Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over a Temporary Substrate
US-2018006008-A1 · Jan 4, 2018 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2924/141 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 223 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 12 |
| 2016 | 19 |
| 2017 | 28 |
| 2018 | 36 |
| 2019 | 27 |
| 2020 | 23 |
| 2021 | 20 |
| 2022 | 12 |
| 2023 | 21 |
| 2024 | 11 |
| 2025 | 12 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Redistribution layer (rdl) fan-out wafer level packaging (fowlp) structure
US-2017373032-A1 · Dec 28, 2017 · US
Wafer-level chip-scale package including power semiconductor and manufacturing method thereof
US-2017358510-A1 · Dec 14, 2017 · US
Semiconductor device and method of forming build-up interconnect structures over a temporary substrate
US-9818734-B2 · Nov 14, 2017 · US
Semiconductor package
US-9806053-B2 · Oct 31, 2017 · US
Board level shields with virtual grounding capability
US-2017311438-A1 · Oct 26, 2017 · US
POWER MODULE SUBSTRATE WITH Ag UNDERLAYER AND POWER MODULE
US-2017294399-A1 · Oct 12, 2017 · US
Encapsulated semiconductor device package with heatsink opening, and methods of manufacture thereof
US-9787254-B2 · Oct 10, 2017 · US
Semiconductor device and method of forming PoP semiconductor device with RDL over top package
US-9786623-B2 · Oct 10, 2017 · US
Coaxial through via with novel high isolation cross coupling method for 3d integrated circuits
US-2017278806-A1 · Sep 28, 2017 · US
Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof
US-9774301-B1 · Sep 26, 2017 · US
Chip package and method for forming the same
US-9761510-B2 · Sep 12, 2017 · US
Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs)
US-9754923-B1 · Sep 5, 2017 · US
Electronic device
US-9748194-B2 · Aug 29, 2017 · US
Chip packages and methods of manufacture thereof
US-9735130-B2 · Aug 15, 2017 · US
Electrostatic discharge protection for a balun
US-9735145-B2 · Aug 15, 2017 · US
Interconnect structures for wafer level package and methods of forming same
US-9659896-B2 · May 23, 2017 · US
Electronic device
US-2017141066-A1 · May 18, 2017 · US
Intramodule radio frequency isolation
US-9646936-B2 · May 9, 2017 · US
Matrix lid heatspreader for flip chip package
US-9640469-B2 · May 2, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2924/141?
- CPC H01L2924/141 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2924/141 (Electricity)?
- Our database includes 223 publications tagged with this CPC code.
- Is patent activity under CPC H01L2924/141 growing?
- Publication counts under this code: 11 in 2024 vs 12 in 2025 (latest complete years).