Resin composition, copper-clad laminate using the same, and printed circuit board using the same

Patent metadata

Field	Value
Publication number	US-9926435-B2
Application number	US-201615067144-A
Country	US
Kind code	B2
Filing date	Mar 10, 2016
Priority date	Mar 10, 2016
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.

First claim

What is claimed is:

1. A resin composition comprising the following components:
(A) a specific phosphorus-containing salt, being expressed by formula (I) below:

wherein M n+ is a metal ion and n denotes an integer from 1 to 3; and

(B) a prepolymer of vinyl-containing polyphenylene ether, wherein the prepolymer of vinyl-containing polyphenylene ether is prepolymerized from vinyl-containing polyphenylene ether resin, maleimide, and a specific vinyl compound other than vinyl-containing polyphenylene ether resin and maleimide.

2. The resin composition of claim 1 , wherein M n+ is a metal ion selected from the group consisting of Al 3+ , Ca 2+ and Zn 2+ .

3. The resin composition of claim 1 , wherein the specific phosphorus-containing salt is expressed by formula (II) below:

4. The resin composition of claim 1 , wherein the vinyl-containing polyphenylene ether resin is a polyphenylene ether resin with at least one end group having an unsaturated double bond.

5. The resin composition of claim 1 , wherein the vinyl-containing polyphenylene ether resin is expressed by formula (III) below:

wherein
R 1 and R 2 represent hydrogen atom, R 3 , R 4 , R 5 , R 6 and R 7 are the same as or different from each other, each independently representing a hydrogen atom or an alkyl group;
—(O—X—O)— represents any one of formula (IV) or (V) expressed below:

wherein R 8 , R 9 , R 10 , R 11 , R 12 , R 13 , R 14 and R 15 are the same as or different from each other, each independently representing a hydrogen atom, an alkyl group with 6 or less carbon atoms or a phenyl group, R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , and R 23 are the same as or different from each other, each independently representing a halogen atom, an alkyl group with 6 or less carbon atoms or a phenyl group, and A represents a linear, branched or cyclic hydrocarbon with 20 or less carbon atoms;
—(Y—O)— represents formula (VI) expressed below:

wherein R 24 , R 25 , R 26 and R 27 are the same as or different from each other, each independently representing a hydrogen atom, an alkyl group with 6 or less carbon atoms or a phenyl group;

Z represents an organic group with at least one carbon atom; and
a and b independently represent an integer from 1 to 30, and c and d are 1.

6. The resin composition of claim 5 , wherein A represents —CH 2 — or —C(CH 3 ) 2 —.

7. The resin composition of claim 5 , wherein Z represents an alkyl group with 6 or less carbon atoms.

8. The resin composition of claim 5 , wherein Z is a methylene (—CH 2 —).

9. The resin composition of claim 1 , wherein the vinyl-containing polyphenylene ether resin is expressed by formula (VII) below:

wherein G is bisphenol A, bisphenol F or a covalent bond, and p and q independently represent an integer of 1 to 15.

10. The resin composition of claim 1 , wherein the vinyl-containing polyphenylene ether resin comprises at least one resin selected from the group consisting of methacrylate polyphenylene ether resin and vinylbenzyl polyphenylene ether resin.

11. The resin composition of claim 1 , wherein the specific vinyl compound comprises at least one selected from the group consisting of divinylbenzene (DVB), bis(vinylbenzyl) ether (BVBE), triallyl isocyanurate (TAIC), triallyl cyanurate (TAC), 1,2,4-Trivinylcyclohexane (TVCH), diallyl bisphenol A, styrene, brominated styrene, 2-Propenoic acid, 1,1′-[(octahydro-4,7-methano-1H-indene-5,6-diyl)bis(methylene)] ester, and polyolefin compound.

12. The resin composition of claim 11 , wherein the polyolefin compound comprises at least one selected from the group consisting of styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, vinyl-polybutadiene-urethane oligomer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, styrene-isoprene copolymer, hydrogenated styrene-isoprene copolymer, hydrogenated styrene-butadiene-divinylbenzene copolymer, butadiene-urethane-methyl methacrylate copolymer, polybutadiene, maleic anhydride styrene-butadiene copolymer, methyl styrene copolymer, petroleum resin, and cyclic olefin copolymer.

13. The resin composition of claim 1 , the maleimide is monofunctional maleimide, bifunctional maleimide or multifunctional maleimide.

14. The resin composition of claim 1 , the maleimide comprises at least one selected from the group consisting of 4,4′-diphenylmethane bismaleimide, oligomer of phenylmethane maleimide, m-phenylene bismaleimide, bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide, 4-methyl-1,3-phenylene bismaleimide and 1,6-bismaleimide-(2,2,4-trimethyl) hexane.

15. A resin film made from the resin composition of claim 1 .

16. A prepreg made from the resin composition of claim 1 .

17. A copper-clad laminate made from the prepreg of claim 16 .

18. A printed circuit board comprising the copper-clad laminate of claim 17 .

Assignees

• Elite Material Co Ltd

Inventors

• Hsieh Chen-Yu

Classifications

• H05K1/0353

  consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• C08K5/53 Primary

  bound to oxygen and to carbon only · CPC title

• C08J2371/00

  Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers · CPC title

• C08J5/18

  Manufacture of films or sheets · CPC title