Electronic product and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10716219-B2
Application number	US-201815869303-A
Country	US
Kind code	B2
Filing date	Jan 12, 2018
Priority date	Jan 26, 2017
Publication date	Jul 14, 2020
Grant date	Jul 14, 2020

Abstract

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a film, wherein the conductive circuit is made of a conductive metal layer, the conductive metal layer is a metal foil and the conductive metal layer is patterned to form the conductive circuit. Then, an electronic element is disposed on the conductive circuit of the film, and the electronic element is electrically connected to the conductive circuit. Then, the film and a supporting structure are combined by an out-mold forming technology or an in-mold forming technology, such that the electronic element is wrapped between the film and the supporting structure.

First claim

What is claimed is:

1. A manufacturing method of an electronic product, comprising:
forming a conductive circuit on a film by a hot stamping process, wherein the conductive circuit is made by a metal foil, a part of the metal foil is pressed and fixed to the film so as to pattern the metal foil as a conductive metal layer to form the conductive circuit, wherein a heat resistant releasing layer is disposed on the conductive metal layer and separates the conductive metal layer and a press plate, and a part of the metal foil not pressed and fixed to the film is removed by peeling off the heat resistant releasing layer;
disposing an electronic element on the conductive circuit of the film, wherein the electronic element is electrically connected to the conductive circuit; and
combining the film and a supporting structure by an out-mold molding technology or an in-mold molding technology, such that the electronic element is wrapped between the film and the supporting structure.

2. The manufacturing method according to claim 1 , wherein the out-mold molding technology comprises an out-mold wrapping method, a high temperature vacuum adsorption method, a hot pressing method, a ultrasonic melting method, a melt bonding method or an adhesive bonding method, and the in-mold molding technology comprises an injection molding method.

3. The manufacturing method according to claim 1 , wherein the film is a polymer film, and forming the conductive circuit comprises:
forming a patterned ink layer having a circuit pattern on the polymer film;
placing the conductive metal layer on the patterned ink layer; and
hot pressing the conductive metal layer on the patterned ink layer.

4. The manufacturing method according to claim 3 , further comprising disposing the conductive metal layer having the heat resistant releasing layer on the patterned ink layer.

5. The manufacturing method according to claim 1 , wherein the film is a polymer film, and forming the conductive circuit comprises:
placing the conductive metal layer on a toppan stamping plate, wherein a protrusion of the toppan stamping plate forms a circuit pattern, and the conductive metal layer contains a binder;
placing the polymer film on the conductive metal layer; and
hot pressing the conductive metal layer through the toppan stamping plate on the polymer film.

6. The manufacturing method according to claim 5 , further comprising
disposing the conductive metal layer having the heat resistant releasing layer on the toppan stamping plate.

7. The manufacturing method according to claim 1 , wherein the film is a polymer film, and forming the conductive circuit comprises:
placing the conductive metal layer having a circuit pattern on the polymer film, wherein the conductive metal layer has a binder; and
hot pressing the conductive metal layer on the polymer film.

8. A manufacturing method of an electronic product, comprising:
forming a conductive circuit on a film by a cold stamping process, wherein the conductive circuit is made by a metal foil, a part of the metal foil is pressed and fixed to the film so as to pattern the metal foil as a conductive metal layer to form the conductive circuit, wherein a light resistant releasing layer is disposed on the conductive metal layer and separates the conductive metal layer and a press plate, and a part of the metal foil not pressed and fixed to the film is removed by peeling off the light resistant releasing layer;
disposing an electronic element on the conductive circuit of the film, wherein the electronic element is electrically connected to the conductive circuit; and
combining the film and a supporting structure by an out-mold molding technology or an in-mold molding technology, such that the electronic element is wrapped between the film and the supporting structure.

9. The manufacturing method according to claim 8 , wherein the out-mold molding technology comprises an out-mold wrapping method, a high temperature vacuum adsorption method, a hot pressing method, a ultrasonic melting method, a melt bonding method or an adhesive bonding method, and the in-mold molding technology comprises an injection molding method.

10. The manufacturing method according to claim 8 , wherein the film is a polymer film, and forming the conductive circuit comprises:
forming a patterned binder layer having a circuit pattern on the polymer film;
placing the conductive metal layer on the patterned binder layer; and
applying a pressure to the conductive metal layer on the patterned binder layer, and curing the patterned binder to form a patterned conductive metal layer having the circuit pattern on the polymer film.

11. The manufacturing method according to claim 8 , wherein the film is a polymer film, and forming the conductive circuit comprises:
forming a patterned binder layer on a protrusion of a toppan or a groove of an intaglio plate, wherein the protrusion of the toppan or the groove of the intaglio plate forms a circuit pattern;
placing the polymer film on the patterned binder and transfer-printing the patterned binder layer on the polymer film;
placing the conductive metal layer on the patterned binder layer; and
applying a pressure to the conductive metal layer on the patterned binder layer, and curing the patterned binder layer to form a patterned conductive metal layer having the circuit pattern on the polymer film.

12. The manufacturing method according to claim 10 , further comprising:
disposing the conductive metal layer having the light resistant releasing layer on the patterned binder layer.

13. The manufacturing method according to claim 11 , further comprising:
disposing the conductive metal layer having the light resistant releasing layer on the patterned binder layer.

Assignees

• Lite On Electronics Guangzhou
• Lite On Technology Corp

Inventors

• Pu yi-feng
• Lin Tzu-Shu
• Huang Pei-Hsuan

Classifications

• H05K3/025

  by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper · CPC title

• H05K2203/0522

  Using an adhesive pattern · CPC title

• H05K2203/0285

  Using ultrasound, e.g. for cleaning, soldering or wet treatment · CPC title

• H05K2203/0108

  Male die used for patterning, punching or transferring · CPC title

• H05K3/207

  using a prefabricated paste pattern, ink pattern or powder pattern · CPC title