Thermoplastic resin composition, and molded article thereof
US-2016163413-A1 · Jun 9, 2016 · US
Resin film, coverlay for printed wiring board, substrate for printed wiring board, and printed wiring board
US2017327630A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017327630-A1 |
| Application number | US-201515520135-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 13, 2015 |
| Priority date | Oct 21, 2014 |
| Publication date | Nov 16, 2017 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A resin film containing a fluororesin as a main component has, on at least one surface thereof, a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more. A coverlay includes the resin film and an adhesive layer laminated on the pre-treated surface. A substrate for a printed wiring board includes the resin film and a conductive layer laminated on the pre-treated surface. A printed wiring board includes an insulating base layer, a conductive pattern laminated on at least one surface of the base layer, and the coverlay for a printed wiring board, the coverlay being laminated on the conductive pattern.
First claim
Opening claim text (preview).
1 : A resin film comprising a fluororesin as a main component, wherein the resin film has, on at least one surface thereof, a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more. 2 : The resin film according to claim 1 , wherein a contact angle of the pre-treated surface with respect to pure water is 90° or less. 3 : The resin film according to claim 1 , wherein a peel strength of an epoxy resin adhesive having an average thickness of 25 μm to the pre-treated surface, the peel strength being measured using a polyimide sheet having an average thickness of 12.5 μm as a flexible adherend, is 1 N/cm or more. 4 : A coverlay for a printed wiring board, the coverlay comprising the resin film according to claim 1 ; and an adhesive layer laminated on the pre-treated surface. 5 : The coverlay for a printed wiring board according to claim 4 , wherein a peel strength between the adhesive layer and the pre-treated surface is 1 N/cm or more. 6 : A substrate for a printed wiring board, the substrate comprising the resin film according to claim 1 ; and a conductive layer laminated on the pre-treated surface. 7 : The substrate for a printed wiring board according to claim 6 , wherein a peel strength between the pre-treated surface and the conductive layer is 1 N/cm or more. 8 : A printed wiring board comprising: an insulating base layer; a conductive pattern laminated on at least one surface of the base layer; and the coverlay for a printed wiring board according to claim 4 , the coverlay being laminated on the conductive pattern. 9 : A printed wiring board comprising the resin film according to claim 1 ; and a conductive pattern laminated on the pre-treated surface. 10 : A printed wiring board comprising the resin film according to claim 1 ; and a conductive pattern laminated on a surface of the resin film, wherein the pre-treated surface is disposed in a conductive pattern-non-laminated region on the surface of the resin film. 11 : The printed wiring board according to claim 10 , wherein the pre-treated surface is disposed in a conductive pattern-laminated region.
Assignees
Inventors
Classifications
Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] · CPC title
Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38) · CPC title
Improvement of the adhesion between the insulating substrate and the metal · CPC title
comprising epoxy resins · CPC title
Cleaning or polishing of the conductive pattern · CPC title
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Frequently asked questions
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- What does patent US2017327630A1 cover?
- A resin film containing a fluororesin as a main component has, on at least one surface thereof, a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more. A coverlay includes the resin film and an adhesive layer laminated on the pre-treated surface. A substrate for a printed wiring board includes the resin film and a conductive layer laminated …
- Who is the assignee on this patent?
- Sumitomo Electric Printed Circuits Inc
- What technology area does this patent fall under?
- Primary CPC classification C08G59/30. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Nov 16 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).