Manufacturing method for printed circuit board

Patent metadata

Field	Value
Publication number	US-10893613-B2
Application number	US-201715825511-A
Country	US
Kind code	B2
Filing date	Nov 29, 2017
Priority date	Nov 29, 2016
Publication date	Jan 12, 2021
Grant date	Jan 12, 2021

Abstract

A manufacturing method for a printed circuit board includes: transferring roughness of a metal film to an insulating layer by laminating the metal film on the insulating layer, the metal film having the roughness formed on one surface thereof and having a discrete metal layer laminated thereon; exposing a surface of the insulating layer, on which the roughness is transferred, by removing the metal film; processing the surface of the insulating layer having the roughness formed thereon with an acidic solution; and forming a circuit pattern on the insulating layer by a plating process.

First claim

What is claimed is:

1. A manufacturing method for a printed circuit board, comprising:
laminating a metal film on an insulating layer, the metal film comprising a first metal layer comprising one or more jagged surface having a roughness formed by peaks between valleys, and a second metal layer comprising a first surface in contact with the first metal layer and a second surface in contact with a surface of the insulating layer;
pressing the metal film toward the insulating layer such that the roughness is transferred to the surface of the insulating layer;
removing the first metal layer such that the first surface of the second metal layer is exposed; and
treating the first surface of the second metal layer with an acidic solution such that at least a portion of the second metal layer is removed from the surface of the insulating layer.

2. The manufacturing method of claim 1 , further comprising, after treating the first surface of the insulating second metal layer, forming a circuit pattern on the insulating layer by a plating process.

3. The manufacturing method of claim 1 , wherein the treating the first surface of the second metal layer comprises partially removing the second metal layer from the surface of the insulating layer.

4. The manufacturing method of claim 3 , wherein the second metal layer comprises any one or combination of nickel and chrome.

5. The manufacturing method of claim 3 , wherein the treating the first surface of the second metal layer comprises maintaining 4.0 to 10.0 at % (atomic concentration) of the second metal layer on the surface of the insulating layer.

6. The manufacturing method of claim 1 , wherein the insulating layer comprises a polymer chain, and
wherein the treating the first surface of the second metal layer comprises hydrolyzing the polymer chain of the insulating layer.

7. The manufacturing method of claim 6 , wherein the polymer chain comprises an epoxy group, and
wherein the treating the first surface of the second metal layer comprises a polar group formed by hydrolyzing the epoxy group of the insulating layer.

8. The manufacturing method of claim 1 , wherein the treating the first surface of the second metal layer comprises coating sulfuric acid on the insulating first surface of the second metal layer.

9. The manufacturing method of claim 1 , wherein the treating the first surface of the second metal layer comprises soaking the second metal layer in the sulfuric acid.

10. The manufacturing method of claim 1 , further comprising, prior to removing the first metal layer:
forming a via hole in the insulating layer; and
desmearing the via hole.

11. The manufacturing method of claim 10 , wherein the treating the first surface of the second metal layer comprises neutralizing, the desmearing of the via hole using a neutralizer.

12. A manufacturing method for a printed circuit board, comprising:
laminating a metal film on an insulating layer, the metal film comprising a first metal layer comprising one or more jagged surface having a roughness formed by peaks between valleys, and a second metal layer comprising a first surface in contact with the first metal layer and a second surface in contact with the insulating layer;
pressing the metal film toward the insulating layer such that the roughness is transferred to the surface of the insulating layer;
removing the first metal layer such that the first surface of the second metal layer is exposed; and
treating the first surface of the second metal layer with an acidic solution such that at least a portion of the second metal layer is removed,
wherein the second surface of the second metal layer is in contact with an entire surface of the insulating layer after the treating.

13. A manufacturing method for a printed circuit board, comprising:
laminating a metal film on an insulating layer, the metal film comprising a first metal layer comprising one or more jagged surface having a roughness formed by peaks between valleys, and a second metal layer comprising a first surface in contact with the first metal layer and a second surface in contact with a surface of the insulating layer;
pressing the metal film toward the insulating layer such that the roughness is transferred to the surface of the insulating layer;
removing the first metal layer such that the first surface of the second metal layer is exposed; and
coating the first surface of the second metal layer with an acidic solution such that the second metal layer with a uniform thickness is continuously disposed on the insulating layer.

Assignees

• Samsung Electro Mech

Inventors

• Kim Jong-Guk
• Lee Chul-Min
• Park Sung-Jun
• Shin Dong-Chul
• Lee Chang-Jae
• Kim Seon-Hye
• Hwang Joong-Mo
• Park Sim-Hwan
• Chong Myung-Gun
• Jung Tae-Wook

Classifications

• H05K3/381 Primary

  by special treatment of the substrate · CPC title

• H05K3/18

  using precipitation techniques to apply the conductive material · CPC title

• H05K3/0055

  After-treatment, e.g. cleaning or desmearing of holes · CPC title

• H05K3/0017

  Etching of the substrate by chemical or physical means · CPC title

• H05K2203/075

  Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles · CPC title