Surface pretreatment and drop spreading control on multi component surfaces

Patent metadata

Field	Value
Publication number	US-9781829-B2
Application number	US-201414761380-A
Country	US
Kind code	B2
Filing date	Jan 21, 2014
Priority date	Jan 21, 2013
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

Methods, systems and produced printed substrates are provided, which include substrates composed of one or more materials which are treated by an intermediate layer for normalizing surface energies and a digitally printed formulation adapted to the normalized surface energies. Surface energy normalization may be carried out by physical processes or by selective chemical processes. In an example, a self-assembled monolayer is applied to the surface of a printed circuit board to control ink jet dots by reducing copper surface energy and to improve ink adhesion. The self-assembled monolayer binds via an α group selectively and covalently to the copper on the board and binds via a hydrophobic ω group to solder mask ink that is applied to the board. The ω group participates in the solidification process of the ink.

First claim

I claim:

1. A method comprising normalizing surface energies of a substrate composed of one or more materials and digitally printing a formulation adapted to the normalized surface energies; wherein the normalizing is carried out by a physical treatment of the substrate with an intermediate layer of molecules having a polar α group selected to physically attach to a surface of the substrate and a ω group selected to present a specified surface energy to the formulation.

2. The method of claim 1 , wherein the intermediate layer is a self-assembled monolayer.

3. A method comprising normalizing surface energies of a substrate composed of one or more materials and digitally printing a formulation adapted to the normalized surface energies; wherein the normalizing is carried out by a chemical treatment of the substrate with an intermediate layer of molecules having a polar α group selected to bind to at least one of the surface materials and ω group selected to present a specified surface energy to the formulation.

4. The method of claim 3 , wherein the ω group is selected to participate in a solidification process of the formulation.

5. The method of claim 3 , wherein the intermediate layer is a self-assembled monolayer.

6. The method of claim 3 , wherein the substrate is a printed circuit board (PCB) and the intermediate layer is a self-assembled monolayer comprising copper binding α groups.

7. The method of claim 6 , wherein the a group is a thiol, the ω group is selected from a double bond and an epoxide and the formulation is a solder mask.

8. The method of claim 6 , further comprising printing a solder mask ink onto the PCB and solidifying the ink.

9. The method of claim 3 , wherein the substrate is a wafer piece and the intermediate layer is a self-assembled monolayer comprising wafer binding α groups.

10. The method of claim 9 , wherein the α group is a trichlorosilane and the ω group is selected from a double bond and an epoxide.

11. The method of claim 9 , further comprising printing a formulation onto the wafer piece and solidifying the formulation.

12. A printed substrate comprising an intermediate layer selected to bridge between a substrate composed of one or more materials and a digitally printed formulation, wherein the intermediate layer is selected to normalize surface energies of the substrate and the formulation is adapted to the normalized surface energies; wherein the intermediate layer is physically attached to the substrate and comprises molecules having polar α groups selected to physically attach to a surface of the substrate and ω groups selected to present a specified surface energy to the formulation.

13. A printed substrate comprising an intermediate layer selected to bridge between a substrate composed of one or more materials and a digitally printed formulation, wherein the intermediate layer is selected to normalize surface energies of the substrate and the formulation is adapted to the normalized surface energies; wherein the intermediate layer is chemically bonded to at least one of the substrate materials by respective α groups and comprises ω groups selected to present a specified surface energy to the formulation.

14. The printed substrate of claim 13 , wherein the ω group is selected to participate in a solidification process of the formulation.

15. The printed substrate of claim 13 , wherein the substrate is a printed circuit board (PCB) and the intermediate layer is a self-assembled monolayer comprising copper binding α groups.

16. The printed substrate of claim 15 , wherein the α group is a thiol, the formulation is a solder mask and the ω group is selected from a double bond and an epoxide.

17. A system comprising: a treatment unit arranged to apply an intermediate layer to a substrate composed of one or more materials, the intermediate layer configured to normalize surface energies of the substrate; and a printing unit arranged to digitally print a formulation adapted to the normalized surface energies upon the treated substrate; wherein intermediate layer comprises polar α groups selected to physically or chemically attach to a surface of the substrate and ω groups selected to present a specified surface energy to the formulation.

Assignees

• Camtek Ltd
• Camtel Ltd

Inventors

• Nitzan Boaz

Classifications

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• H05K1/056 Primary

  the metal substrate being covered by an organic insulating layer · CPC title

• H01L21/306

  Electricity · mapped topic

• Y10T428/24802

  Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] · CPC title

• H05K3/38

  Improvement of the adhesion between the insulating substrate and the metal · CPC title