Pick-and-place tool

Patent metadata

Field	Value
Publication number	US-9648795-B2
Application number	US-201414557952-A
Country	US
Kind code	B2
Filing date	Dec 2, 2014
Priority date	Sep 15, 2010
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.

First claim

What is claimed is:

1. A pick-and-place tool comprising:
a mounting head including,
a die position determining unit including a camera, the die position determining unit configured to one of measure and detect an actual position of at least one die during a time between placement of the at least one die on a workpiece and picking up of a subsequent die for placement on the workpiece, the actual position of the at least one die being an actual position of the at least one die on the workpiece relative to at least one local alignment mark on the workpiece, wherein
the mounting head is configured to move together with the die position determining unit between a first position, at which the at least one die is picked up, and a second position at which the at least one die is placed on the workpiece,
the pick-and-place tool is further configured to output position information for adjusting original pattern data associated with a pattern to be generated on the workpiece, the position information including (i) imaging data of the actual position of the at least one die, and (ii) local alignment data for the at least one die, the local alignment data including the measured or detected actual position of the at least one die on the workpiece relative to the at least one local alignment mark on the workpiece,
the pick-and-place tool is further configured to output the position information to an external patterning tool, either directly or indirectly via a memory,
the imaging data is obtained by the camera after the placement of the at least one die and while the mounting head is still in the second position at which the at least one die is placed on the workpiece, and
the die position determining unit is further configured to one of measure and detect the actual position of the at least one die while the mounting head is still in the second position at which the at least one die is placed on the workpiece, and without moving from the second position at which the at least one die is placed on the workpiece.

2. The pick-and-place tool of claim 1 , wherein the die position determining unit is further configured to measure the actual position of the at least one die on the workpiece relative to at least one measurement mark.

3. The pick-and-place tool of claim 2 , wherein the at least one measurement mark includes the at least one local alignment mark or another unique feature associated with, or connected to, a position on the workpiece.

4. The pick-and-place tool of claim 3 , wherein
the position information includes a measurement of the position of the at least one die relative to the at least one local alignment mark or some other reference point to which the at least one local alignment mark has a clearly defined distance.

5. The pick-and-place tool of claim 4 , wherein
the pick-and-place tool is further configured to place the at least one die on a first layer of the workpiece; and
the pick-and-place tool further includes a pattern generator configured to use the position information to adjust original pattern data to be written on a second layer of the workpiece, which is different from the first layer.

6. The pick-and-place tool of claim 5 , wherein both the first layer and the second layer are layers associated with the same group of placed dies or components.

7. The pick-and-place tool of claim 5 , wherein the first layer is a layer associated with a first group of placed dies or components and the second layer is a layer associated with a second group of placed dies or components different from the first group of dies or components.

8. The pick-and-place tool of claim 1 , wherein the camera is configured to obtain an image of the workpiece.

9. The pick-and-place tool of claim 8 , wherein the camera is a charge coupled device camera.

10. The pick-and-place tool of claim 8 , wherein the camera is configured to obtain an image covering only a subarea of the workpiece surface area in order to measure the actual position of at least one die placed on the workpiece relative to at least one measurement mark.

11. The pick-and-place tool of claim 10 , wherein the image obtained by the camera includes actual position information for only a subset of the plurality of dies placed on the workpiece.

12. The pick-and-place tool of claim 1 , wherein the die position determining unit includes a sensor configured to detect a position of the at least one die on the workpiece.

13. The pick-and-place tool of claim 12 , wherein the sensor is a laser sensor configured to use at least one of reflected light and triangulation to detect the position of the at least one die on the workpiece.

Assignees

• Mycronic AB

Inventors

• Gustafsson Per-Erik
• Wahlsten Mikael

Classifications

• H10P72/0446 Primary

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10P72/0442 Primary

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/53

  using optical controlling means · CPC title

• H01L21/67132

  Electricity · mapped topic