Solder recovery device

US2023225059A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023225059-A1
Application numberUS-202017996462-A
CountryUS
Kind codeA1
Filing dateApr 25, 2020
Priority dateApr 25, 2020
Publication dateJul 13, 2023
Grant date

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A solder recovery device includes a recovery plate, a lifting and lowering device, and multiple connecting sections. The recovery plate recovers solder. The lifting and lowering device lifts up and lowers the recovery plate. The multiple connecting sections include a fixing portion provided on the recovery plate and configured to detachably attach the recovery plate to the lifting and lowering device and a fixed portion provided on the lifting and lowering device and to which the fixing portion is fixed, and are configured to restrain the recovery plate from moving in a predetermined direction relative to the lifting and lowering device when the fixing portion is fixed to the fixed portion. The multiple connecting sections have different restraining directions in which the recovery plate is restrained from moving relative to the lifting and lowering device.

First claim

Opening claim text (preview).

1 . A solder recovery device comprising: a recovery plate configured to recover solder; a lifting and lowering device configured to lift up and lower the recovery plate; and multiple connecting sections comprising, in turn, a fixing portion provided on the recovery plate and configured to detachably attach the recovery plate to the lifting and lowering device and a fixed portion provided on the lifting and lowering device and to which the fixing portion is fixed, the multiple connecting sections being configured to restrain the recovery plate from moving in a predetermined direction relative to the lifting and lowering device when the fixing portion is fixed to the fixed portion, wherein the multiple connecting sections have different restraining directions in which the recovery plate is restrained from moving relative to the lifting and lowering device. 2 . The solder recovery device according to claim 1 , wherein a moving direction of a squeegee in which the squeegee moves the solder is referred to as first direction, a lifting and lowering direction in which the recovery plate is lifted up and lowered is referred to as second direction, and a direction which is orthogonal to the first direction and the second direction is referred to a third direction, wherein when a first fixing portion which is the fixing portion possessed by a first connecting section of the multiple connecting sections is fixed to a first fixed portion which is the fixed portion to which the first fixing portion is fixed, the recovery plate is restrained in at least one direction in the first direction, the second direction, and the third direction relative to the lifting and lowering device, and wherein when a second fixing portion which is the fixing portion possessed by a second connecting section of the multiple connecting sections is fixed to a second fixed portion which is the fixed portion to which the second fixing portion is fixed, the recovery plate is restrained from moving in remaining directions in the first direction, the second direction, and the third direction relative to the lifting and lowering device. 3 . The solder recovery device according to claim 2 , wherein the first fixing portion comprises a groove section formed into a U-shape which restrains the recovery plate from moving in the second direction while allowing the recovery plate to move in the first direction, and wherein the groove section is configured to fit on the first fixed portion to thereby restrain the recovery plate from moving in the second direction and the third direction. 4 . The solder recovery device according to claim 3 , wherein the second fixing portion fits on the second fixed portion via the first fixing portion to restrain further the recovery plate from moving in the first direction. 5 . The solder recovery device according to claim 4 , wherein the first fixing portion comprises: a rising edge portion extending upwards in the second direction from the recovery plate; a protruding portion protruding outwards of the recovery plate from a distal end portion of the rising edge portion; and a supporting portion configured to support the second fixing portion, wherein the groove section is formed in such a manner as to extend along the first direction in the rising edge portion, and wherein the second fixing portion is provided in such a manner as to penetrate the protruding portion and the supporting portion to move in the second direction. 6 . The solder recovery device according to claim 5 , wherein the second fixing portion comprises a restraining member configured to move in an inside portion of the supporting portion in association with a movement of the second fixing portion in the second direction, and wherein the second fixing portion is restrained from moving upwards in the second direction as a result of the restraining member arriving at a top portion of the supporting portion. 7 . The solder recovery device according to claim 6 , wherein the supporting portion comprises a holding member provided in, of a lower end position where the holding member faces the restraining member when the second fixing portion fits on the second fixed portion of the lower end position and an upper end position where the holding member faces the restraining member when the restraining member arrives at the top portion of the supporting portion, at least the lower end position so as to hold a facing state with the restraining member. 8 . The solder recovery device according to claim 7 , wherein the holding member is formed of a magnetic material, and wherein the restraining member is formed of a metallic material. 9 . The solder recovery device according to claim 3 , wherein the lifting and lowering device comprises: a main body section; and a lifting and lowering section configured to be lifted up and lowered relative to the main body section, wherein the first fixed portion and the second fixed portion are provided on the lifting and lowering section, wherein the first fixed portion comprises: a first shaft section extending from the lifting and lowering section along the third direction; and a first flange portion provided at an end portion of the first shaft section which lies opposite to an end portion thereof which faces the lifting and lowering section, and wherein the groove section in the first fixing portion fits on the first shaft section. 10 . The solder recovery device according to claim 9 , wherein the second fixed portion comprises: a second shaft section extending from the first flange portion of the first fixed portion coaxially with the first shaft section along the third direction; and a second flange portion provided at an end portion of the second shaft section which lies opposite to an end portion thereof which faces the first flange portion, and wherein the second fixing portion comprises a fitting portion configured to fit on the second shaft section. 11 . The solder recovery device according to claim 4 , wherein the second fixing portion is formed in an L-shape, and comprises: an extending portion extending along the second direction; and a gripping portion protruding outwards of the recovery plate from an upper end portion of the extending portion in such a manner that an operator can grip thereon. 12 . The solder recovery device according to claim 1 , wherein the multiple connecting sections are provided at each of both end portions of the recovery plate, and wherein the lifting and lowering device is provided at each of both the end portions of the recovery plate.

Assignees

Inventors

Classifications

  • for printing on polyhedral articles · CPC title

  • H05K3/1216Primary

    by screen printing or stencil printing · CPC title

  • comprising squeegees or doctors · CPC title

  • Screen printing machines for particular purposes · CPC title

  • Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking · CPC title

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Frequently asked questions

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What does patent US2023225059A1 cover?
A solder recovery device includes a recovery plate, a lifting and lowering device, and multiple connecting sections. The recovery plate recovers solder. The lifting and lowering device lifts up and lowers the recovery plate. The multiple connecting sections include a fixing portion provided on the recovery plate and configured to detachably attach the recovery plate to the lifting and lowering …
Who is the assignee on this patent?
Fuji Corp
What technology area does this patent fall under?
Primary CPC classification B41F15/0881. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Jul 13 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).