Micro-element, alignment system and assembling method
US-2024404864-A1 · Dec 5, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L21/67144 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 783 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 17 |
| 2016 | 23 |
| 2017 | 55 |
| 2018 | 71 |
| 2019 | 118 |
| 2020 | 132 |
| 2021 | 80 |
| 2022 | 70 |
| 2023 | 59 |
| 2024 | 72 |
| 2025 | 65 |
| 2026 | 21 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Bonding tool for providing chip on wafer bond and methods for performing the same
US-2024274461-A1 · Aug 15, 2024 · US
Die bonding device, die bonding method and vacuum control method for pick-and-placer thereof
US-2024170320-A1 · May 23, 2024 · US
Method for insulating singulated electronic die
US-9847270-B2 · Dec 19, 2017 · US
Manufacturing apparatus and manufacturing method of light-emitting element
US-2017358469-A1 · Dec 14, 2017 · US
Display device and method of manufacturing the display device
US-2017358503-A1 · Dec 14, 2017 · US
Electronic-component mounting apparatus and electronic-component mounting method
US-2017347504-A1 · Nov 30, 2017 · US
LED array
US-9831383-B2 · Nov 28, 2017 · US
Semiconductor device
US-9806035-B2 · Oct 31, 2017 · US
Apparatuses for bonding semiconductor chips
US-2017287748-A1 · Oct 5, 2017 · US
Laser welded joint and laser welding method
US-2017274473-A1 · Sep 28, 2017 · US
Method of transferring and bonding an array of micro devices
US-9773750-B2 · Sep 26, 2017 · US
Semiconductor device on glass substrate and method of making the same
US-2017256524-A1 · Sep 7, 2017 · US
Thermocompression bonding systems and methods of operating the same
US-2017221854-A1 · Aug 3, 2017 · US
Apparatuses for bonding semiconductor chips
US-9704732-B2 · Jul 11, 2017 · US
Die bonding apparatus
US-9698117-B2 · Jul 4, 2017 · US
Die mounting system and die mounting method
US-2017140960-A1 · May 18, 2017 · US
Pick-and-place tool
US-9648795-B2 · May 9, 2017 · US
Method of fabricating a micro device transfer head
US-9620478-B2 · Apr 11, 2017 · US
Substrate with array of leds for backlighting a display device
US-2017053901-A1 · Feb 23, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L21/67144?
- CPC H01L21/67144 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L21/67144 (Electricity)?
- Our database includes 783 publications tagged with this CPC code.
- Is patent activity under CPC H01L21/67144 growing?
- Publication counts under this code: 72 in 2024 vs 65 in 2025 (latest complete years).