Process for connecting joining parts

Patent metadata

Field	Value
Publication number	US-9502376-B2
Application number	US-201414773970-A
Country	US
Kind code	B2
Filing date	Mar 24, 2014
Priority date	Mar 26, 2013
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A method is provided for connecting parts to be joined. A first layer sequence is applied to a first part to be joined. The first layer sequence contains silver. A second layer sequence is applied to a second part to be joined. The second layer sequence contains indium and bismuth. The first layer sequence and the second layer sequence are pressed together at their end faces respectively remote from the first part to be joined and the second part to be joined through application of a joining pressure at a joining temperature which amounts to at most 120° C. for a predetermined joining time. The first layer sequence and the second layer sequence fuse together to form a bonding layer which directly adjoins the first part to be joined and the second part to be joined and the melting temperature of which amounts to at least 260° C.

First claim

The invention claimed is:

1. A method for connecting parts to be joined, the method comprising:
providing a first part to be joined and a second part to be joined;
applying a first layer sequence to the first part to be joined, wherein the first layer sequence comprises at least one layer that contains silver;
applying a second layer sequence to the second part to be joined, wherein the second layer sequence comprises at least one layer that contains indium and bismuth or the…

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Plöβl Andreas

Classifications

• H10P14/47

  Electricity · mapped topic

• H10W90/736

  Electricity · mapped topic

• H10W90/734

  Electricity · mapped topic

• H10W72/07355

  Electricity · mapped topic

• H10W72/07341

  Electricity · mapped topic