Copper clad laminate and printed wiring board
US-2024349422-A1 · Oct 17, 2024 · US
Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2203/178 |
| Official title | Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials |
| Display label | Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials |
| Total patents | 73 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 10 |
| 2016 | 8 |
| 2017 | 9 |
| 2018 | 7 |
| 2019 | 5 |
| 2020 | 4 |
| 2021 | 5 |
| 2022 | 2 |
| 2023 | 5 |
| 2024 | 10 |
| 2025 | 6 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Recycling printed circuit boards using swelling agent
US-2024260199-A1 · Aug 1, 2024 · US
Information handling system and peripheral printed circuit board having non-homogeneous substrate material and integrated thermal solution
US-2024130041-A1 · Apr 18, 2024 · US
Fabrication of high-resolution graphene-based flexible electronics via polymer casting
US-11938708-B1 · Mar 26, 2024 · US
Method, apparatus and system for processing a composite waste source
US-11884992-B2 · Jan 30, 2024 · US
Information handling system mouse with rapid assembly and disassembly to aid recycling
US-11856719-B1 · Dec 26, 2023 · US
Self-healable, recyclable, and reconfigurable wearable electronics device
US-2023413432-A1 · Dec 21, 2023 · US
Solder recovery device
US-2023225059-A1 · Jul 13, 2023 · US
Apparatus and method for assigning a material value score to a waste printed circuit board or a portion thereof and system for sorting waste printed circuit boards
US-2023109956-A1 · Apr 13, 2023 · US
Electronic circuit having graphene oxide paper substrate and method of recovering parts of an electronic circuit
US-2023049337-A1 · Feb 16, 2023 · US
Fabrication of high-resolution graphene-based flexible electronics via polymer casting
US-11465397-B1 · Oct 11, 2022 · US
Method for treating waste electronic substrate
US-2022062962-A1 · Mar 3, 2022 · US
Powder gathering apparatus
US-11052399-B2 · Jul 6, 2021 · US
A method, apparatus and system for processing a composite waste source
US-2021189520-A1 · Jun 24, 2021 · US
Transient electronics using thermoresponsive materials
US-10978396-B2 · Apr 13, 2021 · US
Decoy security based on stress-engineered substrates
US-10947150-B2 · Mar 16, 2021 · US
Integrated electronic waste recycling and recovery system and process of using same
US-2021040581-A1 · Feb 11, 2021 · US
Electronic product and manufacturing method thereof
US-10716219-B2 · Jul 14, 2020 · US
Decoy security based on stress-engineered substrates
US-2020172430-A1 · Jun 4, 2020 · US
Method for processing of electrical and electronic components to recover valuable materials
US-10668482-B2 · Jun 2, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2203/178?
- CPC H05K2203/178 is the Cooperative Patent Classification code for “Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials.”
- How many patents are filed under CPC H05K2203/178 (Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials)?
- Our database includes 73 publications tagged with this CPC code.
- Is patent activity under CPC H05K2203/178 growing?
- Publication counts under this code: 10 in 2024 vs 6 in 2025 (latest complete years).