Electrostatic discharge protection for a balun

Patent metadata

Field	Value
Publication number	US-9735145-B2
Application number	US-201514625453-A
Country	US
Kind code	B2
Filing date	Feb 18, 2015
Priority date	Feb 18, 2015
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

A die is mounted in an integrated circuit package. The die includes a balun circuit and an electrostatic discharge (ESD) circuit coupled to a ground of the integrated circuit die. The package has a first output pin coupled to a first terminal of the balun and has a second output pin coupled to a second terminal of the balun through first and second bond wires. The second output pin is connected to board ground. A third bond wire is disposed between the second package terminal and the ESD circuit to provide a safe discharge path through the third bond wire for ESD events affecting the first and second output terminals. Thus, a charge that builds up involving one of the output terminals coupled to the balun can be safely dissipated.

First claim

What is claimed is:

1. An apparatus comprising:
a balun circuit including an input coil and an output coil disposed on an integrated circuit die;
a first bond wire coupled to a first terminal of the balun circuit through a first die pad and coupled to a first output terminal of an integrated circuit package housing the integrated circuit die;
a second bond wire coupled to a second terminal of the balun circuit through a second die pad and coupled to a second output terminal on the integrated circuit package, the second output terminal for coupling to a first ground, the first ground being a board ground of a printed circuit board on which the integrated circuit package is mounted; and
a third bond wire coupled to the second output terminal and to an electrostatic discharge (ESD) circuit on the integrated circuit die through a third die pad, wherein the ESD circuit is coupled to a second ground, the second ground being an integrated circuit ground on the integrated circuit die; and
wherein voltage swings on the first and second bond wires are approximately an order of magnitude greater than a voltage swing at the third die pad.

2. The apparatus as recited in claim 1 further comprising a microcontroller disposed on the integrated circuit die.

3. The apparatus as recited in claim 1 wherein the integrated circuit die further comprises a power amplifier circuit coupled to supply an amplified signal to the balun circuit.

4. The apparatus as recited in claim 1 wherein the ESD circuit comprises a diode.

5. The apparatus as recited in claim 1 , wherein the balun circuit comprises an input coil and an output coil disposed in the integrated circuit die.

6. The apparatus as recited in claim 1 further comprising the printed circuit board on which the integrated circuit package containing the integrated circuit die is mounted.

7. A method of providing electrostatic discharge protection for a package terminal of an integrated circuit package and for a die mounted in the integrated circuit package, the method comprising:
coupling a first terminal of a balun circuit through a bond wire to the package terminal and through the package terminal to a ground of a printed circuit board on which the integrated circuit package is mounted; and
responsive to a voltage being above a predetermined threshold at the package terminal, providing a low impedance path from the package terminal to an integrated circuit ground on the die through a second bond wire coupled to the package terminal and coupled through a die pad of the die to an electrostatic discharge (ESD) circuit disposed between the second bond wire and the integrated circuit ground, a voltage on the die pad being approximately an order of magnitude less than the predetermined threshold when the low impedance path is provided.

8. The method as recited in claim 7 further comprising:
responsive to the voltage being below a second predetermined threshold at the package terminal of the integrated circuit package, providing a low impedance path from the package terminal to the integrated circuit ground.

9. The method as recited in claim 7 wherein providing the low impedance path comprises turning on a diode circuit in the ESD circuit responsive to the voltage at the package terminal of an integrated circuit package being above the predetermined threshold to thereby provide the low impedance path.

10. The method as recited in claim 7 , wherein the balun circuit is disposed in the die.

11. The method as recited in claim 9 further supplying the balun circuit with an amplified signal from a power amplifier.

12. The method as recited in claim 7 further comprising during normal operation the voltage at the package terminal is below the predetermined threshold.

13. An apparatus comprising:
a printed circuit board having a first ground;
an integrated circuit package mounted on the printed circuit board;
a die mounted in the integrated circuit package, the die including,
a balun circuit including an input coil and an output coil;
electrostatic discharge (ESD) circuit coupled to a ground of the die;

a first bond wire disposed between a first terminal of the balun circuit and a first package terminal of the integrated circuit package;
a second bond wire disposed between a second terminal of the balun circuit and a second package terminal on the integrated circuit package, the second package terminal coupled to the first ground of the printed circuit board;
a third bond wire disposed between the second package terminal and the ESD circuit;
a first output die pad coupled between the first terminal of the balun circuit and the first bond wire;
a second output die pad coupled between the second terminal of the balun circuit and the second bond wire;
a third output die pad coupled between the third bond wire and the ESD circuit; and
wherein voltage swings on the first and second bond wires are approximately an order of magnitude greater than a voltage swing at the third output die pad.

14. The apparatus as recited in claim 13 further comprising a microcontroller disposed on the die.

15. The apparatus as recited in claim 13 wherein the die further comprises a power amplifier coupled to supply an amplified signal to the balun circuit.

16. The apparatus as recited in claim 13 wherein the ESD circuit comprises one or more diodes.

17. The apparatus as recited in claim 13 wherein the ESD circuit comprises a snap back transistor.

Assignees

• Silicon Lab Inc

Inventors

• Dupuis Timothy J
• Kummaraguntla Ravi K

Classifications

• H10W90/758

  between a chip and a stacked discrete passive device · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W44/248

  for antennas · CPC title

• H10W72/075

  of bond wires · CPC title

• H10W72/50

  Bond wires · CPC title