Integrated RF subsystem
US-9842814-B1 · Dec 12, 2017 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/08 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 285 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 10 |
| 2016 | 29 |
| 2017 | 34 |
| 2018 | 36 |
| 2019 | 41 |
| 2020 | 29 |
| 2021 | 29 |
| 2022 | 22 |
| 2023 | 15 |
| 2024 | 15 |
| 2025 | 21 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Tamper-proof electronic packages with stressed glass component substrate(s)
US-2017330844-A1 · Nov 16, 2017 · US
Lens cap for a transistor outline package
US-2017294390-A1 · Oct 12, 2017 · US
Chip scale package and related methods
US-9754983-B1 · Sep 5, 2017 · US
Fingerprint identification module and manufacturing method thereof
US-2017243046-A1 · Aug 24, 2017 · US
Method of manufacturing an electronic component
US-9735340-B2 · Aug 15, 2017 · US
Molded composite enclosure for integrated circuit assembly
US-2017170085-A1 · Jun 15, 2017 · US
Semiconductor package system and related methods
US-2017170084-A1 · Jun 15, 2017 · US
Semiconductor package system and related methods
US-2017170083-A1 · Jun 15, 2017 · US
Semiconductor module
US-9673117-B2 · Jun 6, 2017 · US
Flexible packages including chips
US-2017154869-A1 · Jun 1, 2017 · US
Semiconductor package with barrier for radio frequency absorber
US-9666538-B1 · May 30, 2017 · US
Method for Producing a Power Semiconductor Module
US-2017148644-A1 · May 25, 2017 · US
Method of Manufacturing a Cooler for Semiconductor Modules
US-2017140946-A1 · May 18, 2017 · US
Semiconductor device
US-9640454-B2 · May 2, 2017 · US
Carrier and a method for processing a carrier
US-9613878-B2 · Apr 4, 2017 · US
Molded composite enclosure for integrated circuit assembly
US-9607914-B2 · Mar 28, 2017 · US
Low power, temperature regulated circuit for precision integrated circuits
US-9607913-B1 · Mar 28, 2017 · US
Semi-hermetic semiconductor package
US-2017062297-A1 · Mar 2, 2017 · US
Power amplifier module package and packaging method thereof
US-2017040182-A1 · Feb 9, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/08?
- CPC H01L23/08 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/08 (Electricity)?
- Our database includes 285 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/08 growing?
- Publication counts under this code: 15 in 2024 vs 21 in 2025 (latest complete years).