Led device
US-2017343204-A1 · Nov 30, 2017 · US
by special treatment of the substrate
by special treatment of the substrate · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/381 |
| Official title | {by special treatment of the substrate} |
| Display label | by special treatment of the substrate |
| Total patents | 329 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 30 |
| 2016 | 17 |
| 2017 | 35 |
| 2018 | 28 |
| 2019 | 37 |
| 2020 | 27 |
| 2021 | 31 |
| 2022 | 31 |
| 2023 | 30 |
| 2024 | 32 |
| 2025 | 25 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Resin film, coverlay for printed wiring board, substrate for printed wiring board, and printed wiring board
US-2017327630-A1 · Nov 16, 2017 · US
Long-term packaging for the protection of implant electronics
US-9781842-B2 · Oct 3, 2017 · US
Electric connection structure and electric connection member
US-2017273192-A1 · Sep 21, 2017 · US
Surface treatment of hydrophobic ferroelectric polymers for printing
US-2017237003-A1 · Aug 17, 2017 · US
Circuit Board and Process for Preparing the Same
US-2017238417-A1 · Aug 17, 2017 · US
Electronic component mounting substrate and light emission device using same
US-2017207369-A1 · Jul 20, 2017 · US
Method of manufacturing wiring substrate, and wiring substrate
US-9699916-B2 · Jul 4, 2017 · US
Process of depositing a metallic pattern on a medium
US-9674966-B2 · Jun 6, 2017 · US
Metallic microstructures with reduced-visibility and methods for producing same
US-2017142841-A1 · May 18, 2017 · US
Method of forming insulating layer and touchscreen manufactured using the same
US-9655250-B2 · May 16, 2017 · US
Printed wiring board and method for producing printed wiring board
US-2017118837-A1 · Apr 27, 2017 · US
Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board
US-9578741-B2 · Feb 21, 2017 · US
Method for producing printed wiring board
US-9516765-B2 · Dec 6, 2016 · US
Method for forming conductor layer, and method for producing multilayer wiring substrate using same
US-2016353580-A1 · Dec 1, 2016 · US
Electrostatic adsorptive belt and method of manufacturing thereof, assembly, and conveyance system
US-9487365-B2 · Nov 8, 2016 · US
Method of forming insulating layer and touchscreen manufactured using the same
US-2016252994-A1 · Sep 1, 2016 · US
Wiring substrate and semiconductor package
US-9433109-B2 · Aug 30, 2016 · US
Copper foil with carrier
US-2016242281-A1 · Aug 18, 2016 · US
Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
US-2016212857-A1 · Jul 21, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/381?
- CPC H05K3/381 is the Cooperative Patent Classification code for “by special treatment of the substrate.”
- How many patents are filed under CPC H05K3/381 (by special treatment of the substrate)?
- Our database includes 329 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/381 growing?
- Publication counts under this code: 32 in 2024 vs 25 in 2025 (latest complete years).