Method for producing wiring circuit board
US-2024284600-A1 · Aug 22, 2024 · US
Etching temporary metallic carrier substrate
Etching temporary metallic carrier substrate · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2203/0376 |
| Official title | Etching temporary metallic carrier substrate |
| Display label | Etching temporary metallic carrier substrate |
| Total patents | 48 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 10 |
| 2016 | 10 |
| 2017 | 8 |
| 2018 | 7 |
| 2019 | 2 |
| 2020 | 4 |
| 2021 | 2 |
| 2022 | 3 |
| 2024 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for producing wiring circuit board
US-2024107667-A1 · Mar 28, 2024 · US
Wireless power supply wiring circuit board and battery module
US-2022295626-A1 · Sep 15, 2022 · US
Printed wiring board and method for manufacturing the same
US-11382218-B2 · Jul 5, 2022 · US
Fluororesin base material, printed wiring board, and circuit module
US-11364714-B2 · Jun 21, 2022 · US
Flexible wiring circuit board and imaging device
US-11122676-B2 · Sep 14, 2021 · US
Manufacturing method for printed circuit board
US-10893613-B2 · Jan 12, 2021 · US
Carrier substrate
US-10820426-B2 · Oct 27, 2020 · US
Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
US-10791631-B2 · Sep 29, 2020 · US
Flexible wiring circuit board and imaging device
US-2020154016-A1 · May 14, 2020 · US
Circuit board and method for manufacturing the same
US-10561017-B1 · Feb 11, 2020 · US
Printed wiring board and method for manufacturing the same
US-2019373742-A1 · Dec 5, 2019 · US
Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
US-10251283-B2 · Apr 2, 2019 · US
Method of manufacturing a wiring substrate
US-10117336-B2 · Oct 30, 2018 · US
Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device
US-2018160546-A1 · Jun 7, 2018 · US
Manufacturing method for printed circuit board
US-2018153043-A1 · May 31, 2018 · US
Circuit board structure
US-2018077799-A1 · Mar 15, 2018 · US
Printed circuit board and method for manufacturing the same
US-9907164-B2 · Feb 27, 2018 · US
Printed circuit board and method of manufacturing the same
US-9894764-B2 · Feb 13, 2018 · US
Circuit board structure and manufacturing method thereof
US-9860984-B2 · Jan 2, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2203/0376?
- CPC H05K2203/0376 is the Cooperative Patent Classification code for “Etching temporary metallic carrier substrate.”
- How many patents are filed under CPC H05K2203/0376 (Etching temporary metallic carrier substrate)?
- Our database includes 48 publications tagged with this CPC code.
- Is patent activity under CPC H05K2203/0376 growing?
- Publication counts under this code: 3 in 2022 vs 2 in 2024 (latest complete years).