Method of manufacturing an electronic component

Patent metadata

Field	Value
Publication number	US-9735340-B2
Application number	US-201314036171-A
Country	US
Kind code	B2
Filing date	Sep 25, 2013
Priority date	Apr 11, 2011
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.

First claim

The invention claimed is:

1. A method for manufacturing an electronic component, the method comprising:
providing an original sealing member;
forming a glass layer on at least a portion of a principal surface of the original sealing member;
cutting the original sealing member into a plurality of first sealing members;
providing a plurality of second sealing members: and separately bonding each of the plurality of second sealing members with a resin adhesive to a respective inner frame region defined inside the glass layer on the principal surface of a respective first sealing member of each of the plurality of first sealing members, respectively.

2. The method according to claim 1 , wherein the step of forming the glass layer comprises forming the glass layer in a lattice shape on the principal surface of the original sealing member.

3. The method according to claim 1 , further comprising:
forming at least one wiring electrode on each of the respective principal surfaces of the plurality of first sealing members;
mounting an electronic component body on each of the plurality of first sealing members; and
bonding each electronic component body to a respective wiring electrode.

4. The method according to claim 1 , further comprising curing the resin adhesive.

5. A method for manufacturing an electronic component the method comprising:
providing an original sealing member:
forming a glass layer on at least a portion of a principal surface of the original sealing member, such that the glass layer has a first surface on the principle surface of the original sealing member and a second surface opposite to the first surface;
cutting the original sealing member into a plurality of first sealing members; and
bonding a plurality of second sealing members, each with a resin adhesive, to each of the respective inner frame regions on the principal surface of the plurality of first sealing members defined inside the glass layer respectively, such that each of the plurality of second sealing members do not cover the second surface of the glass layer on each of the plurality of the first sealing members, respectively.

6. The method according to claim 5 , wherein the step of forming the glass layer comprises forming the glass layer in a lattice shape on the principal surface of the original sealing member.

Assignees

• Murata Manufacturing Co

Inventors

• Oishibashi Hidekazu
• Nagamine Yuichiro
• Sato Takeo

Classifications

• H10W95/00 Primary

  Packaging processes not covered by the other groups of this subclass · CPC title

• H10W76/60

  Seals · CPC title

• H10W76/18

  Insulating materials, e.g. resins, glasses or ceramics · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/071

  Connecting or disconnecting · CPC title