Fabrication of high-resolution graphene-based flexible electronics via polymer casting

Patent metadata

Field	Value
Publication number	US-11938708-B1
Application number	US-202217898745-A
Country	US
Kind code	B1
Filing date	Aug 30, 2022
Priority date	Aug 21, 2018
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

An economical, efficient, and effective formation of a high resolution pattern of conductive material on a variety of films by polymer casting. This allows, for example, quite small-scale patterns with sufficient resolution for such things as effective microelectronics without complex systems or steps and with substantial control over the characteristics of the film. A final end product that includes that high resolution functional pattern on any of a variety of substrates, including flexible, stretchable, porous, biodegradable, and/or biocompatible. This allows, for example, highly beneficial options in design of high resolution conductive patterns for a wide variety of applications.

First claim

The invention claimed is:

1. A method of fabrication of high resolution conductive patterns on polymeric substrates comprising:
a. forming a high resolution pattern with 3D features in a starting substrate;
b. forming an end product comprising a combination of a high-resolution conductive pattern based on the high resolution pattern on a polymeric substrate by:
(1) creating a high resolution pattern on the starting substrate filled with a conductive material, coating the patterned conductive material on the starting substrate with a polymeric solution, drying the polymeric solution in a manner effective to promote adherence of the patterned conductive material to the dried polymeric layer, and peeling the dried polymeric layer and adhered conductive material from the starting substrate to transfer the dried conductive material in the high resolution pattern from the starting substrate to the dried polymeric layer.

2. The method of claim 1 wherein the high-resolution pattern is made by a micropatterning technique with 3D channel features in the approximate ranges of 5 to 500 um in width and 5 to 300 um in depth.

3. The method of claim 1 wherein the combination of the high-resolution conductive pattern on the polymeric substrate is used in an application comprising one of:
a. microelectronics including but not limited to;
i. robotics;
ii. wearable biosensors;
iii. ICs;
iv. batteries;
v. displays;
vi. thin film transistors;
vii. RFID/NFC tools;
viii. pressure sensors;

b. micro environments for material-cell interface;
c. surgical implantation including but not limited to one of:
i. heart sensors/stimulators;
ii. brain-computer interfaces; or

d. microfluidic device uses.

4. The method of claim 1 wherein the conductive material on the starting substrate comprises:
a. forming a conductive solution of graphene nano-flakes in concentrations in the range of 20 to 100 mg/mL in 70% alcohol;
b. thermally annealing the conductive solution at ˜75 degrees C. or higher for more than three hours;
c. filling the annealed conductive solution on the Teflon, glass, or silicon-wafer based substrate with pattern; and
d. drying in place the filled annealed conductive solution on the patterned substrate.

5. The method of claim 1 wherein the coating with polymeric solution comprises:
a. casting by direct pouring or spin casting a polymer solution on the combined dried conductive material and patterned starting substrate; and
b. drying the polymer solution in place to a thin film effective to create an adhesion between conductive material and polymeric thin film that is stronger than any adhesion between conductive material and the starting substrate.

6. The method of claim 1 wherein the starting substrate comprises a polymer-based material including but not limited to polyimide or any other rigid substrate to which inkjet printing can be applied.

7. The method of claim 1 wherein the micropattern is inkjet printed onto the starting substrate.

8. The method of claim 1 wherein the polymeric layer comprises cellulose acetate.

9. The method of claim 1 wherein the peeling of the dried thin target polymer film comprises:
a. peeling the target polymer film effective to overcome any adhesive force between conductive material and the starting substrate; but
b. keeping intact the high resolution pattern of the conductive material and the thin polymer film to effectively transfer the high resolution pattern of conductive material from the starting substrate to the polymer film substrate.

10. A method of fabrication of high resolution conductive patterns on polymeric substrates comprising:
a. forming a high resolution pattern with 3D features in a starting substrate;
b. forming an end product comprising a combination of a high-resolution conductive pattern based on the high resolution pattern on a polymeric substrate by:
(1) creating a high resolution pattern on the starting substrate filled with a conductive material, coating the patterned conductive material on the starting substrate with a polymeric solution, drying the polymeric solution in a manner effective to promote adherence of the patterned conductive material to the dried polymeric layer, and peeling the dried polymeric layer and adhered conductive material from the starting substrate to transfer the dried conductive material in the high resolution pattern from the starting substrate to the dried polymeric layer;
(2) wherein the conductive material on the starting substrate comprises:
(i) forming a conductive solution of graphene nano-flakes in concentrations in the range of 20 to 100 mg/mL in 70% alcohol;
(ii) thermally annealing the conductive solution at ˜75 degrees C. or higher for more than three hours;
(iii) filling the annealed conductive solution on the Teflon, glass, or silicon-wafer based substrate with pattern; and
(iv) drying in place the filled annealed conductive solution on the patterned substrate.

11. A method of fabrication of high resolution conductive patterns on polymeric substrates comprising:
a. forming a high resolution pattern with 3D features in a starting substrate;
b. forming an end product comprising a combination of a high-resolution conductive pattern based on the high resolution pattern on a polymeric substrate by:
(1) creating a high resolution pattern on the starting substrate filled with a conductive material, coating the patterned conductive material on the starting substrate with a polymeric solution, drying the polymeric solution in a manner effective to promote adherence of the patterned conductive material to the dried polymeric layer, and peeling the dried polymeric layer and adhered conductive material from the starting substrate to transfer the dried conductive material in the high resolution pattern from the starting substrate to the dried polymeric layer;
(2) wherein the peeling of the dried thin target polymer film comprises:
(i) peeling the target polymer film effective to overcome any adhesive force between conductive material and the starting substrate; but
(ii) keeping intact the high resolution pattern of the conductive material and the thin polymer film to effectively transfer the high resolution pattern of conductive material from the starting substrate to the polymer film substrate.

Assignees

• Univ Iowa State Res Found Inc
• Lowa State Univ Research Foundation Inc

Inventors

• Uz Metin
• Mallapragada Surya

Classifications

• B32B37/025 Primary

  Transfer laminating · CPC title

• H05K1/0277

  Bendability or stretchability details (H05K1/038, H05K3/4691 take precedence) · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title

• H05K3/025

  by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper · CPC title

• H05K3/207 Primary

  using a prefabricated paste pattern, ink pattern or powder pattern · CPC title