Low power, temperature regulated circuit for precision integrated circuits

Patent metadata

Field	Value
Publication number	US-9607913-B1
Application number	US-201615099341-A
Country	US
Kind code	B1
Filing date	Apr 14, 2016
Priority date	Apr 14, 2016
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

Various embodiments provide a temperature regulated circuit. The temperature regulated circuit includes a suspended mass that is positioned in an opening of a frame. The suspended mass is suspended from the frame by a plurality of support beams that may be made of thermally insulating material. The suspended mass provides a thermally isolated substrate for an integrated circuit. The suspended mass also includes a temperature sensor configured to measure a temperature of the integrated circuit, and a heater configured to heat the integrated circuit. A controller is positioned on the frame and is configured to receive temperature measurements from the temperature sensor and control the heater based on the temperature measurements.

First claim

The invention claimed is:

1. A device, comprising:
a frame having an opening;
a controller on the frame;
a plurality of support beams made of thermally insulating material;
a suspended mass positioned in the opening of the frame, the suspended mass being coupled to the frame by the plurality of support beams;
an integrated circuit, a temperature sensor, and a heater on the suspended mass;
a first conductive track on a first support beam of the plurality of support beams, the first conductive track electrically coupled to the integrated circuit, the temperature sensor, or the heater.

2. The device of claim 1 , further comprising a second conductive track on a second support beam of the plurality of support beams, the second conductive track electrically coupled to the controller and to the temperature sensor or the heater.

3. The device of claim 1 , wherein the controller is configured to receive temperature measurements from the temperature sensor and control the heater based on the temperature measurements.

4. The device of claim 1 , further comprising:
a first wafer, the frame positioned on the first wafer; and
a second wafer overlying the frame and the suspended mass, the suspended mass being spaced from the first and second wafers.

5. The device of claim 4 , wherein the frame, the first wafer, and the second wafer form a chamber around the suspended mass.

6. The device of claim 5 , wherein the chamber is evacuated.

7. The device of claim 4 , further comprising a conductive via formed through the second wafer, the conductive via being electrically coupled to the first conductive track.

8. The device of claim 1 , further comprising:
a ceramic base, the frame being positioned on the ceramic base; and
a lid coupled to the ceramic base, the lid and the ceramic base forming a chamber around the suspended mass.

9. The device of claim 1 , further comprising a bond pad on the frame, the first conductive track being electrically coupled to the bond pad.

10. A device, comprising:
a substrate including:
a first portion having an opening; and
a second portion positioned in the opening and spaced from the first portion;

a controller on the first portion of the substrate;
an integrated circuit, a temperature sensor, and a heater on the second portion of the substrate;
an insulating layer on the first and second portions of the substrate, the insulating layer coupling the first and second portions of the substrate to each other;
and
a first conductive track on the insulating layer, the first conductive track being electrically coupled to the integrated circuit, the temperature sensor, or the heater.

11. The device of claim 10 , further comprising a second conductive track on the insulating layer, the second conductive track electrically coupled to the controller and to the temperature sensor or the heater.

12. The device of claim 10 , wherein the controller is configured to receive temperature measurements from the temperature sensor and control the heater based on the temperature measurements.

13. The device of claim 10 , further comprising first and second wafers, the substrate being positioned between the first and second wafers.

14. The device of claim 10 , further comprising a hermetic vacuum package, the substrate being positioned inside of the hermetic vacuum package.

15. The device of claim 10 , further comprising a bond pad on the first portion of the substrate, the bond pad electrically coupled to the first conductive track.

16. A method, comprising:
fabricating a controller on a peripheral component of a semiconductor die;
fabricating an integrated circuit, a temperature sensor, and a heater element on a central component of the semiconductor die, the peripheral component surrounding the central component; and
suspending the central component from the peripheral component by removing portions of the semiconductor die that is between the peripheral component and the central component.

17. The method of claim 16 , further comprising forming a conductive track on the semiconductor die, the conductive track electrically coupling a bond pad on the peripheral component of the semiconductor die to the integrated circuit, the temperature sensor, or the heater element.

18. The method of claim 16 , further comprising:
positioning the semiconductor die on a first wafer; and
positioning a second wafer on the semiconductor die, the first and second wafers being spaced from the central component of the semiconductor die, the peripheral component of the semiconductor die, the first wafer, and the second wafer forming a chamber.

19. The method of claim 18 , further comprising evacuating the chamber.

20. The method of claim 16 , further comprising positioning the semiconductor die in a hermetic vacuum package.

Assignees

• Fluke Corp

Inventors

• Britz William J

Classifications

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W78/00

  Detachable holders for supporting packaged chips in operation · CPC title

• H10W76/40

  Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) · CPC title

• H10W76/15

  Containers comprising an insulating or insulated base · CPC title