Molded composite enclosure for integrated circuit assembly

Patent metadata

Field	Value
Publication number	US-9607914-B2
Application number	US-201414434239-A
Country	US
Kind code	B2
Filing date	May 15, 2014
Priority date	May 15, 2014
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

Embodiments of the present disclosure are directed toward a molded composite enclosure for an integrated circuit (IC) assembly. In one embodiment, an enclosure for an integrated circuit (IC) assembly may include a molded lid structure having a body portion, and a side portion that extends from the body portion and forms a cavity configured to house the IC assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the opening. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. An enclosure for an integrated circuit (IC) assembly, the enclosure comprising:
a composite lid structure having
a body portion, and
a side portion that extends from the body portion and forms a cavity configured to house the IC assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion such that the IC assembly is thermally coupled with the contiguous exterior material through the opening.

2. The enclosure of claim 1 , wherein the IC assembly includes heat-generating elements of a solid-state drive (SSD).

3. The enclosure of claim 1 , wherein the opening is one of multiple openings formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the multiple openings.

4. The enclosure of claim 1 , wherein the polymer is selected from a group consisting of ABS (Acrylonitrile Butadiene Styrene), ABS +PC (ABS +Polycarbonate), Acetal (POM), Acrylic (PMMA), LCP (Liquid Crystal Polymer), PA-Nylon 6 (Polyamide), PA-Nylon 6/6 (Polyamide), PA-Nylon 11 (Polyamide), PBT (Polybutylene Terepthalate), PC (Polycarbonate), PEI (Polyetherimide), PE (Polyethylene), LDPE (Low Density Polyethylene), HDPE (High Density Polyethylene), PET (Polyethylene Terepthalate), PP (Polypropylene), PPA (Polyphthalamide), PPS (Polyphenylene Sulfide), PS (Polystyrene), HIPS (High Impact Polystyrene), PSU (Polysulfone), PU (Polyurethane), PVC (Polyvinylchloride), PVDF (Polyvinylidene Fluoride), SAN (Styrene Acrylonitrile), TPE (Thermoplastic Elastomer) and TPU (Thermoplastic Polyurethane).

5. The enclosure of claim 1 , wherein the metal is selected from a group consisting of aluminum (Al), iron (Fe), titanium (Ti), copper (Cu), nickel (Ni), magnesium (Mg), stainless steel and Inconel.

6. The enclosure of claim 1 , further comprising:
a primer material disposed between the contiguous interior material and the contiguous exterior material to promote adhesion between the contiguous interior material and the contiguous exterior material.

7. The enclosure of claim 6 , wherein the primer material comprises a polymer or nano-structured metal oxide.

8. The enclosure of claim 1 , further comprising:
a base structure configured to couple with the molded lid structure such that the cavity is disposed between the base structure and the molded lid structure when the base structure is coupled with the molded lid structure.

9. The enclosure of claim 1 , wherein the molded lid structure has a rectangular profile.

10. A solid-state drive (SSD) comprising:
a composite lid structure having
a body portion, and
a side portion that extends from the body portion and forms a cavity configured to house an integrated circuit (IC) assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion;

a base structure coupled with the molded lid structure such that the cavity is disposed between the base structure and the molded lid structure; and
the IC assembly being disposed between the base structure and the molded lid structure, wherein the IC assembly is thermally coupled with the contiguous exterior material of the molded lid structure through the opening.

11. The SSD of claim 10 , wherein:
the opening is one of multiple openings formed in the body portion; and
the IC assembly is thermally coupled with the contiguous exterior material through the multiple openings.

12. The SSD of claim 10 , further comprising:
a primer material disposed between the contiguous interior material and the contiguous exterior material to promote adhesion between the contiguous interior material and the contiguous exterior material.

Assignees

• Intel Corp

Inventors

• Gwin Paul J

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07254

  changes in dispositions · CPC title

• H10W72/242

  relative to the surface, e.g. recessed, protruding · CPC title