Printed circuit board (pcb) with wrapped conductor
US-2015382460-A1 · Dec 31, 2015 · US
Electrical chemical plating process
US2016319450A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016319450-A1 |
| Application number | US-201615206321-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 11, 2016 |
| Priority date | Jun 6, 2011 |
| Publication date | Nov 3, 2016 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An electrical chemical plating process is provided. A semiconductor structure is provided in an electrical plating platform. A pre-electrical-plating step is performed wherein the pre-electrical-plating step is carried out under a fixed voltage environment and lasts for 0.2 to 0.5 seconds after the current is above the threshold current of the electrical plating platform. After the pre-electrical-plating step, a first electrical plating step is performed on the semiconductor structure.
First claim
Opening claim text (preview).
What is claimed is: 1 . An electrical chemical plating process, comprising: providing a semiconductor structure in an electro-plating machine; providing a pre-electro-plating step, wherein the pre-electro-plating step lasts for 0.2 to 0.5 seconds and a current in the pre-electro-plating step is gradually increased to a maximum value and is substantially maintained at the maximum value; and after the pre-electro-plating step, performing a first-electro-plating step. 2 . The electrical chemical plating process according to claim 1 , wherein the pre-electro-plating step lasts for 0.3 seconds after the current exceeds a threshold current of the electro-plating machine. 3 . The electrical chemical plating process according to claim 1 , wherein the pre-electro-plating step is performed under a fixed voltage and the fixed voltage is 0.8V. 4 . The electrical chemical plating process according to claim 1 , wherein the maximum value of the current during the pre-electro-plating step is 10A. 5 . The electrical chemical plating process according to claim 1 , wherein the first-electro-plating step is performed under a first fixed current condition. 6 . The electrical chemical plating process according to claim 5 , wherein the first fixed current is between 4.0A to 5.0A. 7 . The electrical chemical plating process according to claim 6 , wherein the first fixed current is 4.5A. 8 . The electrical chemical plating process according to claim 1 , further comprising a second electro-plating step after the first electro-plating step, wherein the second-electro-plating step is performed under a second fixed current condition. 9 . The electrical chemical plating process according to claim 8 , wherein the second fixed current is greater than the first fixed current. 10 . The electrical chemical plating process according to claim 8 , wherein the second fixed current is between 6.0A to 7.0A.
Assignees
Inventors
Classifications
Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title
by selectively depositing, e.g. by using selective CVD or plating · CPC title
Electricity · mapped topic
Electricity · mapped topic
of copper · CPC title
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Frequently asked questions
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- What does patent US2016319450A1 cover?
- An electrical chemical plating process is provided. A semiconductor structure is provided in an electrical plating platform. A pre-electrical-plating step is performed wherein the pre-electrical-plating step is carried out under a fixed voltage environment and lasts for 0.2 to 0.5 seconds after the current is above the threshold current of the electrical plating platform. After the pre-electric…
- Who is the assignee on this patent?
- United Microelectronics Corp
- What technology area does this patent fall under?
- Primary CPC classification C25D7/123. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Nov 03 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).