Die bonding apparatus

Patent metadata

Field	Value
Publication number	US-9698117-B2
Application number	US-201514600324-A
Country	US
Kind code	B2
Filing date	Jan 20, 2015
Priority date	Feb 10, 2014
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

The die bonding apparatus including a transferring unit, a loading member loading a substrate to the transferring unit, an unloading member unloading the substrate from the transferring unit, a wafer holder supporting a wafer providing dies, and a bonding member picking up one of the dies from the wafer and bonding the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the substrate using a gas may be provided.

First claim

What is claimed is:

1. A die bonding apparatus comprising:
a transferring unit;
a loading member configured to load a substrate to the transferring unit;
an unloading member configured to unload the substrate from the transferring unit;
a wafer holder configured to support a wafer providing dies; and
a bonding member configured to pick up one of the dies from the wafer and configured to bond the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the loaded substrate using a gas, wherein the bonding member includes,
a body,
a bonding head coupled to and disposed under the body, the bonding head having an adsorption hole configured to pick the die using a suction pressure and outer pressurizing grooves outside the adsorption hole, the outer pressurizing grooves providing a space, in which the gas pressurizing the picked-up die is received, and
a pressurizing tube connected to a gas supply member and configured to supply the gas to the outer pressurizing grooves.

2. The die bonding apparatus of claim 1 , wherein the pressurizing tube comprises:
a main pressurizing tube connected to the gas supply member; and
branch tubes branching from the main pressurizing tube, the branch tubes being connected to the outer pressurizing grooves, respectively.

3. The die bonding apparatus of claim 1 , wherein a distribution space defined between the main pressurizing tube and branch tubes and configured to distribute the gas supplied from the main pressurizing tube to the branch tubes is defined in at least one of the body and the bonding head.

4. The die bonding apparatus of claim 3 , wherein the distribution space comprises:
a main distribution space connected to the main pressurizing tube, the main distribution space having a ring shape; and
branch spaces defined in the bonding head and connected to the main distribution space, the branch spaces extending toward an outside of the bonding head in a lower portion of the main distribution space.

5. The die bonding apparatus of claim 4 , wherein the branch spaces comprises:
first branch spaces at both sides of the main distribution space, each of the first branch spaces having a rod shape; and
second branch spaces at both sides of the main distribution space, each of the second branch spaces inclined with respect to a length direction of the first branch space.

6. The die bonding apparatus of claim 1 , wherein the outer pressurizing grooves have a linear shape and are spaced a distance from each other in parallel.

7. The die bonding apparatus of claim 6 , wherein side surfaces of the pressurizing grooves have symmetrical shapes with respect to a center axis of the bonding head.

8. The die bonding apparatus of claim 1 , further comprising:
an inner pressurizing groove between the adsorption hole and the outer pressurizing grooves at a bottom surface of the bonding head, the inner pressurizing groove having a uniform width in each direction with respect to a center of the adsorption hole, the inner pressurizing groove providing a space in which the gas is received.

9. The die bonding apparatus of claim 1 , further comprising:
an adsorption part protruding from a center of a bottom surface of the bonding head.

10. The die bonding apparatus of claim 9 , wherein
the adsorption part surrounds the adsorption hole, and
the die bonding apparatus further includes,
an adsorption tube connected to the adsorption hole and defined at least one of inside the bonding head and inside the body, and
an intake member connected to the adsorption tube and configured to exhaust gas in the adsorption tube.

11. The die bonding apparatus of claim 10 , further comprising:
a purge gas supply member connected to the adsorption tube and configured to supply a purge gas to the adsorption tube.

12. The die bonding apparatus of claim 1 , wherein the transferring unit comprises:
rails between the loading member and the unloading member; and
a shuttle configured to travel along the rails and support the substrate,
wherein the die bonding apparatus further includes an auxiliary bonding member on a path through which the shuttle travels, the auxiliary bonding member configured to pressurize the die bonded to the substrate located on the shuttle.

13. The die bonding apparatus of claim 12 , wherein the auxiliary bonding member configured to further pressurize the bonded die against the loaded substrate using a gas.

14. The die bonding apparatus of claim 13 , wherein a bottom surface of the auxiliary bonding member has an area which corresponds to one of an area of the substrate and an area of the shuttle or has an area less than that of one of the substrate and the shuttle.

15. A die bonding apparatus comprising:
a die bonding member including,
a body; and
a bonding head connected to and disposed under the body and configured to pressurize a die against a substrate such that the die is bonded to the substrate, the bonding head including,
a first pressurizing portion configured to pressurize a first portion of the die against the substrate mechanically, the first pressurizing portion housing an adsorption hole and configured to pick the die using a suction pressure,
a second pressurizing portion configured to pressurize a second portion of the die against the substrate based on a gas-based pressure, the second pressurizing portion including outer pressurizing grooves outside the adsorption hole, the outer pressurizing grooves providing a space, in which a gas for pressurizing the picked-up die is received, and
a pressurizing tube connected to a gas supply member and configured to supply the gas to the outer pressurizing grooves.

16. The die bonding apparatus of claim 15 , wherein the first pressurizing portion is a protrusion at a bottom surface of the bonding head.

17. The die bonding apparatus of claim 16 , wherein the outer pressurizing grooves surround the protrusion.

18. The die bonding apparatus of claim 15 , wherein when pressurizing the die, a lowermost point of the first pressurizing portion is configured to be in a closer proximity to the die than a lowermost point of the second pressurizing portion.

19. The die bonding apparatus of claim 15 , wherein the first pressurizing portion downwardly protrudes further than the second pressurizing portion.

20. A die bonding apparatus comprising:
a transferring unit;
a loading member configured to load a substrate to the transferring unit;
an unloading member configured to unload the substrate from the transferring unit;
a wafer holder configured to support a wafer providing dies; and
a bonding member configured to pick up one of the dies from the wafer and configured to bond the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the loaded substrate using a gas,
wherein the bonding member includes,
a body, and
a bonding head coupled to and disposed under the body, the bonding head having an adsorption hole configured to pick the die using a suction pressure and branch tubes spaced apart from the adsorption hole, the branch tubes configured to supply the gas to the picked-up die.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Ha Yongdae
• Lee Jaeryoung
• Kim Chulmin
• Hwang Yisung
• Um Teaseog
• Jung Yongjin

Classifications

• H10W72/0711 Primary

  Apparatus therefor · CPC title

• H10P72/7432

  used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10W72/07173

  Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title

• H10W72/07163

  Means for mechanical processing, e.g. for planarising, pressing, stamping or drilling · CPC title