Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device

Patent metadata

Field	Value
Publication number	US-2018160546-A1
Application number	US-201715825259-A
Country	US
Kind code	A1
Filing date	Nov 29, 2017
Priority date	Dec 6, 2016
Publication date	Jun 7, 2018
Grant date	—

Abstract

Disclosed is a surface treated copper foil in which the dropping of the roughening particles from the roughening treatment layer provided on the surface of the copper foil is favorably suppressed.
Also disclosed is a surface treated copper foil, comprising a copper foil, a roughening treatment layer on one surface, and/or another roughening treatment layer the other surface of the copper foil, wherein a height of roughening particles of the roughening treatment layer is 5 to 1000 nm from the surface, a color difference ΔE*ab according to JIS Z 8730 of a surface of a side of the roughening treatment layer is 65 or less, and a glossiness of the TD of the surface of the side of the roughening treatment layer is 70% or less.

First claim

1 . A surface treated copper foil, comprising
a copper foil, and a roughening treatment layer on at least one surface of the copper foil, wherein a height of roughening particles of the roughening treatment layer is 5 to 1000 nm from the surface of the copper foil, a color difference ΔE*ab according to JIS Z 8730 of a surface of a side of the roughening treatment layer is 65 or less, and a glossiness of a TD of the surface of the side of the roughening treatment layer is 70% or less.

2 . The surface treated copper foil according to claim 1 , wherein the height of the roughening particles of the roughening treatment layer is 20 nm or more from the surface of the copper foil.

3 . The surface treated copper foil according to claim 1 , wherein the height of the roughening particles of the roughening treatment layer is 150 nm or more from the surface of the copper foil.

4 . The surface treated copper foil according to claim 1 , wherein the height of the roughening particles of the roughening treatment layer is 650 nm or less from the surface of the copper foil.

5 . The surface treated copper foil according to claim 1 , wherein the height of the roughening particles of the roughening treatment layer is 150 nm or less from the surface of the copper foil.

6 . The surface treated copper foil according to claim 1 , wherein a thickness of the roughening particles of the roughening treatment layer is 5 to 500 nm.

7 . The surface treated copper foil according to claim 1 , wherein the thickness of the roughening particles of the roughening treatment layer is 10 nm or more.

8 . The surface treated copper foil according to claim 1 , wherein the thickness of the roughening particles of the roughening treatment layer is 250 nm or less.

9 . The surface treated copper foil according to claim 1 , wherein the glossiness of the TD of the surface of the side of the roughening treatment layer is 65% or less.

10 . The surface treated copper foil according to claim 1 , wherein the glossiness of the TD of the surface of the side of the roughening treatment layer is 10% or less.

11 . The surface treated copper foil according to claim 1 , wherein the glossiness of the TD of the surface of the side of the roughening treatment layer is 5% or less.

12 . The surface treated copper foil according to claim 1 , wherein the color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 42 or more.

13 . The surface treated copper foil according to claim 1 , wherein the color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 45 or more.

14 . The surface treated copper foil according to claim 1 , wherein the color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 49.1 or more.

15 . The surface treated copper foil according to claim 1 , wherein the color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 50 or less.

16 . The surface treated copper foil according to claim 1 , wherein
the height of roughening particles of the roughening treatment layer is 500 to 1000 nm from the surface of the copper foil, the thickness of the roughening particles of the roughening treatment layer is 10 to 250 nm, the color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 49.1 to 65, and the glossiness of the TD of the surface of the side of the roughening treatment layer is 5% or less.

17 . The surface treated copper foil according to claim 1 , wherein
the height of roughening particles of the roughening treatment layer is 20 to 400 nm from the surface of the copper foil, the thickness of the roughening particles of the roughening treatment layer is 10 to 250 nm, the color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 49.1 to 65, and the glossiness of the TD of the surface of the side of the roughening treatment layer is 65% or less.

18 . The surface treated copper foil according to claim 1 , wherein the copper foil has the roughening treatment layer on both surfaces of the copper foil.

19 . The surface treated copper foil according to claim 1 comprising, on the surface of the roughening treated layer, one or more layers selected from the group consisting of a heat resistant layer, a rust preventive layer, a chromate treatment layer and a silane coupling treatment layer.

20 . The surface treated copper foil according to claim 1 , wherein the surface treated copper foil is for heat dissipation.

21 . A surface treated copper foil with resin layer, comprising the surface treated copper foil according to claim 1 , and a resin layer on the surface of the side of the roughening treatment layer.

22 . A copper foil with carrier, comprising
a carrier, an intermediate layer, and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil according to claim 1 .

23 . The copper foil with carrier, comprising
a carrier, an intermediate layer, and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil with resin layer according to claim 21 .

24 . A laminate, comprising the surface treated copper foil according to claim 1 .

25 . A laminate, comprising the copper foil with carrier according to claim 22 .

26 . A method for manufacturing a printed wiring board, using
the surface treated copper foil according to claim 1 , or a copper foil with carrier, comprising a carrier, an intermediate layer, and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil according to claim 1 .

27 . A method for manufacturing a printed wiring board, comprising
a step of preparing the surface treated copper foil according to claim 1 , or a copper foil with carrier, comprising a carrier, an intermediate layer, and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil according to claim 1 , and an insulating substrate; a step of forming a copper clad laminate comprising any one of the following (1) or (2): (1) a step of laminating the surface treated copper foil and the insulating substrate, (2) a step of laminating the copper foil with carrier and the insulating substrate, and then peeling off the carrier of the copper foil with carrier; and a step of forming a circuit by a semi-additive method, a subtractive method, a partly additive method or a modified semi-additive method using the copper clad laminate.

28 . A method for manufacturing a printed wiring board, comprising
a step of forming a circuit on the surface of the side of the roughening treatment layer of the surface treated copper foil according to claim 1 , or on a surface of a side of an ultra-thin copper layer, or a surface of a side of a carrier of a copper foil with carrier, comprising a carrier, an intermediate layer and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil according to claim 1 ; a step of forming a resin layer on the surface of the side of the roughening treatment layer of the surfaced treated copper foil, or on the surface of the side of the ultra-thin

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Ori Yuki
• Arai Hideta
• Miki Atsushi
• Fukuchi Ryo

Classifications

• H05K2203/0376

  Etching temporary metallic carrier substrate · CPC title

• H05K2203/0392

  Pretreatment of metal, e.g. before finish plating, etching · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K2203/072

  Electroless plating, e.g. finish plating or initial plating · CPC title

• H05K3/4661

  Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K3/387) · CPC title