Method of mounting electronic device and under-fill film used thereto

Patent metadata

Field	Value
Publication number	US-9754804-B2
Application number	US-201615164228-A
Country	US
Kind code	B2
Filing date	May 25, 2016
Priority date	Dec 1, 2015
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

A method of mounting an electronic device includes: preparing a printed circuit board including a base substrate, connection pads disposed on the base substrate and spaced apart from each other, and a solder resist including contact holes exposing a portion of the connection pads; disposing preliminary bumps on the exposed portion of the connection pads via the contact holes; disposing under-fill patterns in areas between the preliminary bumps on the solder resist; disposing an electronic device on the preliminary bumps and the under-fill patterns; and mounting the electronic device onto the printed circuit board by reflowing the preliminary bumps and the under-fill patterns. The disposing of the under-fill patterns may include: providing an under-fill film including a base film having openings spaced apart from each other, and the under-fill patterns disposed within the openings; applying pressure to the under-fill film; and removing the base film from the under-fill film.

First claim

What is claimed is:

1. An under-fill film, comprising:
a base film having a plurality of openings spaced apart from each other; and
a plurality of under-fill patterns disposed within the plurality of openings,
wherein each of the under-fill patterns includes:
a body part disposed in a center of an opening; and
a plurality of connection parts extended from sides of the body part and connected to the base film.

2. The under-fill film of claim 1 , wherein the plurality of connection parts have a shape with a decreasing width as being extended from the body part to the base film.

3. The under-fill film of claim 2 , wherein a cross-section of an opening is parallel to a surface of the base film and has one of a circular shape and a rhombus shape.

4. The under-fill film of claim 3 , wherein when the opening has a rhombus shape, the connection parts are connected to four apexes of the rhombus shape.

5. The under-fill film of claim 3 , wherein when the opening has a circular shape, the connection parts are connected to four points on a circular arc, and a line connecting two opposite points on the circular arc is orthogonal to a line connecting the other two remaining points on the circular arc.

Assignees

• Samsung Display Co Ltd

Inventors

• Go Jeong Hun
• Na Yeon Sun
• Nam Jeong Mo
• Hong Hyun Seok

Classifications

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W76/42

  Fillings · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/012

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title

• H10W72/071

  Connecting or disconnecting · CPC title