Intramodule radio frequency isolation

Patent metadata

Field	Value
Publication number	US-9646936-B2
Application number	US-201514937842-A
Country	US
Kind code	B2
Filing date	Nov 10, 2015
Priority date	Sep 28, 2012
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

A radio frequency (RF) module comprises RF-shielding structure for providing three-dimensional electromagnetic interference shielding with respect to one or more RF devices disposed on the module. The RF-shielding may comprise wirebond structures disposed adjacent to or surrounding an RF device. Two or more intramodule devices may have wirebond structures configured to at least partially block certain types of RF signals disposed between the devices, thereby reducing effects of cross-talk between the devices.

First claim

What is claimed is:

1. A radio frequency module, comprising:
a packaging substrate configured to receive a plurality of components;
first and second radio frequency devices implemented on the packaging substrate;
a conductive ground layer disposed at least partially below the first radio frequency device;
a first plurality of wirebond structures implemented on the packaging substrate between the first radio frequency device and the second radio frequency device; and
a conductive top layer at least partially disposed above the first radio frequency device and in electrical contact with one or more of the first plurality of wirebond structures such that the conductive ground layer, the one or more of the first plurality of wirebond structures, and the conductive top layer at least partially form a radio frequency barrier between the first radio frequency device and the second radio frequency device.

2. The radio frequency module of claim 1 wherein a first portion of the first plurality of wirebond structures forms a first row between the first and second radio frequency devices.

3. The radio frequency module of claim 2 wherein a second portion of the first plurality of wirebond structures forms a second row, substantially parallel to the first row.

4. The radio frequency module of claim 1 further comprising a third radio frequency device implemented on the packaging substrate.

5. The radio frequency module of claim 4 wherein the first and second radio frequency devices are each electrically connected to the third radio frequency device.

6. The radio frequency module of claim 5 wherein the first radio frequency device includes a first switching device, the second radio frequency device includes a second switching device, and the third radio frequency device includes an amplifier device.

7. The radio frequency module of claim 4 further comprising a second plurality of wirebond structures disposed on the surface of the substrate between the first radio frequency device and the third radio frequency device, the second plurality of wirebond structures at least partially forming a radio frequency barrier between the first and third radio frequency devices.

8. The radio frequency module of claim 7 further comprising a third plurality of wirebond structures disposed on the surface of the substrate between the second radio frequency device and the third radio frequency device, the third plurality of wirebond structures at least partially forming a radio frequency barrier between the second and third radio frequency devices.

9. The radio frequency module of claim 7 wherein at least some of the first plurality of wirebond structures forms a first row between the first and second radio frequency devices, and at least some of the second plurality of wirebond structures forms a second row between the first and third radio frequency devices, the second row being disposed at a substantially right angle with respect to the first row.

10. A radio frequency device comprising:
a transceiver;
first and second antennas; and
a power amplifier module in communication with the transceiver, the power amplifier module including a first switching device electrically coupled to the first antenna, a second switching device electrically coupled to the second antenna, a conductive ground layer disposed at least partially below the first switching device, a first plurality of wirebond structures disposed between the first and second switching devices, and a conductive top layer disposed at least partially above the first switching device and in electrical contact with one or more of the first plurality of wirebond structures such that the conductive ground layer, the one or more of the first plurality of wirebond structures, and the conductive top layer at least partially form a radio frequency barrier between the first switching device and the second switching device.

11. The radio frequency device of claim 10 wherein the first plurality of wirebond structures includes a first row of wirebond structures between the first and second radio frequency devices.

12. The radio frequency device of claim 11 wherein the first plurality of wirebond structures includes a second row of wirebond structures between the first and second radio frequency devices, the second row being substantially parallel to the first row.

13. The radio frequency device of claim 10 further comprising an amplifier device electrically connected to the first and second switching devices.

14. The radio frequency device of claim 13 further comprising a second plurality of wirebond structures implemented on the packaging substrate between the first switching device and the amplifier device, the second plurality of wirebond structures at least partially forming a radio frequency barrier between the first switching device and amplifier devices.

15. The radio frequency device of claim 14 further comprising a third plurality of wirebond structures implemented on the packaging substrate between the second switching device and the amplifier device, the third plurality of wirebond structures at least partially forming a radio frequency barrier between the second switching device and the amplifier device.

16. The radio frequency device of claim 14 wherein at least some of the first plurality of wirebond structures form a first row between the first and second switching devices, and at least some of the second plurality of wirebond structures form a second row between the first switching device and the amplifier device, the second row being disposed at a substantially right angle with respect to the first row.

17. A conductive shielding structure comprising:
a conductive ground layer disposed at least partially below a first radio frequency device;
a conductive top layer disposed at least partially above the first radio frequency device; and
a first plurality of wirebond structures electrically connected between the conductive ground layer and the conductive top layer, the conductive ground layer, the conductive top layer, and the first plurality of wirebond structures at least partially forming a radio frequency barrier between the first radio frequency device and a second radio frequency device.

18. The conductive shielding structure of claim 17 wherein a first portion of the first plurality of wirebond structures forms a first row between the first and second radio frequency devices and a second portion of the first plurality of wirebond structures forms a second row between the first and second radio frequency devices.

19. The conductive shielding structure of claim 17 further comprising a second plurality of wirebond structures, the second plurality of wirebond structures at least partially forming a radio frequency barrier between the first radio frequency device and a third radio frequency device.

20. The conductive shielding structure of claim 19 further comprising a third plurality of wirebond structures, the third plurality of wirebond structures at least partially forming a radio frequency barrier between the second radio frequency device and the third radio frequency device.

Assignees

• Skyworks Solutions Inc

Inventors

• Chen Howard E
• Read Matthew Sean
• Lobianco Anthony James
• Nguyen Hoang Mong
• Zhang Guohao
• Hoang Dinhphuoc Vu

Classifications

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W42/273

  the arrangements being between laterally adjacent chips, e.g. walls between chips · CPC title

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title