Electronic module and apparatus
US-2023225054-A1 · Jul 13, 2023 · US
Leadless chip carrier [LCC], e.g. chip-modules for cards
Leadless chip carrier [LCC], e.g. chip-modules for cards · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2201/10727 |
| Official title | Leadless chip carrier [LCC], e.g. chip-modules for cards |
| Display label | Leadless chip carrier [LCC], e.g. chip-modules for cards |
| Total patents | 81 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 10 |
| 2017 | 10 |
| 2018 | 8 |
| 2019 | 8 |
| 2020 | 4 |
| 2021 | 7 |
| 2022 | 4 |
| 2023 | 9 |
| 2024 | 6 |
| 2025 | 7 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Package, method for forming a package, chip card, and method for forming a chip card
US-2023187328-A1 · Jun 15, 2023 · US
Sealed interface power module housing
US-2023053718-A1 · Feb 23, 2023 · US
Transparent package for use with printed circuit boards
US-2022377888-A1 · Nov 24, 2022 · US
Nitride-based semiconductor module and method for manufacturing the same
US-2022359454-A1 · Nov 10, 2022 · US
Semiconductor package with stress reduction design and method for forming the same
US-2022361338-A1 · Nov 10, 2022 · US
Circuit board
US-11224123-B2 · Jan 11, 2022 · US
Semiconductor device and production method thereof
US-2021335700-A1 · Oct 28, 2021 · US
Device comprising a chip package and an overlap-free coil layout
US-2021328483-A1 · Oct 21, 2021 · US
Integrated circuit, circuit board with integrated circuit, and display device using the same
US-11114372-B2 · Sep 7, 2021 · US
Circuit Board
US-2021227686-A1 · Jul 22, 2021 · US
Connection Arrangement, Component Carrier and Method of Forming a Component Carrier Structure
US-2021074662-A1 · Mar 11, 2021 · US
Removing unwanted flux from an integrated circuit package
US-10939559-B2 · Mar 2, 2021 · US
Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device
US-10926360-B2 · Feb 23, 2021 · US
Conformal coating blockage by surface-mount technology solder features
US-2020315030-A1 · Oct 1, 2020 · US
Embedding a component in a core on conductive foil
US-10743422-B2 · Aug 11, 2020 · US
Removing unwanted flux from an integrated circuit package
US-2020236793-A1 · Jul 23, 2020 · US
Integrated circuit, circuit board with integrated circuit, and display device using the same
US-2020006216-A1 · Jan 2, 2020 · US
Computer modules with small thicknesses and associated methods of manufacturing
US-10522515-B2 · Dec 31, 2019 · US
Removing unwanted flux from an integrated circuit package
US-10512167-B2 · Dec 17, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2201/10727?
- CPC H05K2201/10727 is the Cooperative Patent Classification code for “Leadless chip carrier [LCC], e.g. chip-modules for cards.”
- How many patents are filed under CPC H05K2201/10727 (Leadless chip carrier [LCC], e.g. chip-modules for cards)?
- Our database includes 81 publications tagged with this CPC code.
- Is patent activity under CPC H05K2201/10727 growing?
- Publication counts under this code: 6 in 2024 vs 7 in 2025 (latest complete years).