Information handling system and peripheral printed circuit board having non-homogeneous substrate material and integrated thermal solution

Patent metadata

Field	Value
Publication number	US-2024130041-A1
Application number	US-202217968438-A
Country	US
Kind code	A1
Filing date	Oct 18, 2022
Priority date	Oct 18, 2022
Publication date	Apr 18, 2024
Grant date	—

Abstract

An information handling system and/or peripheral device includes a printed circuit board having at least one prepreg substrate coupled to at least one bio-based substrate to support operation of electronic components, such as mouse position sensor and scroll wheel rotation sensor, and having a layer of graphene between the prepreg substrate and the bio-based substrate. At end of life, the bio-based substrate is removed from the prepreg substrate, such as by melting of the biobased material, so that the prepreg substrate can be reused. In one embodiment, the prepreg substrate supports power and ground planes that bio-based substrates couple over so that the prepreg substrate can be reused along with the power and ground planes by coupling updated bio-based substrates over the reused prepreg substrate.

First claim

What is claimed is:

1 . An information handling system comprising:
a housing; a processor disposed in the housing and operable to execute instructions that process information; a memory disposed in the housing and interfaced with the processor, the memory operable to store the instructions and information; a peripheral device external the housing and interfaced with the processor, the peripheral device operable to perform a peripheral function; and a printed circuit board disposed in the peripheral device and supporting one or more electronic components, the printed circuit board having at least one prepreg substrate and at least one bio-based substrate and having a layer of graphene disposed between the prepreg substrate and bio-based substrate.

2 . The information handling system of claim 1 further comprising:
a ground plane coupled to a first side of the prepreg substrate;
a power plane coupled to a second side of the prepreg substrate;
a first graphene layer disposed between the ground plane and the bio-based substrate; and
a second graphene layer disposed between the prepreg substrate and the power plane.

3 . The information handling system of claim 1 further comprising a power plane coupled to a side of the prepreg substrate, wherein:
the at least one bio-based substrate couples over the power plane;
the layer of graphene couples between the power plane and the bio-based substrate; and
the one or more electronic components couple to the bio-based substrate.

4 . The information handling system of claim 1 further comprising a ground plane coupled to a side of the prepreg substrate, wherein:
the at least one bio-based substrate couples over the ground plane;
the layer of graphene couples between the ground plane and the prepreg substrate; and
the one or more electronic components couple to the bio-based substrate.

5 . The information handling system of claim 1 further comprising:
a ground plane coupled to a first side of the prepreg substrate;
a power plane coupled to a second side of the prepreg substrate;
a first bio-based substrate coupled to the ground plane;
a second bio-based substrate coupled to the power plane;
plural electronic components coupled to the first and second bio-based substrates.

6 . The information handling system of claim 5 wherein the layer of graphene couples between the bio-based substrate and the ground plane.

7 . The information handling system of claim 5 wherein the layer of graphene couples between the prepreg substrate and the ground plane.

8 . The information handling system of claim 5 wherein the layer of graphene couples between the bio-based substrate and the power plane.

9 . The information handling system of claim 5 wherein the layer of graphene couples between the prepreg substrate and the power plane.

10 . A method for manufacture of an information handling system peripheral, the method comprising:
forming a printed circuit board to have at least one prepreg substrate, at least one bio-based substrate and at least one layer of graphene disposed between the prepreg substrate and the bio-based substrate; coupling the printed circuit board in the peripheral; and performing peripheral functions with electronic components coupled to the printed circuit board.

11 . The method of claim 10 further comprising:
forming a ground plane coupled to one side of the at least one prepreg substrate;
forming the at least one bio-based substrate to couple to the ground plane; and
disposing the layer of graphene between the prepreg substrate and the ground plane.

12 . The method of claim 10 further comprising:
forming a ground plane coupled to one side of the at least one prepreg substrate;
forming the at least one bio-based substrate to couple to the ground plane; and
disposing the layer of graphene between the bio-based substrate and the ground plane.

13 . The method of claim 10 further comprising:
forming a power plane coupled to one side of the at least one prepreg substrate;
forming the at least one bio-based substrate to couple to the power plane; and
disposing the layer of graphene between the prepreg substrate and the power plane.

14 . The method of claim 10 further comprising:
forming a power plane coupled to one side of the at least one prepreg substrate;
forming the at least one bio-based substrate to couple to the power plane; and
disposing the layer of graphene between the bio-based substrate and the power plane.

15 . The method of claim 10 further comprising:
coupling the printed circuit board into a keyboard peripheral; and
interfacing a keyboard membrane with a communication device of coupled to the bio-based substrate.

16 . The method of claim 10 further comprising:
coupling the printed circuit board into a mouse peripheral; and
coupling a position sensor to the bio-based substrate.

17 . A printed circuit board comprising:
at least one prepreg substrate; at least one bio-based substrate coupled to the prepreg substrate; at least one layer of graphene disposed between the prepreg substrate and the bio-based substrate; and at least one electronic component coupled to the bio-based substrate and interfacing through the bio-based substrate with the prepreg substrate.

18 . The printed circuit board of claim 17 further comprising:
a ground plane coupled to a first side of the at least one prepreg substrate;
a power plane coupled to a second side of the at least one prepreg substrate;
a first bio-base substrate coupled to the ground plane and supporting a first set of electronic components;
a second bio-based substrate coupled to the power plane and supporting a second set of electronic components;
a first layer of graphene between the prepreg layer and the power plane; and
a second layer of graphene between the ground plane and the first bio-based substrate.

19 . The printed circuit board of claim 17 wherein the bio-based substrate encapsulates the at least one prepreg substrate and the layer of graphene.

20 . The printed circuit board of claim 17 the first set of electronic components comprise a position sensor.

Assignees

• Dell Products Lp

Inventors

• Goh Peng Lip
• Aurongzeb Deeder M

Classifications

• H05K3/4688

  Composite multilayer circuits, i.e. comprising insulating layers having different properties (having a special base or central core H05K3/4602) · CPC title

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• H05K2201/0323

  Carbon · CPC title

• H05K2203/178

  Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials · CPC title

• H05K1/0353 Primary

  consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title