Package, method for forming a package, chip card, and method for forming a chip card

Patent metadata

Field	Value
Publication number	US-2023187328-A1
Application number	US-202218062164-A
Country	US
Kind code	A1
Filing date	Dec 6, 2022
Priority date	Dec 10, 2021
Publication date	Jun 15, 2023
Grant date	—

Abstract

A package including an electronic leadless module having a top side, a bottom side and side faces between the top side and the bottom side, the electronic leadless module having an electronic circuit, a plurality of electrical contact pads at the bottom side of the electronic leadless module which are electrically conductively coupled to the electronic circuit, and encapsulation material which partially encapsulates the electronic circuit, wherein the electrical contact pads are at least partially free from encapsulation material and the electronic leadless module have an anchoring region on at least one side face. The package may also include a carrier frame which carries the electronic leadless module, with the side face extending further in the direction of the carrier frame below the anchoring region than in the anchoring region, and filler material in the anchoring region for fastening the electronic leadless module to the carrier frame.

First claim

1 . A package, comprising:
an electronic leadless module having a top side, a bottom side and side faces between the top side and the bottom side, the electronic leadless module comprising:
an electronic circuit;
a plurality of electrical contact pads at the bottom side of the electronic leadless module which are electrically conductively coupled to the electronic circuit; and
an encapsulation material which partially encapsulates the electronic circuit, the electrical contact pads being at least partially free from encapsulation material;
wherein the electronic leadless module has an anchoring region on at least one side face; a carrier frame which carries the electronic leadless module; wherein the side face extends further in a direction of the carrier frame below the anchoring region than in the anchoring region; and filler material in the anchoring region for fastening the electronic leadless module to the carrier frame.

2 . The package of claim 1 ,
wherein the anchoring region is formed as a cutout or as an upper section of an inclined side face.

3 . The package of claim 1 ,
wherein the anchoring region is open in a direction of the top side of the electronic leadless module.

4 . The package of claim 1 ,
wherein the anchoring region extends along an entire side face.

5 . The package of claim 1 ,
wherein the at least one side face has a plurality of side faces, each with one anchoring region.

6 . The package of claim 1 ,
wherein the electronic leadless module has an anchoring region on each side face.

7 . The package of claim 1 ,
wherein the side face extends linearly, with a plurality of linear sections, curvedly, in a form of a circular segment, or with a combination of these profiles, in a direction from the top side to the bottom side in the anchoring region.

8 . The package of claim 1 ,
wherein the carrier frame has an opening for receiving the electronic leadless module.

9 . The package of claim 8 ,
wherein the electronic leadless module is interlockingly fastened in the opening of the carrier frame.

10 . The package of claim 1 ,
wherein the filler material completely fills the anchoring region.

11 . The package of claim 1 ,
wherein the bottom side of the electronic leadless module is formed as a land grid array, as a ball grid array, or as a quad-flat no-leads package.

12 . The package of claim 1 ,
wherein the electronic leadless module is configured as a sensor module.

13 . A chip card, comprising:
a chip card body with a receiving opening; and the package of claim 1 , the package having been received in the receiving opening.

14 . A method for forming a package, the method comprising:
forming an electronic leadless module having a top side, a bottom side and side faces between the top side and the bottom side, an electronic circuit, a plurality of electrical contact pads at the bottom side of the electronic leadless module which are electrically conductively coupled to the electronic circuit, and encapsulation material which partially encapsulates the electronic circuit, wherein the electrical contact pads are at least partially free from encapsulation material; forming an anchoring region on at least one side face of the electronic leadless module; arranging the electronic leadless module in an opening in a carrier frame, with a side face extending further in a direction of the carrier frame below the anchoring region than in the anchoring region; and arranging filler material in the anchoring region in order to fasten the electronic leadless module to the carrier frame.

15 . The method of claim 14 ,
wherein the anchoring region is formed as a cutout and in a multi-module grouping.

16 . The method of claim 14 ,
wherein the anchoring region is formed while the electronic leadless modules are singulated from a multi-module grouping.

17 . The method of claim 15 ,
wherein the forming of the anchoring region includes sawing to form the anchoring region and sawing with a thinner saw blade or breaking to separate the multi-module grouping below and/or above the cutout.

18 . The method of claim 14 ,
wherein the anchoring region is formed after the electronic leadless modules have been singulated from a multi-module grouping.

19 . The method of claim 14 ,
wherein the forming includes at least one method from a group of methods consisting of: sawing; grinding; laser processing; and etching.

20 . A method for forming a chip card, the method comprising:
providing a chip card body with a receiving opening; and arranging the package of claim 1 in the receiving opening.

Assignees

• Infineon Technologies Ag

Inventors

• Pohl Jens
• Püschner Frank

Classifications

• H05K2201/10727

  Leadless chip carrier [LCC], e.g. chip-modules for cards · CPC title

• G06K19/07722 Primary

  the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title

• H05K2201/09381

  Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component · CPC title

• G06V40/13

  Sensors therefor · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title