Conductive structure body and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9706653-B2
Application number	US-201414766085-A
Country	US
Kind code	B2
Filing date	Nov 4, 2014
Priority date	Nov 4, 2013
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

The present specification relates to a conductive structure body and a method for manufacturing the same.

First claim

The invention claimed is:

1. A conductive structure body comprising:
a substrate;
a conductive pattern layer provided on the substrate; and
a darkening pattern layer provided on at least one surface of the conductive pattern layer,
wherein the darkening pattern layer includes a copper-manganese-based material represented by Cu a Mn b O c N d ,
in the copper-manganese-based material,
b is a mass ratio of Mn to the copper-manganese-based material and 0.01 or more and 0.5 or less,
c is a mass ratio of O to the copper-manganese-based material and 0.05 or more and 0.6 or less,
d is a mass ratio of N to the copper-manganese-based material and 0 or more and 0.15 or less, and
a is a mass ratio of Cu to the copper-manganese-based material and a remainder value to a sum of the mass ratios of components other than Cu.

2. The conductive structure body of claim 1 , wherein in the copper-manganese-based material, d is 0, and c is 0.25 or more and 0.6 or less.

3. The conductive structure body of claim 1 , wherein in the copper-manganese-based material, d is more than 0 and 0.15 or less, and c +d is 0.15 or more and 0.6 or less.

4. The conductive structure body of claim 1 , wherein total reflectance of the conductive structure body is 25% or less.

5. The conductive structure body of claim 2 , wherein the conductive pattern layer is provided between the substrate and the darkening pattern layer, and the total reflectance is measured on a surface of the substrate, on which the conductive pattern is provided.

6. The conductive structure body of claim 2 , wherein the darkening pattern layer is provided between the substrate and the conductive pattern layer, and the total reflectance is measured on an opposite surface of the surface of the substrate, on which the conductive pattern is provided.

7. The conductive structure body of claim 1 , wherein an extinction coefficient k of the darkening pattern layer is 0.2 or more and 2.5 or less.

8. The conductive structure body of claim 1 , wherein a refractive index of the darkening pattern layer is 0 or more and 3 or less.

9. The conductive structure body of claim 1 , wherein a thickness of the darkening pattern layer is 20 nm or more and 100 nm or less.

10. The conductive structure body of claim 1 , wherein surface resistance of the conductive structure body is more than 0 Ω/square and 300 Ω/square or less.

11. The conductive structure body of claim 1 , wherein in the conductive structure body, based on a CIE L*a*b* color coordinate, brightness L* is 55 or less and chromaticity a* and b* are 0 or less.

12. The conductive structure body of claim 1 , wherein a thickness of the conductive pattern layer is 0.01 μm or more and 10 μm or less.

13. The conductive structure body of claim 1 , wherein the conductive pattern layer includes one or more materials selected from the group consisting of a metal, a metal alloy, metal oxide, and metal nitride, and
the materials have specific resistance of 1×10 6 Ω·cm or more and 30×10 6 Ω·cm or less.

14. The conductive structure body of claim 1 , wherein a line width of a pattern of the conductive pattern layer is 10 μm or less.

15. A touch screen panel comprising:
the conductive structure body of claim 1 .

16. A display device comprising:
the conductive structure body of claim 1 .

17. A solar battery comprising:
the conductive structure body of claim 1 .

18. A method for manufacturing a conductive structure body, comprising:
preparing a substrate;
forming a conductive pattern layer on the substrate; and
forming a darkening pattern layer on an upper surface, a lower surface, or the upper surface and the lower surface of the conductive pattern layer,
wherein the darkening pattern layer includes a copper-manganese-based material represented by Cu a Mn b O c N d ,
in the copper-manganese-based material,
b is a mass ratio of Mn to the copper-manganese-based material and 0.01 or more and 0.5 or less,
c is a mass ratio of O to the copper-manganese-based material and 0.05 or more and 0.6 or less,
d is a mass ratio of N to the copper-manganese-based material and 0 or more and 0.15 or less, and
a is a mass ratio of Cu to the copper-manganese-based material and a remainder value to a sum of the mass ratios of components other than Cu.

19. The method of claim 18 , wherein the forming of the conductive pattern layer includes forming a conductive layer on the substrate,
wherein the forming of the darkening pattern layer includes forming a darkening layer on an upper surface, a lower surface, or the upper surface and the lower surface of the conductive layer, and
the conductive pattern layer and the darkening pattern layer are formed by simultaneous patterning of the conductive layer and the darkening layer.

20. The method of claim 19 , wherein in the simultaneous patterning, batch etching is performed by using an etchant.

Assignees

• Lg Chemical Ltd

Inventors

• Yoon Junghwan
• Lim Jin Hyong
• Kim Yong Chan
• Lee Ilha
• Kim Ki-Hwan

Classifications

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• H01L31/022466

  Electricity · mapped topic

• G06F3/041 Primary

  Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

• Y10T29/49158

  with molding of insulated base · CPC title

• G06F3/044

  by capacitive means · CPC title