Built-in-electronic-component substrate and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-9961775-B2
Application number	US-201514928136-A
Country	US
Kind code	B2
Filing date	Oct 30, 2015
Priority date	Nov 5, 2014
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

A built-in-electronic-component substrate includes a core substrate, an electronic component mounted on one main surface of the core substrate via a joining member, and a resin layer including the electronic component embedded therein. The electronic component is a multilayer ceramic capacitor including a ceramic multilayer body, and a first outer electrode including an end surface portion and a second outer electrode including an end surface portion provided on end surfaces of the ceramic multilayer body. A first gap is provided between the resin layer and the end surface portion of the first outer electrode and the joining member and a second gap is provided between the resin layer and the end surface portion of the second outer electrode and the joining member.

First claim

What is claimed is:

1. A built-in-electronic-component substrate comprising:
a core substrate;
at least one electronic component mounted on one main surface of the core substrate via a joining member; and
a resin layer provided on the one main surface of the core substrate such that the at least one electronic component is embedded in the resin layer; wherein
the at least one electronic component is a multilayer capacitor including:
a multilayer body including an electrostatic capacitance exhibiting portion in which capacitor elements, in each of which a dielectric layer is interposed between a first inner electrode and a second inner electrode, are stacked, and a first protective portion and a second protective portion sandwiching therebetween the electrostatic capacitance exhibiting portion, and including two opposing end surfaces parallel or substantially parallel to a stacking direction of the capacitor elements and including side surfaces connecting the two end surfaces; and
a first outer electrode and a second outer electrode including end surface portions provided on the end surfaces of the multilayer body and respectively connected to the first inner electrodes and the second inner electrodes at the end surface portions; and

a first gap is provided between the resin layer and the end surface portion of the first outer electrode and the joining member on the end surface portion thereof;
a second gap is provided between the resin layer and the end surface portion of the second outer electrode and the joining member on the end surface portion thereof; and
a first insertion member having a lower elasticity than the resin layer is provided in the first gap and a second insertion member having a lower elasticity than the resin layer is provided in the second gap.

2. The built-in-electronic-component substrate according to claim 1 , wherein a third gap is provided between the resin layer and a portion of the multilayer body not covered by the first outer electrode and the second outer electrode.

3. A built-in-electronic-component substrate comprising:
a core substrate;
at least one electronic component mounted on one main surface of the core substrate via a joining member; and
a resin layer provided on the one main surface of the core substrate such that the at least one electronic component is embedded in the resin layer; wherein
the at least one electronic component is a multilayer capacitor including:
a multilayer body including an electrostatic capacitance exhibiting portion in which capacitor elements, in each of which a dielectric layer is interposed between a first inner electrode and a second inner electrode, are stacked, and a first protective portion and a second protective portion sandwiching therebetween the electrostatic capacitance exhibiting portion, and including two opposing end surfaces parallel or substantially parallel to a stacking direction of the capacitor elements and including side surfaces connecting the two end surfaces; and
a first outer electrode and a second outer electrode including end surface portions provided on the end surfaces of the multilayer body and respectively connected to the first inner electrodes and the second inner electrodes at the end surface portions; and

a first gap is provided between the resin layer and the end surface portion of the first outer electrode and the joining member on the end surface portion thereof;
a second gap is provided between the resin layer and the end surface portion of the second outer electrode and the joining member on the end surface portion thereof;
a third gap is provided between the resin layer and a portion of the multilayer body not covered by the first outer electrode and the second outer electrode; and
a third insertion member having a lower elasticity than the resin layer is provided in the third gap.

4. The built-in-electronic-component substrate according to claim 1 , wherein the first gap and the second gap have a same shape as each other.

5. The built-in-electronic-component substrate according to claim 1 , wherein the first gap and the second gap have non-symmetrical shapes.

6. The built-in-electronic-component substrate according to claim 1 , wherein the first protective portion and the second protective portion have a same thickness or substantially a same thickness.

7. The built-in-electronic-component substrate according to claim 1 , wherein a thickness of the first protective portion is larger than a thickness of the second protective portion.

8. The built-in-electronic-component substrate according to claim 2 , wherein the third gap surrounds side surfaces of the ceramic multilayer body in an annular manner.

9. The built-in-electronic-component substrate according to claim 2 , wherein the third gap is connected to the first gap and the second gap to define a single integrated gap.

10. The built-in-electronic-component substrate according to claim 1 , wherein the at least one electronic component includes a first electrode terminal attached to the first outer electrode by the joining member and a second electrode terminal attached to the second outer electrode by the joining member.

11. The built-in-electronic-component substrate according to claim 1 , further comprising an interposer including one main surface and another main surface that are substantially parallel or substantially parallel to each other, a first intermediary land and a second intermediary land provided on a first main surface and a third intermediary land and a fourth intermediary land are provided on a second main surface.

12. The built-in-electronic-component substrate according to claim 11 , wherein the first intermediary land and the second intermediary land of the interposer are respectively connected to the first outer electrode and the second outer electrode by the joining member.

13. The built-in-electronic-component substrate according to claim 11 , wherein the third intermediary land and the fourth intermediary land are respectively connected to a first mounting land and a second mounting land.

Assignees

• Murata Manufacturing Co

Inventors

• Takahashi Masaru
• Fujii Choichiro

Classifications

• H05K1/185 Primary

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H05K3/3442

  having edge contacts, e.g. leadless chip capacitors, chip carriers · CPC title

• Y02P70/611

  Cross-Sectional Technologies · mapped topic

• H05K1/0271

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title