Semiconductor module

Patent metadata

Field	Value
Publication number	US-9673117-B2
Application number	US-201614990423-A
Country	US
Kind code	B2
Filing date	Jan 7, 2016
Priority date	Jan 17, 2014
Publication date	Jun 6, 2017
Grant date	Jun 6, 2017

Abstract

A semiconductor module includes a plurality of insulating circuit boards including semiconductor chips, each of the plurality of insulating circuit boards including a first outer edge among outer edges of the insulating circuit board facing an adjacent insulating circuit board of the plurality of insulating circuit boards, and a second outer edge among the outer edges excluding the first outer edge; a resin frame body having a crosspiece abutting against the first outer edges, and a frame element abutting against the second outer edges; a conductive component striding over the crosspiece to electrically connect the insulating circuit boards to each other; and an upper lid having a lid element covering an opening disposed at an upper part of the resin frame body and a partition protruding from a face of the lid element facing the insulating circuit boards to abut against a part of the crosspiece.

First claim

What is claimed is:

1. A semiconductor module comprising:
a plurality of insulating circuit boards including semiconductor chips, each of the plurality of insulating circuit boards including a first outer edge among outer edges of the insulating circuit board facing an adjacent insulating circuit board of the plurality of insulating circuit boards, and a second outer edge among the outer edges of the insulating circuit board excluding the first outer edge;
a resin frame body having a crosspiece abutting against the first outer edges of the plurality of insulating circuit boards, and a frame element abutting against the second outer edges of the plurality of insulating circuit boards;
a conductive component striding over the crosspiece to electrically connect the insulating circuit boards to each other; and
an upper lid having a lid element covering an opening disposed at an upper part of the resin frame body, and a partition protruding from a face of the lid element facing the insulating circuit boards and abutting against a part of the crosspiece.

2. The semiconductor module according to claim 1 , wherein the upper lid further includes a columnar part protruding from the face of the lid element facing the insulating circuit boards and abutting against the insulating circuit board.

3. The semiconductor module according to claim 1 , wherein the resin frame body further includes
a stepped section disposed along an inside wall of the resin frame body, and
a metal terminal having a leg disposed on an upper face of the stepped section, a shaft, and a hinge portion bent to couple the shaft to the leg and having a width narrower than that of the shaft or the leg.

4. The semiconductor module according to claim 3 , wherein the metal terminal is embedded in the frame element of the resin frame body in a state in which a part of the shaft and a part of the leg are exposed.

5. A method for manufacturing a semiconductor module, comprising:
preparing the semiconductor module comprising a plurality of insulating circuit boards including semiconductor chips, each of the plurality of insulating circuit boards including a first outer edge among outer edges of the insulating circuit board facing an adjacent insulating circuit board of the plurality of insulating circuit boards, and a second outer edge among the outer edges of the insulating circuit board excluding the first outer edge; a resin frame body having a crosspiece to abut against the first outer edges of the insulating circuit boards, and a frame element to abut against the second outer edges of the insulating circuit boards; a conductive component to stride over the crosspiece to electrically connect the insulating circuit boards; and an upper lid having a lid element to cover an opening disposed at an upper part of the resin frame body and a partition protruding from a face of the lid element to face the insulating circuit boards to abut a part of the crosspiece,
disposing the insulating circuit boards and the resin frame body so that the crosspiece abuts against the first outer edges, and the frame element abuts against the second outer edges;
electrically connecting the insulating circuit boards to each other with the conductive component striding over the crosspiece; and
fixing the upper lid to the resin frame body to cover the opening disposed at the upper part of the resin frame body with the lid element of the upper lid, and to allow the partition disposed on the upper lid to abut against a part of the crosspiece.

Assignees

• Fuji Electric Co Ltd

Inventors

• Maruyama Rikihiro
• Harada Takahito

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5473

  multiple bond wires connected to a common bond pad · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title