Electrochemical plating
US-9518332-B2 · Dec 13, 2016 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L21/2885 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 802 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 42 |
| 2016 | 102 |
| 2017 | 123 |
| 2018 | 102 |
| 2019 | 110 |
| 2020 | 100 |
| 2021 | 73 |
| 2022 | 42 |
| 2023 | 46 |
| 2024 | 38 |
| 2025 | 19 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Package for a surface-mount semiconductor device and manufacturing method thereof
US-2016351477-A1 · Dec 1, 2016 · US
Method for copper plating
US-9506158-B2 · Nov 29, 2016 · US
Process for connecting joining parts
US-9502376-B2 · Nov 22, 2016 · US
Semiconductor device and fabrication method thereof
US-9502348-B2 · Nov 22, 2016 · US
Electrical chemical plating process
US-2016319450-A1 · Nov 3, 2016 · US
Fabrication of multilayer circuit elements
US-9466659-B2 · Oct 11, 2016 · US
Semiconductor device and manufacturing method thereof
US-2016276178-A1 · Sep 22, 2016 · US
Laser drilling encapsulated semiconductor die to expose electrical connection therein
US-2016260652-A1 · Sep 8, 2016 · US
Method of manufacturing semiconductor device and semiconductor device
US-2016254214-A1 · Sep 1, 2016 · US
Integrated circuit and method of forming an integrated circuit
US-9418937-B2 · Aug 16, 2016 · US
Substrate holder, a method for holding a substrate with a substrate holder, and a plating apparatus
US-2016194780-A1 · Jul 7, 2016 · US
Anti-diffusion layer, preparation method thereof, thin-film transistor (TFT), array substrate, display device
US-9368360-B2 · Jun 14, 2016 · US
Package structure and method of fabricating the same
US-2016104652-A1 · Apr 14, 2016 · US
Packaged device with additive substrate surface modification
US-2016093558-A1 · Mar 31, 2016 · US
Method for void-free cobalt gap fill
US-2016056077-A1 · Feb 25, 2016 · US
Electroplating apparatus for tailored uniformity profile
US-9260793-B2 · Feb 16, 2016 · US
Fabrication of multilayer circuit elements
US-2016013262-A1 · Jan 14, 2016 · US
Semiconductor packages and methods of packaging semiconductor devices
US-2015380346-A1 · Dec 31, 2015 · US
Method for manufacturing printed wiring board
US-9222186-B2 · Dec 29, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L21/2885?
- CPC H01L21/2885 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L21/2885 (Electricity)?
- Our database includes 802 publications tagged with this CPC code.
- Is patent activity under CPC H01L21/2885 growing?
- Publication counts under this code: 38 in 2024 vs 19 in 2025 (latest complete years).