Solid-state imaging device, package, and imaging system
US-2024323556-A1 · Sep 26, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/38 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 367 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 23 |
| 2016 | 22 |
| 2017 | 27 |
| 2018 | 30 |
| 2019 | 27 |
| 2020 | 30 |
| 2021 | 27 |
| 2022 | 32 |
| 2023 | 42 |
| 2024 | 45 |
| 2025 | 53 |
| 2026 | 9 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor structure and method of manufacturing a semiconductor structure
US-12029123-B2 · Jul 2, 2024 · US
Nested heating system
US-2024167737-A1 · May 23, 2024 · US
Imaging and Sensing of Thin Layer Using High-Frequency Ultrasonic Transducers
US-2024036005-A1 · Feb 1, 2024 · US
Thermoelectric cooling using through-silicon vias
US-2017324015-A1 · Nov 9, 2017 · US
Integrated circuits with thermal isolation and temperature regulation
US-9761543-B1 · Sep 12, 2017 · US
Package-on-package (PoP) device comprising bi-directional thermal electric cooler
US-9746889-B2 · Aug 29, 2017 · US
Structure and method for cooling three-dimensional integrated circuits
US-9748228-B2 · Aug 29, 2017 · US
Semiconductor device
US-9728487-B2 · Aug 8, 2017 · US
Cooling system for 3d ic
US-2017221862-A1 · Aug 3, 2017 · US
Multi mode thermal management system and methods
US-9677793-B2 · Jun 13, 2017 · US
Organic thermoelectric composites and their uses
US-2017148970-A1 · May 25, 2017 · US
Heat dissipating component, manufacturing method for heat dissipating component, electronic device, manufacturing method for electronic device, integrated module, and information processing system
US-2017110386-A1 · Apr 20, 2017 · US
Image capture apparatus
US-9628731-B2 · Apr 18, 2017 · US
Integrated circuit and method for fabricating an integrated circuit equipped with a temperature probe
US-9543287-B2 · Jan 10, 2017 · US
Cooling structure for photoelectric conversion element
US-2016365461-A1 · Dec 15, 2016 · US
Transistor, heat sink structure thereof and method for manufacturing same
US-9520338-B2 · Dec 13, 2016 · US
Apparatus, system, and method for on-chip thermoelectricity generation
US-9515245-B2 · Dec 6, 2016 · US
Vertically integrated systems
US-9513246-B2 · Dec 6, 2016 · US
Semiconductor device comprising a stacked die configuration including an integrated peltier element
US-9490189-B2 · Nov 8, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/38?
- CPC H01L23/38 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/38 (Electricity)?
- Our database includes 367 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/38 growing?
- Publication counts under this code: 45 in 2024 vs 53 in 2025 (latest complete years).