Releasable thermal gel

Patent metadata

Field	Value
Publication number	US-10428256-B2
Application number	US-201816160478-A
Country	US
Kind code	B2
Filing date	Oct 15, 2018
Priority date	Oct 23, 2017
Publication date	Oct 1, 2019
Grant date	Oct 1, 2019

Abstract

The present disclosure provides a two component releasable thermal gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The two component releasable thermal gel is mixed before the point of application and facilitates catalytic cross-linking. The thermal gel includes a first component including a primary silicone oil, an inhibitor, a catalyst, and at least one thermally conductive filler, and a second component including a primary silicone oil, a cross linking silicone oil, and at least one thermally conductive filler, wherein the ratio of total content of Si—H groups to total content of vinyl groups in the thermal gel is between 0.03 to 10. The thermal gel is releasable from a substrate upon which the thermal gel is applied.

First claim

The invention claimed is:

1. A thermal gel comprising:
a first component including:
a primary silicone oil;
an inhibitor;
a catalyst; and
at least one thermal conductive filler;

a second component including:
a primary silicone oil;
a crosslinking silicone oil; and
at least one thermal conductive filler;

wherein the primary silicone oil of the first component is a vinyl silicone oil, the primary silicone oil of the second component is a vinyl silicone oil, and the crosslinking silicone oil of the second component is a hydrosilicone oil;
wherein the thermal gel is releasable from a substrate upon which the thermal gel is applied;
wherein the total content of the thermally conductive fillers in the thermal gel is between 75 wt. % and 95 wt. %; and
wherein the weight ratio between the first component and the second component is between 0.5:1 and 2:1.

2. The thermal gel of claim 1 , wherein the thermal gel cures in place at room temperature.

3. The thermal gel of claim 1 , wherein the at least one thermally conductive filler for the first component and the second component each have an average particle size between 5 microns and 80 microns.

4. The thermal gel of claim 1 , wherein the a ratio of a total content of Si—H groups of the crosslinking silicone oil to a total content of vinyl groups of the primary silicone oils is between 0.03 to 10.

5. The thermal gel of claim 1 , wherein the concentration of the catalyst in the thermal gel is greater than 100 ppm.

6. The thermal gel of claim 1 , wherein the primary silicone oil of the first component and the crosslinking silicone oil of the second component each have a kinematic viscosity greater than 1000 cSt.

7. The thermal gel of claim 1 , wherein the thermal gel cures at a temperature between room temperature and 100° C.

8. The thermal gel of claim 1 , wherein the viscosity of the first component is at least 100 Pa·s, and the viscosity of the second component is at least 100 Pa·s.

9. The thermal gel of claim 1 , wherein the conductivity of the thermal gel is at least 2 W/m.K.

10. A thermal gel comprising:
a first component including:
a primary silicone oil;
an inhibitor;
a catalyst; and
at least one thermal conductive filler;

a second component including:
a primary silicone oil;
a crosslinking silicone oil; and
at least one thermal conductive filler;

wherein the primary silicone oil of the first component is a vinyl silicone oil, the primary silicone oil of the second component is a vinyl silicone oil, and the crosslinking silicone oil of the second component is a hydrosilicone oil;
wherein the thermal gel is releasable from a substrate upon which the thermal gel is applied;
wherein the total content of the thermally conductive fillers in the thermal gel is between 75 wt. % and 95 wt. %; and
wherein the catalyst is a Pt based catalyst with at least 2000 ppm weight loading in first component.

11. The thermal gel of claim 10 , wherein a ratio of a total content of Si—H groups of the crosslinking silicone oil to a total content of vinyl groups of the primary silicone oils is between 0.03 to 10.

12. The thermal gel of claim 10 , wherein the thermal gel cures in place at room temperature.

13. The thermal gel of claim 10 , wherein the at least one thermally conductive filler for the first component and the second component each have an average particle size between 5 microns and 80 microns.

14. The thermal gel of claim 10 , wherein the primary silicone oil of the first component and the crosslinking silicone oil of the second component each have a kinematic viscosity greater than 1000 cSt.

15. The thermal gel of claim 10 , wherein the thermal gel cures at a temperature between room temperature and 100° C.

16. An electronic device comprising:
(I) at least two heat sources;
(II) a thermal conductive composite, cured from a thermal gel and applied onto the at least two heat sources, the thermal gel comprising:
a first component including:
a silicone oil;
an inhibitor;
a catalyst; and
at least one thermal conductive filler;

a second component including:
a first silicone oil;
a second silicone oil;
at least one thermal conductive filler;

wherein the silicone oil of the first component is a vinyl silicone oil, the first silicone oil of the second component is a vinyl silicone oil, and the second silicone oil of the second component is a hydrosilicone oil; and
(III) a heatsink or heat spreader applied onto the thermal conductive composite;
wherein the thermal gel is releasable from the at least two heat sources;
wherein the total content of the thermally conductive fillers in the thermal gel is between 75 wt. % and 95 wt. %; and
wherein the weight ratio between the first component and the second component is between 0.5:1 and 2:1.

17. The electronic device of claim 16 , wherein the ratio of total content of Si—H groups of the second silicone oil to total content of vinyl groups of the silicone oil of the first component and the first silicone oil of the second component in the thermal gel is between 0.03 to 10.

18. The electronic device of claim 16 , wherein the thermal conductive composite is cured at room temperature from the gel.

19. The electronic device of claim 16 , wherein the thermal conductive composite is cured at a temperature between room temperature and 100° C. from the gel.

20. The thermal gel of claim 16 , wherein the silicone oil of the first component and the first and second silicone oils of the second component each have a kinematic viscosity greater than 1000 cSt.

Assignees

• Honeywell Int Inc

Inventors

• Shen Ling
• Zhang Kai
• Zhang Liqiang
• Liu Ya Qun
• Duan Huifeng
• Kang Haigang

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/254

  Diamond · CPC title