Method for producing printed wiring board

Patent metadata

Field	Value
Publication number	US-9516765-B2
Application number	US-201314065924-A
Country	US
Kind code	B2
Filing date	Oct 29, 2013
Priority date	Nov 1, 2012
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A method for producing a printed wiring board which is capable of forming an insulating layer having a surface with low roughness and high adhesion strength to a conductive layer and of achieving an excellent performance in removal of smear, involves the following steps (A) to (F) in this order: (A) laminating, onto an internal layer circuit substrate, a resin sheet with a support which includes a support and a resin composition layer in contact with the support so that the resin composition layer is in contact with the internal layer circuit substrate; (B) thermally curing the resin composition layer of the resin sheet with a support to form an insulating layer; (C) perforating the insulating layer to form a via hole; (D) performing a desmear treatment; (E) peeling the support; and (F) forming a conductive layer on a surface of the insulating layer.

First claim

The invention claimed is:

1. A method for producing a printed wiring board, comprising (A) to (F) in this order:
(A) laminating, onto an internal layer circuit substrate, a resin sheet with a support which comprises a support and a resin composition layer in contact with the support, so that the resin composition layer is in contact with said internal layer circuit substrate;
(B) thermally curing said resin composition layer of said resin sheet with a support to form an insulating layer;
(C) perforating said insulating layer to form a via hole;
(D) performing a desmear treatment;
(E) peeling said support, to expose a surface of said insulating layer; and
(F) forming a conductive layer on the surface of said insulating layer,
wherein
said resin composition layer of said resin sheet with a support comprises at least one epoxy resin, at least one curing agent, and at least one inorganic filler,
said at least one curing agent comprises an active ester-based curing agent and a curing agent selected from the group consisting of a phenol-based curing agent and a naphthol-based curing agent,
said at least one inorganic filler is treated with at least one surface treatment agent selected from the group consisting of an organosilazane compound, a titanate-based coupling agent, an aminosilane-based coupling agent, an epoxysilane-based coupling agent, and a mercaptosilane-based coupling agent, and
said at least one inorganic filler is present in said resin composition layer in an amount of 72% by mass to 95% by mass, when a content of nonvolatile components in said resin composition layer is defined as 100% by mass.

2. A method for producing a printed wiring board according to claim 1 , wherein said desmear treatment (D) is a wet desmear treatment, a dry desmear treatment, or a combination thereof.

3. A method for producing a printed wiring board according to claim 1 , wherein said forming a conductive layer (F) comprises:
performing a roughening treatment of the surface of said insulating layer, and
wet plating said surface of the insulating layer to form said conductive layer, in this order.

4. A method for producing a printed wiring board according to claim 1 , wherein said forming a conductive layer (F) comprises:
dry plating the surface of said insulating layer to form a metal layer, and
wet plating a surface of said metal layer to form said conductive layer, in this order.

5. A method for producing a printed wiring board according to claim 1 , wherein said at least one inorganic filler has an average particle diameter of 0.01 μm to 3 μm.

6. A method for producing a printed wiring board according to claim 1 , wherein a surface of said at least one inorganic filler is treated with a surface treatment agent.

7. A printed wiring board, which is produced by the method according to claim 1 .

8. A semiconductor device, comprising a printed wiring board according to claim 7 .

9. A method for producing a printed wiring board according to claim 1 , wherein said forming a conductive layer (F) comprises:
performing a roughening treatment of the surface of said insulating layer, the roughening treatment being selected from the group consisting of a dry sand blasting treatment, a wet sand blasting treatment and a desmear treatment using an oxidant solution.

10. A method for producing a printed wiring board according to claim 1 , wherein said forming a conductive layer (F) comprises:
(a) performing a roughening treatment of the surface of said insulating layer, said roughening treatment being a wet roughening treatment or a dry roughening treatment selected from the group consisting of a dry sand blasting treatment and a plasma treatment, and
wet plating said surface of said insulating layer, in this order, to form said conductive layer; or
(b) dry plating the surface of said insulating layer to form a metal layer without performing a roughening treatment, and
wet a plating surface of said metal layer, in this order, to form said conductive layer.

Assignees

• Ajinomoto Kk

Inventors

• Nakamura Shigeo
• Morikawa Yukinori
• Yokota Tadahiko

Classifications

• H05K3/4661

  Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K3/387) · CPC title

• H05K3/465 Primary

  by applying an insulating layer having channels for the next circuit layer · CPC title

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title

• Y10T29/49165

  by forming conductive walled aperture in base · CPC title

• H05K3/381

  by special treatment of the substrate · CPC title