Package-on-package (PoP) device comprising bi-directional thermal electric cooler

Patent metadata

Field	Value
Publication number	US-9746889-B2
Application number	US-201514709276-A
Country	US
Kind code	B2
Filing date	May 11, 2015
Priority date	May 11, 2015
Publication date	Aug 29, 2017
Grant date	Aug 29, 2017

Abstract

A package-on-package (PoP) device includes a first package, a second package, and a bi-directional thermal electric cooler (TEC). The first package includes a first substrate and a first die coupled to the first substrate. The second package is coupled to the first package. The second package includes a second substrate and a second die coupled to the second substrate. The TEC is located between the first die and the second substrate. The TEC is adapted to dynamically dissipate heat back and forth between the first package and the second package. The TEC is adapted to dissipate heat from the first die to the second die in a first time period. The TEC is further adapted to dissipate heat from the second die to the first die in a second time period. The TEC is adapted to dissipate heat from the first die to the second die through the second substrate.

First claim

What is claimed is:

1. A package on package (PoP) device comprising:
a first package comprising:
a first substrate; and
a first die coupled to the first substrate;

a second package coupled to the first package, the second package comprising:
a second substrate; and
a second die coupled to the second substrate; and

a bi-directional thermal electric cooler (TEC) located between the first die and the second substrate, the bi-directional TEC being adapted to dynamically dissipate heat back and forth between the first package and the second package, wherein the bi-directional thermal electric cooler (TEC) is configured to:
dissipate heat away from the first die when (i) a first temperature reading of the first die, is equal or greater than a first maximum temperature for the first die, and (ii) a second temperature reading of the second die, is less than a second maximum temperature for the second die; and
dissipate heat away from the second die when (i) the second temperature reading is equal or greater than the second maximum temperature, and (ii) the first temperature reading is less than the first maximum temperature.

2. The PoP device of claim 1 , wherein the bi-directional TEC is adapted to dissipate heat away from the first die and towards the second die, in a first time period.

3. The PoP device of claim 2 , wherein the bi-directional TEC is further adapted to dissipate heat away from the second die and towards the first die, in a second time period.

4. The PoP device of claim 2 , wherein the bi-directional TEC is adapted to dissipate heat away from the first die and towards the second die through the second substrate.

5. The PoP device of claim 1 , wherein the bi-directional TEC is coupled to the first die through a first thermally conductive adhesive.

6. The PoP device of claim 1 , wherein the bi-directional TEC is an array of a plurality of thermal electric coolers (TECs).

7. The PoP device of claim 1 , wherein the bi-directional TEC is electrically coupled to a TEC controller through a plurality of interconnects that includes interconnects in the first die.

8. The PoP device of claim 1 , wherein the bi-directional TEC is electrically coupled to a TEC controller through a plurality of interconnects that includes interconnects in the first encapsulation layer.

9. The PoP device of claim 1 , wherein the bi-directional TEC is electrically coupled to a TEC controller through a plurality of interconnects that includes interconnects in the second substrate.

10. The PoP device of claim 1 , wherein the first die is a first logic die and the second die is one of at least a second logic die or a memory die.

11. The PoP device of claim 1 , wherein the first package further comprises a third die coupled to the first substrate, wherein the bi-directional TEC is further adapted to dynamically dissipate heat back and forth between the first die and the third die.

12. The PoP device of claim 1 , wherein the first package further comprises a third die coupled to the first substrate, wherein the PoP device further comprises a second bi-directional TEC, wherein the combination of the bi-directional TEC and the second bi-directional TEC is adapted to dynamically dissipate heat back and forth between the first die and the third die.

13. The PoP device of claim 1 , wherein the PoP device is incorporated into a device selected from a group comprising of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, and a device in an automotive vehicle, and further including the device.

14. A package on package (PoP) device comprising:
a first package comprising:
a first substrate; and
a first die coupled to the first substrate;

a second package coupled to the first package, the second package comprising:
a second substrate; and
a second die coupled to the second substrate; and

a bi-directional heat transfer means located between the first die and the second substrate, the bi-directional heat transfer means being configured to dynamically dissipate heat back and forth between the first package and the second package, wherein the bi-directional heat transfer means is configured to:
dissipate heat away from the first die when (i) a first temperature reading of the first die, is equal or greater than a first maximum temperature for the first die, and (ii) a second temperature reading of the second die, is less than a second maximum temperature for the second die; and
dissipate heat away from the second die when (i) the second temperature reading is equal or greater than the second maximum temperature, and (ii) the first temperature reading is less than the first maximum temperature.

15. The PoP device of claim 14 , wherein the bi-directional heat transfer means is configured to dissipate away heat from the first die and towards the second die in a first time period.

16. The PoP device of claim 15 , wherein the bi-directional heat transfer means is further configured to dissipate heat away from the second die and towards the first die, in a second time period.

17. The PoP device of claim 15 , wherein the bi-directional heat transfer means is configured to dissipate heat away from the first die and towards the second die through the second substrate.

18. The PoP device of claim 14 , wherein the bi-directional heat transfer means is an array of a plurality of thermal electric coolers (TECs).

19. The PoP device of claim 15 , wherein the PoP device is incorporated into a device selected from a group comprising of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, and a device in an automotive vehicle, and further including the device.

20. A method for thermal management of a package on package (POP) device, comprising:
receiving a first temperature reading of a first die;
receiving a second temperature reading of a second die;
determining whether the first temperature reading of the first die is equal or greater than a first maximum temperature for the first die;
determining whether the second temperature reading of the second die is equal or greater than a second maximum temperature for the second die;
configuring a bi-directional thermal electric cooler (TEC) to dissipate heat away from the first die when (i) the first temperature reading is equal or greater than the first maximum temperature, and (ii) the second temperature reading is less than the second maximum temperature; and
configuring the bi-directional thermal electric cooler (TEC) to dissipate heat away from the second die when (i) the second temperature reading is equal or greater than the second maximum temperature, and (ii) the first temperature reading is less than the first maximum temperature.

21. The method of claim 20 , wherein configuring the bi-directional TEC to dissipate heat away from the first die comprises configuring a TEC controller to send a first signal to the bi-directional TEC, wherein the first signal has a first polarity.

22. The method of claim 21 , wherein configuring the bi-directional TEC to dissipate heat away from the second die comprise

Assignees

• Qualcomm Inc

Inventors

• Mittal Rajat
• Park Hee Jun
• Wang Peng
• Saeidi Mehdi
• Mittal Arpit

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title