Semiconductor device

Patent metadata

Field	Value
Publication number	US-9640454-B2
Application number	US-201514933449-A
Country	US
Kind code	B2
Filing date	Nov 5, 2015
Priority date	Jun 5, 2013
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

A semiconductor device includes an insulating substrate having a circuit plate on a principal surface thereof; a semiconductor element fixed to the circuit plate; an external terminal having one end fixed to the circuit plate; and a printed circuit board facing the principal surface of the insulating substrate, and having a through-hole for passing through the external terminal. A rigidity of a peripheral region of the through-hole is lower than a rigidity of other regions.

First claim

What is claimed is:

1. A semiconductor device comprising:
an insulating substrate having a circuit plate on a principal surface thereof;
a semiconductor element fixed to the circuit plate;
an external terminal having one end fixed to the circuit plate; and
a printed circuit board facing the principal surface of the insulating substrate, and having a through-hole for passing through the external terminal,
wherein a rigidity of a peripheral region of the through-hole is lower than a rigidity of other regions.

2. The semiconductor device according to claim 1 , further comprising a post electrode,
wherein the semiconductor element has an electrode on a front surface thereof, and the post electrode has one end fixed to the electrode of the semiconductor element and another end fixed to the printed circuit board.

3. The semiconductor device according to claim 1 , wherein the peripheral region is formed with a slit.

4. The semiconductor device according to claim 1 , wherein the peripheral region is formed with a plurality of slits.

5. The semiconductor device according to claim 4 , wherein the through-hole has a circular shape in a plan view, and
the plurality of slits is formed radially at a uniform angle when viewed from the principal surface of the printed circuit board.

6. The semiconductor device according to claim 4 , wherein the through-hole has a polygonal shape in a plan view, and
the plurality of slits is formed radially to extend from apexes of respective corners when viewed from the principal surface of the printed circuit board.

7. The semiconductor device according to claim 6 , wherein the polygonal shape is a quadrangular shape in the plan view.

8. The semiconductor device according to claim 1 , wherein the peripheral region of a surface of the printed circuit board facing the insulating substrate is formed with a chamfered portion.

9. A semiconductor device comprising:
an insulating substrate having a circuit plate on a principal surface thereof;
a semiconductor element fixed to the circuit plate;
an external terminal having one end fixed to the circuit plate; and
a printed circuit board facing the principal surface of the insulating substrate, and having a through-hole shaped in a polygonal shape in a plan view for passing the external terminal therethrough,
wherein a plurality of slits is formed radially and symmetrically on a peripheral region of the through-hole to extend from apexes of respective corners of the through-hole when viewed from the principal surface of the printed circuit board, and a rigidity of the peripheral region of the through-hole is lower than a rigidity of other regions in the printed circuit board.

10. The semiconductor device according to claim 9 , wherein the polygonal shape is a quadrangular shape in the plan view, and the plurality of slits includes four slits, each extending from each apex of the quadrangular shape.

Assignees

• Fuji Electric Co Ltd

Inventors

• Nashida Norihiro
• Nakamura Yoko

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W76/18

  Insulating materials, e.g. resins, glasses or ceramics · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W72/00 Primary

  Interconnections or connectors in packages · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title