pad, the connection plug possessing workability of thermal pressing so as to tightly combine tightly combine the upper connection pad and the lower connection pad through thermal pressing; a bottom flexible plate formed of a yet flexible substrate with electrical insulation, having a middle region and two side regions bordering the middle region, the middle region having a middle through-hole, a lateral size of the bottom flexible plate smaller identical to a lateral size of the lower flexible plate; at least one bottom magnetic induction coil embedded in the bottom flexible plate and having a helical shape close to a lower surface of the bottom flexible plate; and at least one bottom connection pad electrically connected with the corresponding bottom magnetic induction coil, and vertically aligned to the corresponding lower connection pad, wherein the upper magnetic induction coil, the lower magnetic induction coil and the bottom magnetic induction coil are configured around the middle through-holes of the upper flexible plate, the lower flexible plate and the bottom flexible plate, respectively, and the upper magnetic induction coil and the lower magnetic induction coil are separated by the dielectric layer, a notched line is provided along each adjacency of the lower surface of the upper flexible plate and the lower flexible plate, the notched line has a trench recessing upwards or inwards such that

Assignees

Inventors

Classifications

  • Holes or slots in insulating substrate not used for electrical connections · CPC title

  • laminating flexible circuit boards using additional insulating adhesive materials between the boards · CPC title

  • incorporating printed inductors · CPC title

  • Printed windings · CPC title

  • Printed circuits · CPC title

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Frequently asked questions

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What does patent US9847165B2 cover?
A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug…
Who is the assignee on this patent?
Kinsus Interconnect Tech Corp
What technology area does this patent fall under?
Primary CPC classification H01F27/2804. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).