Package structure, electronic device and method for manufacturing package structure
US-2017243049-A1 · Aug 24, 2017 · US
Etchants
Etchants · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/067 |
| Official title | {Etchants} |
| Display label | Etchants |
| Total patents | 203 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 28 |
| 2016 | 25 |
| 2017 | 18 |
| 2018 | 16 |
| 2019 | 18 |
| 2020 | 22 |
| 2021 | 15 |
| 2022 | 20 |
| 2023 | 14 |
| 2024 | 19 |
| 2025 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for fabricating a flexible electronic structure and a flexible electronic structure
US-9723711-B2 · Aug 1, 2017 · US
Carrying device, wet etching apparatus and usage method thereof
US-2017202091-A1 · Jul 13, 2017 · US
Conductive structure body and method for manufacturing the same
US-9706653-B2 · Jul 11, 2017 · US
Etching solution for copper or a compound comprised mainly of copper
US-9644274-B2 · May 9, 2017 · US
Etching liquid, etching method, and method of manufacturing solder bump
US-9633898-B2 · Apr 25, 2017 · US
Method of selectively etching a metal layer from a microstructure
US-2017060282-A1 · Mar 2, 2017 · US
Printed circuit board and method of manufacturing the same
US-2016381796-A1 · Dec 29, 2016 · US
Method of improving lifetime of etching liquid and yield in Cu-interconnection process and Cu-interconnection etching device
US-9528188-B2 · Dec 27, 2016 · US
Circuit substrate having a circuit pattern and method for making the same
US-9474161-B2 · Oct 18, 2016 · US
Liquid composition used in etching multilayer film containing copper and molybdenum, manufacturing method of substrate using said liquid composition, and substrate manufactured by said manufacturing method
US-9466508-B2 · Oct 11, 2016 · US
Method for structuring a transparent conductive matrix comprising nano materials
US-2016293289-A1 · Oct 6, 2016 · US
Nanowire grid structure having grid patterns and a sacrificial layer
US-9456501-B2 · Sep 27, 2016 · US
Aqueous composition for etching of copper and copper alloys
US-9441304-B2 · Sep 13, 2016 · US
Fluororesin base material, printed wiring board, and circuit module
US-2016250830-A1 · Sep 1, 2016 · US
Etching composition and method for producing printed-wiring board using the same
US-9394616-B2 · Jul 19, 2016 · US
Etching liquid composition for multilayer containing copper and molybdenum and process for etching thereof
US-2016186057-A1 · Jun 30, 2016 · US
Method for producing ceramic circuit board
US-2016192503-A1 · Jun 30, 2016 · US
Method Of Improving Lifetime Of Etching Liquid And Yield In CU-Interconnection Process And CU-Interconnection Etching Device
US-2016177456-A1 · Jun 23, 2016 · US
Method for forming an integrated circuit package
US-9368183-B2 · Jun 14, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/067?
- CPC H05K3/067 is the Cooperative Patent Classification code for “Etchants.”
- How many patents are filed under CPC H05K3/067 (Etchants)?
- Our database includes 203 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/067 growing?
- Publication counts under this code: 19 in 2024 vs 8 in 2025 (latest complete years).