A method, apparatus and system for processing a composite waste source

Patent metadata

Field	Value
Publication number	US-2021189520-A1
Application number	US-201716076289-A
Country	US
Kind code	A1
Filing date	Feb 8, 2017
Priority date	Feb 8, 2016
Publication date	Jun 24, 2021
Grant date	—

Abstract

A method, apparatus and system for processing a composite waste source, such as e-waste, is disclosed. The composite waste source may comprise low-, moderate and high-melting point constituents, such as plastics, metals and ceramics. The composite waste source is heated to a first temperature zone, causing at least some of the low-melting point constituents to at least partially thermally transform. The composite waste source is subsequently heated to a second, higher, temperature zone, causing at least some of the moderate-melting point constituents to at least partially thermally transform. At least some of the at least partially thermally transformed constituents may be recovered. The method, apparatus and system disclosed may provide for the recovery and reuse of materials which would otherwise be sent to landfill or incinerated.

First claim

1 . A method of processing electronic waste comprising low-, moderate and high-melting point constituents, the method comprising:
heating the electronic waste in a first temperature zone to a first temperature, such that at least some of the low-melting point constituents in the electronic waste are at least partially thermally transformed; and heating the electronic waste from the first temperature zone in a second, higher, temperature zone, to a second temperature such that at least some of the moderate-melting point constituents are at least partially thermally transformed, wherein at least some of the high-melting point constituents remain reasonably inert.

2 . A method as claimed in claim 1 wherein the low-melting point constituents are at least partially thermally transformed by melting, alloy formation, dissolution and/or phase separation.

3 . A method as claimed in claim 1 wherein the moderate-melting point constituents are at least partially thermally transformed by melting, alloy formation and/or dissolution.

4 . A method of processing electronic waste the method comprising:
rapidly heating the electronic waste in a first temperature zone to a first temperature, such that at least some of the plastic constituents in the electronic waste are at least partially thermally transformed; and heating the electronic waste in a second temperature zone to a second temperature, such that at least some metal constituents in the electronic waste are at least partially thermally transformed, wherein the ceramic constituents remain reasonably inert.

5 . A method as claimed in claim 4 wherein the plastic constituents are at least partially thermally transformed into gases and solid carbon.

6 - 7 . (canceled)

8 . A method as claimed in claim 4 wherein the metal constituents are at least partially thermally transformed through melting, alloy formation and/or dissolution.

9 . A method as claimed in claim 4 wherein, prior to rapidly heating the electronic waste to the first temperature zone, the electronic waste is pre-heated in a pre-treatment temperature zone to a pre-treatment temperature that is lower than the first temperature, whereby at least some low-melting point metals are at least partially thermally transformed to form metals or metal alloys.

10 . A method as claimed in claim 4 further comprising the step of heating the electronic waste in at least one additional temperature zone to at least one additional temperature, wherein the temperature in the at least one additional temperature zone is a higher temperature than the preceding temperature zone.

11 . A method as claimed in claim 4 further comprising collecting at least some of the at least partially thermally transformed constituents at the or each temperature zone.

12 . A method as claimed in claim 4 wherein the temperatures in the zones are controlled so as to minimise the generation of hazardous materials.

13 . A method as claimed in claim 4 wherein the method is conducted under inert conditions.

14 . (canceled)

15 . A method as claimed in claim 4 wherein the electronic waste is analysed to determine its constituents prior to heating.

16 - 20 . (canceled)

21 . A method of producing a metal alloy from electronic waste the method-comprising a multi-stage heating process including the steps of:
rapidly heating the electronic waste to a first temperature in a first temperature zone, such that at least some plastic constituents in the electronic waste are at least partially thermally transformed; and heating the electronic waste to a second temperature in a second temperature zone, such that at least some metal constituents in the electronic waste are at least partially thermally transformed; wherein at least some of the metal constituents are transformed into metal alloys.

22 . A method as claimed in claim 21 wherein, when the metal constituents include copper, the resulting metal alloy is a copper-based metal alloy.

23 . A method as claimed in claim 21 further comprising the step of:
heating the electronic waste to a third temperature in a third temperature zone, such that remaining copper in the electronic waste is melted, and the ceramic constituents remain reasonably inert.

24 . A method as claimed in claim 21 wherein the plastic constituents are at least partially thermally transformed into gases and solid carbon, and assist in the reduction of any copper oxides present in the second, or third, temperature zones.

25 . A method of recovering metals from a electronic waste the method comprising a multi-stage heating process including the steps of:
rapidly heating the electronic waste to a first temperature in a first temperature zone, such that at least some plastic constituents and low-melting temperature metal constituents in the electronic waste are at least partially thermally transformed; and heating the electronic waste to a second temperature in a second temperature zone, such that at least some moderate-melting temperature metal constituents in the electronic waste are at least partially thermally transformed; wherein at least some of the low-melting and moderate-melting temperature metal constituents are recovered as molten metals and/or metal alloys.

26 . A method as claimed in claim 25 further comprising the step of:
heating the electronic waste to a third temperature in a third temperature zone, such that remaining copper in the electronic waste is melted and the ceramic constituents remain reasonably inert.

27 - 46 . (canceled)

47 . A method as claimed in claim 4 , wherein the temperatures in the zones avoid a temperature range of about 350° C.-850° C.

48 . A method of processing a composite waste source comprising low-, moderate- and high-melting point constituents, the method comprising:
heating the composite waste in a first temperature zone to a first temperature, such that at least some of the low-melting point constituents in the composite waste are at least partially thermally transformed; and heating the composite waste from the first temperature zone in a second, higher, temperature zone, to a second temperature such that at least some of the moderate-melting point constituents are at least partially thermally transformed, wherein at least some of the high-melting point constituents remain reasonably inert, and wherein the temperatures in the zones avoid a temperature range of about 350° C.-850° C.

Assignees

• Newsouth Innovations Pty Ltd

Inventors

• Sahajwalla Veena

Classifications

• C22B19/30

  from metallic residues or scraps · CPC title

• C22B11/025 Primary

  from manufactured products, e.g. from printed circuit boards, from photographic films, paper, or baths · CPC title

• H05K2203/1476

  Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning · CPC title

• C22B25/02

  by dry processes · CPC title

• H05K2203/1105

  Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating · CPC title