Substrate, electric compressor, and air conditioner
US-10492303-B2 · Nov 26, 2019 · US
Organic non-polymeric compounds, e.g. oil, wax or thiol
Organic non-polymeric compounds, e.g. oil, wax or thiol · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2203/122 |
| Official title | Organic non-polymeric compounds, e.g. oil, wax or thiol |
| Display label | Organic non-polymeric compounds, e.g. oil, wax or thiol |
| Total patents | 93 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 17 |
| 2016 | 15 |
| 2017 | 14 |
| 2018 | 7 |
| 2019 | 10 |
| 2020 | 8 |
| 2021 | 7 |
| 2022 | 4 |
| 2023 | 3 |
| 2024 | 5 |
| 2025 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Releasable thermal gel
US-10428256-B2 · Oct 1, 2019 · US
Circuit device with monolayer bonding between surface structures
US-2019229082-A1 · Jul 25, 2019 · US
Encapsulation of downhole microelectronics
US-2019132959-A1 · May 2, 2019 · US
Substrate, electric compressor, and air conditioner
US-2019053384-A1 · Feb 14, 2019 · US
Composite member and method of manufacturing the same, and aliphatic polycarbonate-containing layer
US-2019041744-A1 · Feb 7, 2019 · US
Method for producing electroconductive laminate, laminate, and electroconductive laminate
US-2019010608-A1 · Jan 10, 2019 · US
Conductive paste comprising lubricating oils and semiconductor device
US-2018182506-A1 · Jun 28, 2018 · US
Curable composition, prepreg, metal foil with composition, metal-clad laminate and wiring board
US-2018170005-A1 · Jun 21, 2018 · US
Coating metal foil with n-heterocyclic carbene compounds containing organic functionalities for improving metal-to-resin adhesion
US-2018168051-A1 · Jun 14, 2018 · US
Coating metal foil with N-heterocyclic carbene compounds containing organic functionalities for improving metal-to-resin adhesion
US-9974193-B2 · May 15, 2018 · US
Built-in-electronic-component substrate and manufacturing method therefor
US-9961775-B2 · May 1, 2018 · US
Resin composition, copper-clad laminate using the same, and printed circuit board using the same
US-9926435-B2 · Mar 27, 2018 · US
Method for making a circuit board
US-9872393-B2 · Jan 16, 2018 · US
Local dense patch for board assembly utilizing laser structuring metallization process
US-9824962-B1 · Nov 21, 2017 · US
Semiconductor package substrate having an interfacial layer
US-9799593-B1 · Oct 24, 2017 · US
Method of treating gold or gold alloy with a surface treatment solution comprising a disulfide compound
US-9790606-B2 · Oct 17, 2017 · US
Semiconductor package substrate having an interfacial layer
US-2017287827-A1 · Oct 5, 2017 · US
Surface pretreatment and drop spreading control on multi component surfaces
US-9781829-B2 · Oct 3, 2017 · US
Resin composition, copper-clad laminate using the same, and printed circuit board using the same
US-2017260364-A1 · Sep 14, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2203/122?
- CPC H05K2203/122 is the Cooperative Patent Classification code for “Organic non-polymeric compounds, e.g. oil, wax or thiol.”
- How many patents are filed under CPC H05K2203/122 (Organic non-polymeric compounds, e.g. oil, wax or thiol)?
- Our database includes 93 publications tagged with this CPC code.
- Is patent activity under CPC H05K2203/122 growing?
- Publication counts under this code: 5 in 2024 vs 3 in 2025 (latest complete years).