Semiconductor package
US-2018301443-A1 · Oct 18, 2018 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/18 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 244 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 15 |
| 2017 | 33 |
| 2018 | 23 |
| 2019 | 29 |
| 2020 | 31 |
| 2021 | 19 |
| 2022 | 22 |
| 2023 | 18 |
| 2024 | 20 |
| 2025 | 23 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Chip package and method for forming the same
US-9997473-B2 · Jun 12, 2018 · US
‘RDL-First’ packaged microelectronic device for a package-on-package device
US-9911718-B2 · Mar 6, 2018 · US
Microelectronic device housing
US-2018037454-A1 · Feb 8, 2018 · US
Semiconductor device and manufacturing method thereof
US-2017352613-A1 · Dec 7, 2017 · US
Semiconductor package structure and method of manufacturing the same
US-9831195-B1 · Nov 28, 2017 · US
Semiconductor package with barrier for radio frequency absorber
US-2017330812-A1 · Nov 16, 2017 · US
Semiconductor device
US-2017330810-A1 · Nov 16, 2017 · US
Composite magnetic sealing material
US-9818518-B2 · Nov 14, 2017 · US
Microelectronics package with inductive element and magnetically enhanced mold compound component
US-2017323860-A1 · Nov 9, 2017 · US
3D packages and methods for forming the same
US-9793187-B2 · Oct 17, 2017 · US
Composite magnetic sealing material
US-2017287604-A1 · Oct 5, 2017 · US
Semiconductor device
US-2017278771-A1 · Sep 28, 2017 · US
Interposer, semiconductor package with the same and method for preparing a semiconductor package with the same
US-9761535-B1 · Sep 12, 2017 · US
Method of mounting electronic device and under-fill film used thereto
US-9754804-B2 · Sep 5, 2017 · US
Semiconductor package assembly, semiconductor package and forming method thereof
US-9748156-B1 · Aug 29, 2017 · US
Collision sensor device for a medical apparatus, and medical apparatus
US-9737270-B2 · Aug 22, 2017 · US
Chip package and method for forming the same
US-2017207182-A1 · Jul 20, 2017 · US
Power semiconductor module
US-9704768-B2 · Jul 11, 2017 · US
Electronic device with redistribution layer and stiffeners and related methods
US-9698105-B2 · Jul 4, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/18?
- CPC H01L23/18 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/18 (Electricity)?
- Our database includes 244 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/18 growing?
- Publication counts under this code: 20 in 2024 vs 23 in 2025 (latest complete years).