Method for structuring a transparent conductive matrix comprising nano materials

US2016293289A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016293289-A1
Application numberUS-201415035013-A
CountryUS
Kind codeA1
Filing dateOct 16, 2014
Priority dateNov 8, 2013
Publication dateOct 6, 2016
Grant date

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The present invention refers to a method for selectively structuring of a polymer matrix comprising AgNWs (silver nano wires) or silver nano particles (Ag nano ink) or comprising mixtures of AgNWs and silver nano particles on a flexible plastic substructure or solid glass sheet. The method also includes a suitable etching composition, which allows to process the method in an industrial scale.

First claim

Opening claim text (preview).

1 . A method for selective decomposition and release of silver nanowires (AgNWs) and/or of silver nano particles, which are comprising within a polymer matrix, which in turn is positioned on a flexible plastic or glass substructure, comprising the steps: a) printing an etching paste onto the surface of a composite material comprising the polymer matrix comprising silver nanowires (AgNWs) on a plastic substrate or glass sheet, b) etching for a predetermined period of time (fixed dwell time) with or without heating and c) cleaning the substrate surface, with the proviso that the polymer matrix remains and shows a porous structure. without removal of the polymer matrix 2 . A method according to claim 1 , characterized in that in step a) an etching paste is printed comprising an etchant selected from the group NH 4 HF 2 , NH 4 F, HBF 4 , H 2 SO 4 , HNO 3 , Fe(NO 3 ) 3 , FeCl 3 , H 3 PO 4 , Triethylmmonium chloride, Diammoniumhydrogenphosphate, KBrO 3 , KClO 3 , KClO 4 , CuCl 2 , KMnO 4 , K 2 CrO 4 , HCl, NH 4 OH, H 2 O 2 , KNO 3 , K 3 PO 4 , FeSO 4 or a mixture thereof. 3 . A method according to claim 1 , characterized in that in step a) an etching paste is printed comprising a solvent selected from the group water, mono- or polyhydric alcohols, such as glycerol, 1,2-propanediol, 1,2-Ethandiol, 2-Propanol, 1,4-butanediol, 1,3-butanediol, 1,5-pentanediol, 2-ethyl-1-hexenol, ethylene glycol, diethylene glycol and dipropylene glycol, ether, such as ethylene glycol monobutyl ether, triethylene glycol monomethyl ether, diethylene glycol monobutyl ether, diethylene glycol monoethyl ether, diethylene glycol monoethyl ether and dipropylene glycol monomethyl ether, ester, such as [2,2-butoxy(ethoxy)]ethyl acetate, isopropyl acetate, isopropyl formate, esters of carbonic acid, such as propylene carbonate, ketone, such as acetone, 2-butanon, acetophenone, methyl-2-hexanone, 2-octanone, 4-hydroxy-4-methyl-2-pentanone, pyrrolidone and 1-methyl-2-pyrrolidone, caprolactam, 1,3.Dioxolan, 2-Methyl-1,3-Dioxolan, aldehyde, such as acetaldehyd, as such or mixtures thereof, in an amount in the range of 10 to 90% by weight, preferably in an amount in the range of 15 to 85% by weight based on the total amount of the medium. 4 . A method according to claim 1 , characterized in that in step a) an etching paste is used comprising organic and/or inorganic particles or mixtures thereof in an amount in the range of 0.5 to 20% by weight, based on the total amount of the etching medium. 5 . A method according to claim 1 , characterized in that in step a) an etching paste is used comprising inorganic particles in an amount in the range of 0.5 to 5% by weight, based on the total amount of the etching medium. 6 . A method according to claim 1 , characterized in that in step a) an etching paste is used comprising organic particles or mixtures thereof in an amount in the range of 5 to 20% by weight, based on the total amount of the etching medium. 7 . A method according to claim 1 , characterized in that in step a) an etching paste is used comprising inorganic particles having mean particle sizes in the range of 50 nm to 150 nm. 8 . A method according to claim 1 , characterized in that in step a) an etching paste is used comprising organic particles having mean particle sizes in the range of 0.5 μm to 20 μm. 9 . A method according to claim 1 , characterized in that in step a) an etching paste is used comprising organic polymer particles selected from the group of polystyrene, acrylic polymers, polyamides, polyimides, methacrylic polymers, melamine, urethane, benzoguanine and phenolic resins, silicone resins, micronized cellulose, fluorinated polymers (PTFE, PVDF inter alia) and micronized wax as filler and thickener. 10 . A method according to claim 1 , characterized in that in step a) an etching paste is used comprising inorganic particles selected from the group calcium fluoride, boron oxide, carbon black, graphite, fumed silica and sodium chloride as filler and thickener. 11 . A method according to claim 1 , characterized in that in step a) an etching paste is applied onto the surface by screen printing, gravure-printing, inkjetting, dispensing or micro-jetting. 12 . A method according to claim 1 , characterized in that the heating of the substrate lasts for 10 s-15 min, preferably for 30 s to 7 min, and the temperature being in the range of 20 to 170° C. 13 . A method according to claim 1 , characterized in that the heating of the substrate lasts for 5 minutes at 100° C. 14 . A method according to claim 12 , characterized in that the treated substrate is rinsed with DI water or with a solvent; and that the rinsed part is dried with dry air or nitrogen flow. 15 . A method according to claim 1 , wherein said plastic is polyurethane, PEN (polyethylene naphthalate) or PET (polyethylene terephatalate). 16 . A method according to claim 1 , wherein the AgNWs (silver nano wires), which are embedded in conductive polymer layers, have a length variation from 1.5 to 15 μm and diameter varies from 40-150 nm. 17 . A method according to claim 1 , wherein the silver nano particles (Ag nano ink), which are embedded in conductive polymer layers, have a length variation in the range of 1.5 to 15 μm and mean diameter in the range of 40-150 nm. 18 . A method according to claim 1 , wherein the conductive polymer is selected from the group poly(3-octylthiophene) (P3OT), poly(3-hexyl-thiophene) polymer (P3HT), poly(3,4-ethylene dioxythiophene), or other polythiophene derivatives and polyanilines, or is a combination of polymers like poly[2-methoxy-5-(3′,7′-dimethyloctyloxy)1,4-phenylene vinylene] (MDMO-PPV)/1-(3-methoxycarbonyl)-propyl-1-phenyl)[6,6]C 61 (PCBM); poly(3-hexyl-thiophene) polymer (P3HT)/(PCBM) and poly(3,4-ethylene dioxythiophene)/poly(styrene sulfonate) (PEDOT/PSS). 19 . A method according to claim 1 , wherein the resolution of the printed lines, dots or structures is less than 90 μm.

Assignees

Inventors

Classifications

  • containing a fluorine compound · CPC title

  • H01B1/22Primary

    the conductive material comprising metals or alloys · CPC title

  • with organic material · CPC title

  • C23F1/30Primary

    for etching other metallic material · CPC title

  • Porous, e.g. foam · CPC title

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Frequently asked questions

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What does patent US2016293289A1 cover?
The present invention refers to a method for selectively structuring of a polymer matrix comprising AgNWs (silver nano wires) or silver nano particles (Ag nano ink) or comprising mixtures of AgNWs and silver nano particles on a flexible plastic substructure or solid glass sheet. The method also includes a suitable etching composition, which allows to process the method in an industrial scale.
Who is the assignee on this patent?
Merck Patent Gmbh
What technology area does this patent fall under?
Primary CPC classification H01B1/22. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Oct 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).