Vertically integrated systems

Patent metadata

Field	Value
Publication number	US-9513246-B2
Application number	US-201514966920-A
Country	US
Kind code	B2
Filing date	Dec 11, 2015
Priority date	Dec 22, 2010
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

First claim

We claim:

1. An integrated circuit system comprising:
an active layer of a semiconductor die, the active layer comprising an active circuit;
a measuring layer vertically integrated with the semiconductor die, the measuring layer comprising a sensor configured to generate an indication of a pH of a fluid, and the measuring layer configured to provide the indication of the pH of the fluid to the active circuit;
a fluid path configured to provide the fluid from external to the integrated circuit system to the sensor; and
a signal transmission layer comprising a coil configured to transmit a signal indicative of the pH of the fluid from the integrated circuit system.

2. The integrated circuit system of claim 1 , wherein the signal indicative of the pH of the fluid is an alarm signal indicative of whether the pH of the fluid satisfies a threshold.

3. The integrated circuit system of claim 1 , wherein the integrated circuit system is configured to continuously monitor the pH of the fluid.

4. The integrated circuit system of claim 1 , wherein fluid path is configured to allow the fluid to pass through the integrated circuit system from an input port to an output port.

5. The integrated circuit system of claim 1 , wherein the measuring layer comprises a microelectromechanical systems (MEMS) component.

6. The integrated circuit system of claim 1 , further comprising an inductor configured to receive a remote signal, wherein at least a portion of the integrated circuit system is configured to be activated in response to the remote signal.

7. The integrated circuit system of claim 1 , wherein the active circuit and the measuring layer are disposed on opposing sides of the semiconductor die.

8. The integrated circuit system of claim 1 , wherein the integrated circuit system is modifiable after assembly.

9. The integrated circuit system of claim 8 , further comprising a component layer that comprises passive components and modifiable links that are modifiable after assembly of the integrated circuit system.

10. The integrated circuit system of claim 1 , further comprising a conductive path extending through the semiconductor die and providing an electrical connection between the measuring layer and the active circuit.

11. The integrated circuit system of claim 1 , wherein the fluid path comprises a conduit having a profile that is tapered.

12. An integrated circuit system comprising:
an active layer of a semiconductor die, the active layer comprising an active circuit;
a measuring layer integrated with the semiconductor die, the measuring layer comprising a sensor configured to generate an indication of a pH of a fluid, and the measuring layer configured to provide the indication of the pH of the fluid to the active circuit;
an opening configured to provide the fluid from external to the integrated circuit system to the sensor; and
a signal transmission layer configured to transmit a signal indicative of the pH of the fluid from the integrated circuit system, wherein the signal transmission layer is stacked vertically with the measuring layer and the semiconductor die.

13. The integrated circuit system of claim 12 , wherein the signal transmission layer comprises at least one inductor coil configured to transmit the signal indicative of the pH of the fluid.

14. The integrated circuit system of claim 12 , wherein the signal indicative of the pH of the fluid is an alarm signal and the signal transmission layer is configured to transmit the alarm signal responsive to the pH of the fluid satisfying a threshold.

15. The integrated circuit system of claim 12 , wherein the opening is arranged to provide a desired flow rate for monitoring the pH of the fluid.

16. An integrated circuit system comprising:
an active layer of a semiconductor die, the active layer comprising an active circuit;
a measuring layer vertically integrated with the semiconductor die, the measuring layer comprising a sensor configured to generate a signal indicative of a pH of a fluid;
a conduit configured to provide the fluid from external to the integrated circuit system to the sensor; and
a conductive path configured to provide an electrical connection between the measuring layer and the active circuit of the semiconductor die.

17. The integrated circuit system of claim 16 , wherein the measuring layer and the active layer are on opposing sides of the semiconductor die.

18. The integrated circuit system of claim 16 , wherein the integrated circuit system is configured to continuously monitor the pH of the fluid.

19. The integrated circuit system of claim 16 , wherein the measuring layer is configured to perform at least one of filtering the fluid or separating the fluid.

20. The integrated circuit system of claim 16 , further comprising a component layer that comprises passive components and modifiable links that are modifiable after assembly of the integrated circuit system.

Assignees

• Analog Devices Inc

Inventors

• O'Donnell Alan J
• Iriarte Santiago
• Murphy Mark J
• Lyden Colin G
• Casey Gary
• English Eoin Edward

Classifications

• H10W90/758

  between a chip and a stacked discrete passive device · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/293

  characterised by non-galvanic coupling between the chips, e.g. capacitive coupling · CPC title

• H10W72/942

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title

• H10W72/941

  Dispositions of bond pads · CPC title