Apparatuses for bonding semiconductor chips

Patent metadata

Field	Value
Publication number	US-9704732-B2
Application number	US-201213599548-A
Country	US
Kind code	B2
Filing date	Aug 30, 2012
Priority date	Dec 23, 2011
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.

First claim

What is claimed is:

1. An apparatus for bonding semiconductor chips, the apparatus comprising:
transfer rails configured to transfer substrates from a first end of the transfer rails to a second end of the transfer rails, and from the second end of the transfer rails to the first end of the transfer rails;
loading members configured to load the substrates onto the first end of the transfer rails;
unloading members configured to unload the substrates from the first end of the transfer rails;
a first wafer supply unit configured to supply a first wafer including first semiconductor chips; and
a bonding unit configured to bond the first semiconductor chips to the substrates, on the transfer rails, away from the first end of the transfer rails,
wherein,
the transfer rails include first and second transfer rails,
the loading members include first and second loading members,
the unloading members include first and second unloading members,
the first loading member and the first unloading member make a first pair,
the second loading member and the second unloading member make a second pair,
the first pair is adjacent to a first end of the first transfer rail, and
the second pair is adjacent to a first end of the second transfer rail.

2. The apparatus of claim 1 , wherein a second end of the first transfer rail is adjacent to a second end of the second transfer rail.

3. The apparatus of claim 1 , wherein the loading members are further configured to load different kinds of the substrates onto the first end of the first and second transfer rails,
wherein the first semiconductor chips are classified according to characteristics of the first semiconductor chips, and
wherein the bonding unit is further configured to bond the classified first semiconductor chips to the different kinds of the substrates.

4. The apparatus of claim 1 , wherein the loading members are further configured to load a same kind of the substrates onto the first end of the first and second transfer rails, and
wherein when the bonding unit bonds the first semiconductor chips to the substrates loaded on a first one of the first and second transfer rails, one of the substrates loaded on a second one of the first and second transfer rails is standing by ready.

5. The apparatus of claim 1 , further comprising:
a second wafer supply unit configured to supplying a second wafer including second semiconductor chips;
wherein the loading members are further configured to load a same kind of the substrates onto the first end of the first and second transfer rails, and
wherein the bonding unit is further configured to stack the first semiconductor chips and the second semiconductor chips on the substrates.

6. The apparatus of claim 1 , further comprising:
a second wafer supply unit configured to supplying a second wafer including second semiconductor chips;
wherein the loading members are further configured to load different kinds of the substrates onto the first end of the first and second transfer rails,
wherein the first semiconductor chips are classified according to characteristics of the first semiconductor chips, and
wherein the bonding unit is further configured to bond the classified first semiconductor chips to the different kinds of the substrates, and then the bonding unit is further configured to bond the second semiconductor chips to the first semiconductor chips.

7. The apparatus of claim 1 , wherein the first and second transfer rails are continuous from the first end of the first and second transfer rails to the second end of the first and second transfer rails.

8. The apparatus of claim 1 , wherein the first and second transfer rails comprise a pair of parallel transfer rails.

9. The apparatus of claim 1 , further comprising:
a buffer member at one side of at least one of the first and second transfer rails, the buffer member configured to hold the substrates,
wherein the bonding unit further comprises first and second bonding units configured to bond the first semiconductor chips and second semiconductor chips to the substrates on the transfer rails, respectively.

10. The apparatus of claim 9 , wherein the loading members are configured to load different kinds of the substrates onto the first and second transfer rails via the buffer member,
wherein the first semiconductor chips are classified according to characteristics of the first semiconductor chips, and
wherein when the first bonding unit bonds one of the classified first semiconductor chips to a first kind of the substrates, the buffer member is further configured to temporarily receive a second kind of the substrates.

11. The apparatus of claim 9 , further comprising:
wherein the loading members are further configured to load a same kind of the substrates onto the first and second transfer rails via the buffer member, and
wherein the first and second bonding units are further configured to stack the first semiconductor chips and the second semiconductor chips on the substrates.

12. The apparatus of claim 9 , further comprising:
a transferring tool configured to transfer the substrates from the first and second transfer rails to the buffer member after the loading of the substrates onto the first and second transfer rails, and configured to transfer the substrates from the buffer member to the first and second transfer rails after the transferring of the substrates to the buffer member.

13. An apparatus for bonding semiconductor chips, the apparatus comprising:
first and second transfer rails configured to transfer substrates;
a first loading member configured to load the substrates onto the first transfer rail;
a second loading member configured to load the substrates onto the second transfer rail;
a first unloading member configured to unload the substrates from the first transfer rail;
a second unloading member configured to unload the substrates from the second transfer rail;
a first wafer supply unit configured to supply a first wafer including first semiconductor chips; and
a bonding unit configured to bond the first semiconductor chips to the substrates on the first and second transfer rails;
wherein the first transfer rail and the second transfer rail are in line with each other,
wherein the first loading member and the first unloading member are near a same end of the first transfer rail, and
wherein the second loading member and the second unloading member are near a same end of the second transfer rail.

14. The apparatus of claim 13 , further comprising:
a second wafer supply unit configured to supply a second wafer including second semiconductor chips;
wherein the bonding unit is further configured to bond the second semiconductor chips to the first semiconductor chips.

15. The apparatus of claim 13 , further comprising:
a second wafer supply unit configured to supply a second wafer including second semiconductor chips;
wherein the bonding unit is further configured to stack the first semiconductor chips and the second semiconductor chips on the substrates.

16. The apparatus of claim 13 , wherein,
the bonding unit is configured to bond the first semiconductor chips to the substrates on the first transfer rail near a first end of the first transfer rail, and configured to bond the first semiconductor chips to the substrates on the second transfer rail near a first end of the second transfer rail,
the first end of the first transfer rail is near the first end of the second transfer rail,
the first loading member and the first unloading member are near a second end of the first transfer rail,

Assignees

• Hwang Yisung
• Lee Jungchul
• Kim Jaehong
• Chung Taegyeong
• Samsung Electronics Co Ltd

Inventors

• Hwang Yisung
• Lee Jungchul
• Kim Jaehong
• Chung Taegyeong

Classifications

• H10P72/0446 Primary

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• Y10T156/1776

  Means separating articles from bulk source · CPC title

• Y10T156/1761

  Stacked serially · CPC title

• Y10T156/1746

  Plural lines and/or separate means assembling separate sandwiches · CPC title

• Y10T156/1744

  Means bringing discrete articles into assembled relationship · CPC title