Method and apparatus for using radiation imaging data to analyze components
US-2024369500-A1 · Nov 7, 2024 · US
US2023109956A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2023109956-A1 |
| Application number | US-202218045423-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 10, 2022 |
| Priority date | Oct 11, 2021 |
| Publication date | Apr 13, 2023 |
| Grant date | — |
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Apparatus and method for assigning a material value score to a waste printed circuit board or a portion thereof and system for sorting waste printed circuit boards.
Opening claim text (preview).
1 . An apparatus for assigning a material value score to a waste printed circuit board or a portion thereof, configured to determine the material value score and perform the determination on the basis of a dual energy or spectral x-ray image of the waste printed circuit board or the portion thereof. 2 . The apparatus of claim 1 , configured to perform the determination by subjecting the dual energy or spectral x-ray image to a machine learning module. 3 . The apparatus of claim 2 , wherein the machine learning module is trained based on a set of data of annotated components, wherein the annotated components represent annotations of representative components of WPCBs. 4 . The apparatus of claim 1 , configured to detect in the dual energy or spectral x-ray image components of the waste printed circuit board. 5 . The apparatus of claim 4 , configured to deduce from the dual energy or spectral x-ray image a type, a weight and/or a size of the components. 6 . The apparatus of claim 5 , configured to determine for each component a component material value based on the type, weight and/or size associated with the respective component. 7 . The apparatus of claim 6 , configured to perform the determination of the material value score based on the component material values. 8 . The apparatus of claim 1 , configured to acquire the material value score by analysing simultaneously two opposite sides of the waste printed circuit board. 9 . The apparatus of claim 1 , wherein the material value score depends on a concentration of a predetermined material or concentrations of two or more predetermined materials to be recovered from the waste printed circuit board. 10 . A method for assigning a material value score to a waste printed circuit board or a portion thereof, wherein the method comprises determining the material value score and the determination is performed on the basis of a dual energy or spectral x-ray image of the waste printed circuit board or the portion thereof. 11 . The method of claim 10 , wherein the determination is performed by subjecting the dual energy or spectral x-ray image to a machine learning process. 12 . A system for sorting waste printed circuit boards, the system comprising an apparatus for assigning according to claim 1 and a sorting apparatus for distributing a plurality of waste printed circuit boards onto two or more classes of waste printed circuit boards according to the material value score assigned to each of the plurality of waste printed circuit boards by the apparatus for assigning. 13 . A method for sorting waste printed circuit boards, the method comprising a method for assigning according to claim 10 and distributing a plurality of waste printed circuit boards onto two or more classes of waste printed circuit boards according to the material value score assigned to each of the plurality of waste printed circuit boards by the method for assigning.
and forming images of the material · CPC title
Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title
Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials · CPC title
according to radiation transmissivity, e.g. for light, x-rays, particle radiation (detecting hidden objects G01V) · CPC title
Sorting of waste or refuse · CPC title
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